JPH019155Y2 - - Google Patents
Info
- Publication number
- JPH019155Y2 JPH019155Y2 JP16900481U JP16900481U JPH019155Y2 JP H019155 Y2 JPH019155 Y2 JP H019155Y2 JP 16900481 U JP16900481 U JP 16900481U JP 16900481 U JP16900481 U JP 16900481U JP H019155 Y2 JPH019155 Y2 JP H019155Y2
- Authority
- JP
- Japan
- Prior art keywords
- gate
- ring
- cathode electrode
- semiconductor device
- relay
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 21
- 239000000919 ceramic Substances 0.000 description 7
- 238000003466 welding Methods 0.000 description 6
- 238000000605 extraction Methods 0.000 description 4
- 238000002788 crimping Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16900481U JPS5874351U (ja) | 1981-11-13 | 1981-11-13 | 半導体装置における素子のゲ−ト引き出し構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16900481U JPS5874351U (ja) | 1981-11-13 | 1981-11-13 | 半導体装置における素子のゲ−ト引き出し構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5874351U JPS5874351U (ja) | 1983-05-19 |
| JPH019155Y2 true JPH019155Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-03-13 |
Family
ID=29961010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16900481U Granted JPS5874351U (ja) | 1981-11-13 | 1981-11-13 | 半導体装置における素子のゲ−ト引き出し構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5874351U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5040234B2 (ja) * | 2006-09-26 | 2012-10-03 | 三菱電機株式会社 | 圧接型半導体装置 |
-
1981
- 1981-11-13 JP JP16900481U patent/JPS5874351U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5874351U (ja) | 1983-05-19 |