JPH0353854U - - Google Patents
Info
- Publication number
- JPH0353854U JPH0353854U JP1989115371U JP11537189U JPH0353854U JP H0353854 U JPH0353854 U JP H0353854U JP 1989115371 U JP1989115371 U JP 1989115371U JP 11537189 U JP11537189 U JP 11537189U JP H0353854 U JPH0353854 U JP H0353854U
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- semiconductor element
- lead frame
- chip component
- discrete chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/00—
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- H10W72/07553—
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- H10W72/531—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989115371U JPH0353854U (enExample) | 1989-09-29 | 1989-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989115371U JPH0353854U (enExample) | 1989-09-29 | 1989-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0353854U true JPH0353854U (enExample) | 1991-05-24 |
Family
ID=31663702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989115371U Pending JPH0353854U (enExample) | 1989-09-29 | 1989-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353854U (enExample) |
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1989
- 1989-09-29 JP JP1989115371U patent/JPH0353854U/ja active Pending