JPH0385640U - - Google Patents
Info
- Publication number
- JPH0385640U JPH0385640U JP1989148086U JP14808689U JPH0385640U JP H0385640 U JPH0385640 U JP H0385640U JP 1989148086 U JP1989148086 U JP 1989148086U JP 14808689 U JP14808689 U JP 14808689U JP H0385640 U JPH0385640 U JP H0385640U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- die
- metallized
- semiconductor device
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989148086U JPH0385640U (enExample) | 1989-12-21 | 1989-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989148086U JPH0385640U (enExample) | 1989-12-21 | 1989-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0385640U true JPH0385640U (enExample) | 1991-08-29 |
Family
ID=31694551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989148086U Pending JPH0385640U (enExample) | 1989-12-21 | 1989-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0385640U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006524904A (ja) * | 2003-02-10 | 2006-11-02 | スカイワークス ソリューションズ，インコーポレイテッド | インダクタンスが減少し、ダイ接着剤の流出が減少した半導体ダイパッケージ |
-
1989
- 1989-12-21 JP JP1989148086U patent/JPH0385640U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006524904A (ja) * | 2003-02-10 | 2006-11-02 | スカイワークス ソリューションズ，インコーポレイテッド | インダクタンスが減少し、ダイ接着剤の流出が減少した半導体ダイパッケージ |