JPS6336033U - - Google Patents

Info

Publication number
JPS6336033U
JPS6336033U JP12711686U JP12711686U JPS6336033U JP S6336033 U JPS6336033 U JP S6336033U JP 12711686 U JP12711686 U JP 12711686U JP 12711686 U JP12711686 U JP 12711686U JP S6336033 U JPS6336033 U JP S6336033U
Authority
JP
Japan
Prior art keywords
mark
alignment
alignment mark
dimensions
marks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12711686U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12711686U priority Critical patent/JPS6336033U/ja
Publication of JPS6336033U publication Critical patent/JPS6336033U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案に係る半導体装置の目合せマー
クの一実施例を示す正面図である。第2図a及び
bは第1図に示した各マークをそれぞれ独立に示
したものであり、寸法も示している。第3図a,
bは重ね合せ誤差が発生したときの状態を示す図
である。第4図は、従来の半導体装置の目合せマ
ークを示す正面図である。 1……あらかじめウエハ上にある目合せマーク
、2……フオトリソグラフイによつて作られる目
合せマーク。
FIG. 1 is a front view showing one embodiment of an alignment mark for a semiconductor device according to the present invention. FIGS. 2a and 2b show each mark shown in FIG. 1 independently, and also show their dimensions. Figure 3a,
b is a diagram showing a state when an overlay error occurs. FIG. 4 is a front view showing alignment marks of a conventional semiconductor device. 1... Alignment mark previously placed on the wafer, 2... Alignment mark made by photolithography.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 2つのマークを重ね合せることによつてフオト
リソグラフイ工程の重ね合せ誤差を知る目合せマ
ークにおいて、第1方のマークは長方形をX,Y
軸それぞれに原点を中心に配置されたものであり
、第2方のマークは形状は前記第1のマークと同
様であるが寸法及び配置をある一定量前記第1の
マークより変化させたことを特徴とする半導体装
置の目合せマーク。
In the alignment mark, which shows the overlay error in the photolithography process by overlapping two marks, the first mark is used to mark a rectangle in the X and Y directions.
The second mark is arranged around the origin on each axis, and the second mark has the same shape as the first mark, but the dimensions and arrangement are changed by a certain amount from the first mark. A distinctive alignment mark for semiconductor devices.
JP12711686U 1986-08-22 1986-08-22 Pending JPS6336033U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12711686U JPS6336033U (en) 1986-08-22 1986-08-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12711686U JPS6336033U (en) 1986-08-22 1986-08-22

Publications (1)

Publication Number Publication Date
JPS6336033U true JPS6336033U (en) 1988-03-08

Family

ID=31021558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12711686U Pending JPS6336033U (en) 1986-08-22 1986-08-22

Country Status (1)

Country Link
JP (1) JPS6336033U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612745A (en) * 1979-07-10 1981-02-07 Nec Corp Production of semiconductor device
JPS57112021A (en) * 1980-12-29 1982-07-12 Fujitsu Ltd Manufacture of semiconductor device
JPS59188648A (en) * 1983-04-11 1984-10-26 Oki Electric Ind Co Ltd Mask alignment key

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612745A (en) * 1979-07-10 1981-02-07 Nec Corp Production of semiconductor device
JPS57112021A (en) * 1980-12-29 1982-07-12 Fujitsu Ltd Manufacture of semiconductor device
JPS59188648A (en) * 1983-04-11 1984-10-26 Oki Electric Ind Co Ltd Mask alignment key

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