JPH02108338U - - Google Patents

Info

Publication number
JPH02108338U
JPH02108338U JP1989016584U JP1658489U JPH02108338U JP H02108338 U JPH02108338 U JP H02108338U JP 1989016584 U JP1989016584 U JP 1989016584U JP 1658489 U JP1658489 U JP 1658489U JP H02108338 U JPH02108338 U JP H02108338U
Authority
JP
Japan
Prior art keywords
chip component
wiring pattern
wiring board
substrate
information card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989016584U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989016584U priority Critical patent/JPH02108338U/ja
Publication of JPH02108338U publication Critical patent/JPH02108338U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Description

【図面の簡単な説明】
第１図は本考案の一実施例による配線基板を用
いた情報カードを示す略線的斜視図、第２図は接
合部分の説明に供する側面図、第３図、第４図、
第５図は他の実施例を示す側面図、第６図及び第
７図は、従来の配線基板を示す側面図、第８図は
情報カード読取システムの構成を示す略線図、第
９図はその情報カードの電気的構成を示す略線的
ブロツク図である。 ２０……情報カード、２１……配線基板、２１
Ａ……基板、２１Ｂ，２１Ｃ……ダイポールアン
テナ素子、２２，２５Ａ，２５Ｂ……接合膜、２
３……チツプ部品、２３Ａ，２３Ｂ……電極、２
４……電源電池。

Claims (1)

  1. 【実用新案登録請求の範囲】 チツプ部品の電極と基板上に形成された配線パ
    ターンとの間に異方性導電膜でなる接合膜を介挿
    して、 上記チツプ部品を上記配線パターンに接合する
    ことを特徴とする配線基板。
JP1989016584U 1989-02-15 1989-02-15 Pending JPH02108338U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989016584U JPH02108338U (ja) 1989-02-15 1989-02-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989016584U JPH02108338U (ja) 1989-02-15 1989-02-15

Publications (1)

Publication Number Publication Date
JPH02108338U true JPH02108338U (ja) 1990-08-29

Family

ID=31229647

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989016584U Pending JPH02108338U (ja) 1989-02-15 1989-02-15

Country Status (1)

Country Link
JP (1) JPH02108338U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022529522A (ja) * 2019-04-22 2022-06-22 エイヴェリー デニソン リテール インフォメーション サービシズ リミテッド ライアビリティ カンパニー Ｒｆｉｄ装置用自己接着性ストラップ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022529522A (ja) * 2019-04-22 2022-06-22 エイヴェリー デニソン リテール インフォメーション サービシズ リミテッド ライアビリティ カンパニー Ｒｆｉｄ装置用自己接着性ストラップ

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