JPH02127060U - - Google Patents

Info

Publication number
JPH02127060U
JPH02127060U JP3718989U JP3718989U JPH02127060U JP H02127060 U JPH02127060 U JP H02127060U JP 3718989 U JP3718989 U JP 3718989U JP 3718989 U JP3718989 U JP 3718989U JP H02127060 U JPH02127060 U JP H02127060U
Authority
JP
Japan
Prior art keywords
board
wiring pattern
chip
land
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3718989U
Other languages
English (en)
Other versions
JPH0747900Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989037189U priority Critical patent/JPH0747900Y2/ja
Publication of JPH02127060U publication Critical patent/JPH02127060U/ja
Application granted granted Critical
Publication of JPH0747900Y2 publication Critical patent/JPH0747900Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第1図は本考案による配線基板の一実施例を示
す略線的斜視図、第2図は圧力分散ランドを形成
する際の説明に供する部分的断面図、第3図はチ
ツプ部品の接合部分を示す部分的断面図、第4図
は従来の情報カード読取システムの構成を示す略
線図、第5図はその情報カードの電気的ブロツク
図、第6図は従来の配線基板を示す部分的断面図
である。 4,30…情報カード、4A…基板、4B…ダ
イポールアンテナ、4E…配線パターン、20…
配線基板、21…台座、24…圧力分散ランド、
25…突起電極部、26…異方性導電膜。

Claims (1)

  1. 【実用新案登録請求の範囲】 チツプ部品の表面に形成された電極を、基板上
    の実装領域に設けられた配線パターンの一部に圧
    着接合するようになされた配線基板において、 上記基板及び上記チップ部品の表面間に、所定
    の面積に形成された圧力分散用のランドを具え、 上記チツプ部品を上記配線パターンに上に圧着
    する際に、当該押圧力を上記配線パターン及び上
    記圧力分散ランドで受けるようにしたことを特徴
    とする配線基板。
JP1989037189U 1989-03-30 1989-03-30 配線基板 Expired - Lifetime JPH0747900Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989037189U JPH0747900Y2 (ja) 1989-03-30 1989-03-30 配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989037189U JPH0747900Y2 (ja) 1989-03-30 1989-03-30 配線基板

Publications (2)

Publication Number Publication Date
JPH02127060U true JPH02127060U (ja) 1990-10-19
JPH0747900Y2 JPH0747900Y2 (ja) 1995-11-01

Family

ID=31544077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989037189U Expired - Lifetime JPH0747900Y2 (ja) 1989-03-30 1989-03-30 配線基板

Country Status (1)

Country Link
JP (1) JPH0747900Y2 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62116578U (ja) * 1986-01-17 1987-07-24
JPS63275128A (ja) * 1987-05-07 1988-11-11 Fuji Electric Co Ltd 半導体装置
JPS63185229U (ja) * 1987-05-21 1988-11-29
JPS6481237A (en) * 1987-09-22 1989-03-27 Seiko Epson Corp Semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62116578U (ja) * 1986-01-17 1987-07-24
JPS63275128A (ja) * 1987-05-07 1988-11-11 Fuji Electric Co Ltd 半導体装置
JPS63185229U (ja) * 1987-05-21 1988-11-29
JPS6481237A (en) * 1987-09-22 1989-03-27 Seiko Epson Corp Semiconductor device

Also Published As

Publication number Publication date
JPH0747900Y2 (ja) 1995-11-01

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term