JPH0197231U - - Google Patents
Info
- Publication number
- JPH0197231U JPH0197231U JP19256687U JP19256687U JPH0197231U JP H0197231 U JPH0197231 U JP H0197231U JP 19256687 U JP19256687 U JP 19256687U JP 19256687 U JP19256687 U JP 19256687U JP H0197231 U JPH0197231 U JP H0197231U
- Authority
- JP
- Japan
- Prior art keywords
- base
- introduction port
- pressure
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 4
- 238000005259 measurement Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１ａ図は本考案の第１実施例の説明図で、第
１ｂ図はその作用の説明図、第２ａ図は本考案の
第２実施例の説明図で、第２ｂ図はその作用の説
明図、第３図は従来技術の説明図。
１０：センサ、１２：センサチツプ、１３：ダ
イアフラム、１４：台座、１６：真空基準圧室、
１８：基台、２０：ポスト、２２：キヤン、２４
：圧力導入口、２６：切欠き、２７：孔、２８：
半田、９０：回路基板。
Fig. 1a is an explanatory diagram of the first embodiment of the present invention, Fig. 1b is an explanatory diagram of its operation, Fig. 2a is an explanatory diagram of the second embodiment of the invention, and Fig. 2b is an explanatory diagram of its operation. FIG. 3 is an explanatory diagram of the prior art. 10: sensor, 12: sensor chip, 13: diaphragm, 14: pedestal, 16: vacuum reference pressure chamber,
18: Base, 20: Post, 22: Kiyan, 24
: Pressure introduction port, 26: Notch, 27: Hole, 28:
Solder, 90: Circuit board.
Claims (1)
ム１３の下部が基準圧室１６になつているセンサ
チツプ１２と；前記センサチツプ１２の上面に測
定圧を導入するための圧力導入口２４とを有する
半導体圧力センサにおいて； 前記圧力導入口２４の基部が、機械的または熱
的の弱点となつていることを特徴とする、半導体
圧力センサ。 (2) 圧力導入口２４の基部に切欠き２６が形成
してあつて、その部分が機械的弱点になつている
ことを特徴とする、実用新案登録請求の範囲第１
項に記載の半導体圧力センサ。 (3) 圧力導入口２４の基部がキヤン２２に低融
点の半田２８で接着してあつて、その部分が熱的
弱点となつていることを特徴とする、実用新案登
録請求の範囲第１項に記載の半導体圧力センサ。[Claims for Utility Model Registration] (1) A sensor chip 12 which is sealed on a base 14 and whose lower part of the diaphragm 13 serves as a reference pressure chamber 16; measurement pressure is introduced into the upper surface of the sensor chip 12; A semiconductor pressure sensor having a pressure introduction port 24 for: A semiconductor pressure sensor characterized in that the base of the pressure introduction port 24 is a mechanical or thermal weak point. (2) Claim 1 of the utility model registration, which is characterized in that a notch 26 is formed at the base of the pressure introduction port 24, and that part becomes a mechanical weak point.
The semiconductor pressure sensor described in . (3) Claim 1 of the utility model registration claim, characterized in that the base of the pressure introduction port 24 is bonded to the can 22 with a low melting point solder 28, and that part becomes a thermal weak point. The semiconductor pressure sensor described in .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19256687U JPH0197231U (en) | 1987-12-18 | 1987-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19256687U JPH0197231U (en) | 1987-12-18 | 1987-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0197231U true JPH0197231U (en) | 1989-06-28 |
Family
ID=31483416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19256687U Pending JPH0197231U (en) | 1987-12-18 | 1987-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0197231U (en) |
-
1987
- 1987-12-18 JP JP19256687U patent/JPH0197231U/ja active Pending
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