JPH0418462U - - Google Patents

Info

Publication number
JPH0418462U
JPH0418462U JP5975590U JP5975590U JPH0418462U JP H0418462 U JPH0418462 U JP H0418462U JP 5975590 U JP5975590 U JP 5975590U JP 5975590 U JP5975590 U JP 5975590U JP H0418462 U JPH0418462 U JP H0418462U
Authority
JP
Japan
Prior art keywords
semiconductor
anodic bonding
pressure sensor
sensor device
semiconductor pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5975590U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5975590U priority Critical patent/JPH0418462U/ja
Publication of JPH0418462U publication Critical patent/JPH0418462U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例である半導体圧力
センサー装置の断面図、第2図は第1図の半導体
圧力センサー装置の平面図、第3図は従来の半導
体圧力センサー装置の断面図、第4図は第4図の
半導体圧力センサー装置の平面図である。 図において、1はガラス、2は半導体センサー
チツプ、3は陽極接合、4は真空室、5は半導体
ICチツプを示す。なお、図中、同一符号は同一
、または相当部分を示す。
FIG. 1 is a sectional view of a semiconductor pressure sensor device which is an embodiment of this invention, FIG. 2 is a plan view of the semiconductor pressure sensor device of FIG. 1, and FIG. 3 is a sectional view of a conventional semiconductor pressure sensor device. 4 is a plan view of the semiconductor pressure sensor device of FIG. 4. FIG. In the figure, 1 is glass, 2 is a semiconductor sensor chip, 3 is anodic bonding, 4 is a vacuum chamber, and 5 is a semiconductor IC chip. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 陽極接合により真空室を形成された半導体圧力
センサー装置において、陽極接合を行うガラス上
に複数個の半導体ICチツプを搭載したことを特
徴とする半導体圧力センサー装置。
1. A semiconductor pressure sensor device having a vacuum chamber formed by anodic bonding, characterized in that a plurality of semiconductor IC chips are mounted on glass to which the anodic bonding is performed.
JP5975590U 1990-06-06 1990-06-06 Pending JPH0418462U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5975590U JPH0418462U (en) 1990-06-06 1990-06-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5975590U JPH0418462U (en) 1990-06-06 1990-06-06

Publications (1)

Publication Number Publication Date
JPH0418462U true JPH0418462U (en) 1992-02-17

Family

ID=31586534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5975590U Pending JPH0418462U (en) 1990-06-06 1990-06-06

Country Status (1)

Country Link
JP (1) JPH0418462U (en)

Similar Documents

Publication Publication Date Title
JPH0418462U (en)
JPH0397939U (en)
JPH0270450U (en)
JPS62122359U (en)
JPH0348238U (en)
JPH0263545U (en)
JPH0471019U (en)
JPS63105332U (en)
JPH044767U (en)
JPS6255344U (en)
JPH02146341U (en)
JPH0474455U (en)
JPH02102729U (en)
JPS6395244U (en)
JPH01107157U (en)
JPS6364051U (en)
JPH0314444U (en)
JPS6424848U (en)
JPH0363949U (en)
JPS62190359U (en)
JPH02149986U (en)
JPH0221763U (en)
JPH0385658U (en)
JPH0313748U (en)
JPS64331U (en)