JPH0353854U - - Google Patents

Info

Publication number
JPH0353854U
JPH0353854U JP1989115371U JP11537189U JPH0353854U JP H0353854 U JPH0353854 U JP H0353854U JP 1989115371 U JP1989115371 U JP 1989115371U JP 11537189 U JP11537189 U JP 11537189U JP H0353854 U JPH0353854 U JP H0353854U
Authority
JP
Japan
Prior art keywords
insulating layer
semiconductor element
lead frame
chip component
discrete chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989115371U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989115371U priority Critical patent/JPH0353854U/ja
Publication of JPH0353854U publication Critical patent/JPH0353854U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07541Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors

Landscapes

  • Wire Bonding (AREA)
JP1989115371U 1989-09-29 1989-09-29 Pending JPH0353854U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989115371U JPH0353854U (enExample) 1989-09-29 1989-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989115371U JPH0353854U (enExample) 1989-09-29 1989-09-29

Publications (1)

Publication Number Publication Date
JPH0353854U true JPH0353854U (enExample) 1991-05-24

Family

ID=31663702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989115371U Pending JPH0353854U (enExample) 1989-09-29 1989-09-29

Country Status (1)

Country Link
JP (1) JPH0353854U (enExample)

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