JPS63145325U - - Google Patents
Info
- Publication number
- JPS63145325U JPS63145325U JP3754487U JP3754487U JPS63145325U JP S63145325 U JPS63145325 U JP S63145325U JP 3754487 U JP3754487 U JP 3754487U JP 3754487 U JP3754487 U JP 3754487U JP S63145325 U JPS63145325 U JP S63145325U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- sides
- view
- alignment
- sectional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims 1
Description
第１図は本考案に係る装置の実施例を示す正面
説明図、第２図はマーキング棒の配置状態を示し
た平面断面図、第３図は目合わせの要領を示す平
面説明図、第４図は目合わせ用のマークを形成し
た半導体ウエーハの概略要部拡大縦断面図、第５
図は本考案の他の実施例を示す正面説明図、第６
図はレジスト膜に目合わせ用のマークを形成した
半導体ウエーハの概略要部拡大縦断面図である。
第７図は半導体ウエーハの拡大縦断面図、第８図
は従来の目合わせの要領を説明するための半導体
ウエーハの平面説明図である。
１……半導体ウエーハ、６……主面、８……他
主面、１１ａ，１１ｂ……マーク形成手段、１９
，２０……目合わせ用マーク。
Fig. 1 is a front explanatory view showing an embodiment of the device according to the present invention, Fig. 2 is a plan sectional view showing the arrangement of marking rods, Fig. 3 is a plan explanatory view showing the method of alignment, and Fig. 4 The figure is a schematic enlarged vertical cross-sectional view of the main part of a semiconductor wafer on which marks for alignment have been formed.
Figure 6 is a front explanatory view showing another embodiment of the present invention.
The figure is an enlarged vertical cross-sectional view of a schematic essential part of a semiconductor wafer in which alignment marks are formed on a resist film.
FIG. 7 is an enlarged vertical sectional view of a semiconductor wafer, and FIG. 8 is a plan view of the semiconductor wafer for explaining the conventional alignment procedure. DESCRIPTION OF SYMBOLS 1... Semiconductor wafer, 6... Main surface, 8... Other main surface, 11a, 11b... Mark forming means, 19
, 20... mark for alignment.
Claims (1)
両面の対応位置に、対をなす複数の目合わせ用マ
ークを形成するマーク形成手段を対設したことを
特徴とする半導体製造装置。 1. A semiconductor manufacturing apparatus comprising mark forming means for forming a plurality of pairs of alignment marks at corresponding positions on both sides of a semiconductor wafer having patterns formed on both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3754487U JPS63145325U (en) | 1987-03-13 | 1987-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3754487U JPS63145325U (en) | 1987-03-13 | 1987-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63145325U true JPS63145325U (en) | 1988-09-26 |
Family
ID=30848968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3754487U Pending JPS63145325U (en) | 1987-03-13 | 1987-03-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63145325U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9115245B2 (en) | 2002-10-11 | 2015-08-25 | Boston Scientific Scimed, Inc. | Implantable medical devices |
-
1987
- 1987-03-13 JP JP3754487U patent/JPS63145325U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9115245B2 (en) | 2002-10-11 | 2015-08-25 | Boston Scientific Scimed, Inc. | Implantable medical devices |
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