JPH02118931U - - Google Patents
Info
- Publication number
- JPH02118931U JPH02118931U JP1989027335U JP2733589U JPH02118931U JP H02118931 U JPH02118931 U JP H02118931U JP 1989027335 U JP1989027335 U JP 1989027335U JP 2733589 U JP2733589 U JP 2733589U JP H02118931 U JPH02118931 U JP H02118931U
- Authority
- JP
- Japan
- Prior art keywords
- electrode structure
- semiconductor device
- electrode
- film
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/012—
-
- H10W72/234—
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- H10W72/701—
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- H10W72/934—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989027335U JPH02118931U (enExample) | 1989-03-13 | 1989-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989027335U JPH02118931U (enExample) | 1989-03-13 | 1989-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02118931U true JPH02118931U (enExample) | 1990-09-25 |
Family
ID=31249737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989027335U Pending JPH02118931U (enExample) | 1989-03-13 | 1989-03-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02118931U (enExample) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4932150A (enExample) * | 1972-07-27 | 1974-03-23 | ||
| JPS54159173A (en) * | 1978-06-07 | 1979-12-15 | Hitachi Ltd | Construction of bump electrode |
| JPS54160166A (en) * | 1978-06-09 | 1979-12-18 | Hitachi Ltd | Electrode forming method for semiconductor device |
| JPS637640A (ja) * | 1986-06-27 | 1988-01-13 | Toshiba Corp | 半導体装置の製造方法 |
-
1989
- 1989-03-13 JP JP1989027335U patent/JPH02118931U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4932150A (enExample) * | 1972-07-27 | 1974-03-23 | ||
| JPS54159173A (en) * | 1978-06-07 | 1979-12-15 | Hitachi Ltd | Construction of bump electrode |
| JPS54160166A (en) * | 1978-06-09 | 1979-12-18 | Hitachi Ltd | Electrode forming method for semiconductor device |
| JPS637640A (ja) * | 1986-06-27 | 1988-01-13 | Toshiba Corp | 半導体装置の製造方法 |