JPH0171437U - - Google Patents
Info
- Publication number
- JPH0171437U JPH0171437U JP1987167233U JP16723387U JPH0171437U JP H0171437 U JPH0171437 U JP H0171437U JP 1987167233 U JP1987167233 U JP 1987167233U JP 16723387 U JP16723387 U JP 16723387U JP H0171437 U JPH0171437 U JP H0171437U
- Authority
- JP
- Japan
- Prior art keywords
- mask
- semiconductor wafer
- positioning
- back sides
- alignment marks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 description 1
Description
第１図は本考案に係る半導体製造装置の一実施
例を示す断面図、第２図は第１図装置の平面図、
第３図は第１図装置による目合わせ露光状態を示
す断面図、第４図は本考案の他の実施例を示す断
面図である。第５図は従来の目合わせ露光装置の
概略構成を示す斜視図、第６図は第５図装置での
上下マスク位置合わせ状態を示す斜視図、第７図
は第５図装置での目合わせ露光状態を示す斜視図
、第８図は第７図の断面図である。
２……半導体ウエーハ、２ａ，２ｂ……表裏面
、１１，１１′……下マスク、１２……上マスク
、１４……窓孔、１５……目合わせマーク、１８
……マスク位置合わせ用マーク、１９……吸着手
段、２１……目合わせマーク、２２……マスク位
置合わせ用マーク。
FIG. 1 is a sectional view showing an embodiment of a semiconductor manufacturing apparatus according to the present invention, FIG. 2 is a plan view of the apparatus shown in FIG. 1,
FIG. 3 is a sectional view showing the aligning exposure state by the apparatus shown in FIG. 1, and FIG. 4 is a sectional view showing another embodiment of the present invention. Fig. 5 is a perspective view showing the schematic configuration of a conventional alignment exposure device, Fig. 6 is a perspective view showing the state of upper and lower mask alignment in the device shown in Fig. 5, and Fig. 7 is a perspective view showing the alignment state of the upper and lower masks in the device shown in Fig. 5. FIG. 8 is a perspective view showing the exposure state, and FIG. 8 is a sectional view of FIG. 7. 2... Semiconductor wafer, 2a, 2b... Front and back surfaces, 11, 11'... Lower mask, 12... Upper mask, 14... Window hole, 15... Alignment mark, 18
... Mark for mask positioning, 19 ... Adsorption means, 21 ... Alignment mark, 22 ... Mark for mask positioning.
Claims (1)
写用マスクを位置決めする目合わせマークが夫々
形成された上下マスクを、上記半導体ウエーハの
表裏両面側に配設する位置であつて、 上記下マスクに半導体ウエーハを位置決め固定
する吸着手段並びに、照射線が透過可能な窓孔を
設け、かつ上下マスクに上記目合わせマークと共
に上下マスクを相互に位置合わせするマスク位置
合わせ用マークを夫々形成したことを特徴とする
半導体製造装置。[Scope of Claim for Utility Model Registration] A position in which upper and lower masks each having alignment marks formed thereon for positioning a mask for device pattern transfer to both the front and back sides of the semiconductor wafer are disposed on both the front and back sides of the semiconductor wafer. , a suction means for positioning and fixing the semiconductor wafer on the lower mask, and a window hole through which radiation can pass, and mask alignment marks for mutually aligning the upper and lower masks together with the alignment mark on the upper and lower masks, respectively. A semiconductor manufacturing device characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987167233U JPH0171437U (en) | 1987-10-30 | 1987-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987167233U JPH0171437U (en) | 1987-10-30 | 1987-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0171437U true JPH0171437U (en) | 1989-05-12 |
Family
ID=31455339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987167233U Pending JPH0171437U (en) | 1987-10-30 | 1987-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0171437U (en) |
-
1987
- 1987-10-30 JP JP1987167233U patent/JPH0171437U/ja active Pending