JPS58424U - ワイヤボンデイング用キヤピラリの先端部形状 - Google Patents

ワイヤボンデイング用キヤピラリの先端部形状

Info

Publication number
JPS58424U
JPS58424U JP1981093942U JP9394281U JPS58424U JP S58424 U JPS58424 U JP S58424U JP 1981093942 U JP1981093942 U JP 1981093942U JP 9394281 U JP9394281 U JP 9394281U JP S58424 U JPS58424 U JP S58424U
Authority
JP
Japan
Prior art keywords
capillary
wire bonding
tip
tip shape
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981093942U
Other languages
English (en)
Inventor
湯本　泉
了 今井
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP1981093942U priority Critical patent/JPS58424U/ja
Publication of JPS58424U publication Critical patent/JPS58424U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48455—Details of wedge bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4846—Connecting portions with multiple bonds on the same bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のワイヤボンディング用キャピラリ先端部
を示す図、第２図は第１図のキャピラリ先端部によりボ
ンディングされたワイヤ潰れ状態を示す平面図、第３図
は本考案に係るキャピラリ先端部を示す図、第４図は第
３図のキャピラリ先端部によりワイヤ潰れ状態を示す平
面図である。 〔符号の説明〕、１，４・・・・・・キャピラリ先端部
、２・・・・・・ワイヤ、３・・・・・・ボンディング
パット。

Claims (1)

    【実用新案登録請求の範囲】
  1. 被ボンデイングバット面上にワイヤを介してキャピラリ
    先端部を突き当ててなるワイヤボンディングにおいて、
    前記キャピラリ先端部を先端面のまわりに該先端面より
    高さの低い外輪をもつ形状とし、ワイヤボンディング時
    に先端面および外輪面がワイヤに当接するようにしたこ
    とを特徴とするワイヤボンディング用キャピラリの先端
    部形状。
JP1981093942U 1981-06-25 1981-06-25 ワイヤボンデイング用キヤピラリの先端部形状 Pending JPS58424U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981093942U JPS58424U (ja) 1981-06-25 1981-06-25 ワイヤボンデイング用キヤピラリの先端部形状

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981093942U JPS58424U (ja) 1981-06-25 1981-06-25 ワイヤボンデイング用キヤピラリの先端部形状

Publications (1)

Publication Number Publication Date
JPS58424U true JPS58424U (ja) 1983-01-05

Family

ID=29888898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981093942U Pending JPS58424U (ja) 1981-06-25 1981-06-25 ワイヤボンデイング用キヤピラリの先端部形状

Country Status (1)

Country Link
JP (1) JPS58424U (ja)

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