JPH0160937B2 - - Google Patents

Info

Publication number
JPH0160937B2
JPH0160937B2 JP56178374A JP17837481A JPH0160937B2 JP H0160937 B2 JPH0160937 B2 JP H0160937B2 JP 56178374 A JP56178374 A JP 56178374A JP 17837481 A JP17837481 A JP 17837481A JP H0160937 B2 JPH0160937 B2 JP H0160937B2
Authority
JP
Japan
Prior art keywords
wafer
developer
nozzle
developing
vacuum chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56178374A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5880838A (ja
Inventor
Toshihiro Abe
Chiharu Kato
Hirokazu Fukushima
Kazuo Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP56178374A priority Critical patent/JPS5880838A/ja
Publication of JPS5880838A publication Critical patent/JPS5880838A/ja
Publication of JPH0160937B2 publication Critical patent/JPH0160937B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP56178374A 1981-11-09 1981-11-09 デイベロツパ− Granted JPS5880838A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56178374A JPS5880838A (ja) 1981-11-09 1981-11-09 デイベロツパ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56178374A JPS5880838A (ja) 1981-11-09 1981-11-09 デイベロツパ−

Publications (2)

Publication Number Publication Date
JPS5880838A JPS5880838A (ja) 1983-05-16
JPH0160937B2 true JPH0160937B2 (enExample) 1989-12-26

Family

ID=16047369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56178374A Granted JPS5880838A (ja) 1981-11-09 1981-11-09 デイベロツパ−

Country Status (1)

Country Link
JP (1) JPS5880838A (enExample)

Also Published As

Publication number Publication date
JPS5880838A (ja) 1983-05-16

Similar Documents

Publication Publication Date Title
US5939139A (en) Method of removing coated film from substrate edge surface and apparatus for removing coated film
JPH0568092B2 (enExample)
JPH0573245B2 (enExample)
JPS6341630B2 (enExample)
JPS6053305B2 (ja) 現像方法
JPH0160937B2 (enExample)
JPS6351638A (ja) フオト・エツチングのレジスト塗布回収装置
JP2984963B2 (ja) 半導体ウエハ現像方法
JP2593465B2 (ja) 半導体ウエーハの液処理装置
JP3719843B2 (ja) 基板処理方法
JPH0249707Y2 (enExample)
JPS5941300B2 (ja) 現像処理装置
JP3119616B2 (ja) 現像装置
JPH04133415A (ja) 半導体基板現像装置
JPS58184725A (ja) 半導体基板のレジスト塗布装置
JPS5888749A (ja) 現像装置
JP2580082B2 (ja) 基板の回転処理装置
KR100322685B1 (ko) 스핀코터
JPS62229837A (ja) レジスト現像方法および装置
JPH0362476B2 (enExample)
JPH0262549A (ja) スピンデベロッパ、レジスト処理装置及びレジスト処理方法
JP3271063B2 (ja) 塗布膜形成方法及びその装置
JPH02134820A (ja) 洗浄乾燥装置
JPH10246967A (ja) 現像装置
JP2870827B2 (ja) レジストの現像装置