JPH0376140U - - Google Patents
Info
- Publication number
- JPH0376140U JPH0376140U JP13814189U JP13814189U JPH0376140U JP H0376140 U JPH0376140 U JP H0376140U JP 13814189 U JP13814189 U JP 13814189U JP 13814189 U JP13814189 U JP 13814189U JP H0376140 U JPH0376140 U JP H0376140U
- Authority
- JP
- Japan
- Prior art keywords
- container
- wiring board
- thick film
- film wiring
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図は本考案の一実施例の半導体変換器の構
成を示す構造図で、ａは断面図、ｂ，ｃはａの取
付台６を示す部分平面図及び部分断面図、第２図
は従来の一例の半導体変換器の断面図、第３図は
第２図の厚膜配線基板５と取付台６をはんだ７で
接合した場合の接合状況の一例を示す部分断面図
、第４図は第２図の厚膜配線基板５と取付台６を
はんだ７で接合した場合の接合状況の異なる例を
示す部分断面図である。
１……シリコン感圧ダイアフラムチツプ、２…
…台座、３……導圧パイプ、４……容器底部、５
……圧膜配線基板、６……取付台、７……はんだ
、９……容器蓋部、１４……溝。
FIG. 1 is a structural diagram showing the configuration of a semiconductor converter according to an embodiment of the present invention, in which a is a cross-sectional view, b and c are a partial plan view and a partial cross-sectional view showing the mounting base 6 of a, and FIG. FIG. 3 is a cross-sectional view of a semiconductor converter as an example of a conventional semiconductor converter. FIG. FIG. 3 is a partial cross-sectional view showing a different example of the bonding situation when the thick film wiring board 5 and the mounting base 6 of FIG. 2 are bonded with solder 7. FIG. 1... Silicon pressure-sensitive diaphragm chip, 2...
...Pedestal, 3...Pressure pipe, 4...Bottom of container, 5
...Thickness film wiring board, 6...Mounting stand, 7...Solder, 9...Container lid, 14...Groove.
Claims (1)
と容器蓋部とが気密に接合されて構成される容器
内に、圧力導入孔が設けられた台座を介したシリ
コン感圧ダイアフラムチツプと電子回路を搭載し
た厚膜配線基板とが収容され、厚膜配線基板が容
器底部にろう付けされる取付台を介して支持され
る半導体圧力変換器において、厚膜配線基板と容
器底部の間に介在する取付台が厚膜配線基板とほ
ぼ等しい熱膨張係数の焼結合金からなり、かつ、
少なくとも厚膜配線基板との接合面に溝を有する
ことを特徴とする半導体圧力変換器。 A silicon pressure-sensitive diaphragm chip and an electronic circuit are connected to a pedestal with a pressure introduction hole in a container that is made up of a container bottom and a container lid that are airtightly joined to each other through which a pressure-conducting pipe is attached. In a semiconductor pressure transducer that accommodates a mounted thick film wiring board and is supported via a mounting base that is brazed to the bottom of the container, the mounting is interposed between the thick film wiring board and the bottom of the container. The base is made of a sintered alloy with a coefficient of thermal expansion approximately equal to that of the thick film wiring board, and
A semiconductor pressure transducer characterized by having a groove at least on a bonding surface with a thick film wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13814189U JPH0376140U (en) | 1989-11-29 | 1989-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13814189U JPH0376140U (en) | 1989-11-29 | 1989-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0376140U true JPH0376140U (en) | 1991-07-30 |
Family
ID=31685263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13814189U Pending JPH0376140U (en) | 1989-11-29 | 1989-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0376140U (en) |
-
1989
- 1989-11-29 JP JP13814189U patent/JPH0376140U/ja active Pending
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