JPH0152410B2 - - Google Patents

Info

Publication number
JPH0152410B2
JPH0152410B2 JP56112745A JP11274581A JPH0152410B2 JP H0152410 B2 JPH0152410 B2 JP H0152410B2 JP 56112745 A JP56112745 A JP 56112745A JP 11274581 A JP11274581 A JP 11274581A JP H0152410 B2 JPH0152410 B2 JP H0152410B2
Authority
JP
Japan
Prior art keywords
adduct
parts
weight
epoxy resin
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56112745A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5813623A (ja
Inventor
Takeaki Abe
Isao Shinozuka
Hideo Yamamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP11274581A priority Critical patent/JPS5813623A/ja
Publication of JPS5813623A publication Critical patent/JPS5813623A/ja
Publication of JPH0152410B2 publication Critical patent/JPH0152410B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
JP11274581A 1981-07-18 1981-07-18 エポキシ樹脂用固形硬化剤組成物 Granted JPS5813623A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11274581A JPS5813623A (ja) 1981-07-18 1981-07-18 エポキシ樹脂用固形硬化剤組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11274581A JPS5813623A (ja) 1981-07-18 1981-07-18 エポキシ樹脂用固形硬化剤組成物

Publications (2)

Publication Number Publication Date
JPS5813623A JPS5813623A (ja) 1983-01-26
JPH0152410B2 true JPH0152410B2 (enrdf_load_stackoverflow) 1989-11-08

Family

ID=14594484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11274581A Granted JPS5813623A (ja) 1981-07-18 1981-07-18 エポキシ樹脂用固形硬化剤組成物

Country Status (1)

Country Link
JP (1) JPS5813623A (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5548058A (en) * 1990-05-28 1996-08-20 W. R. Grace & Co.-Conn. Spherical curing agent for epoxy resin, curing agent masterbatch for epoxy resin and their preparation
US5480957A (en) * 1991-05-28 1996-01-02 W. R. Grace & Co.-Conn. Spherical curing agent for epoxy resin, curing agent masterbatch for epoxy resin and their preparation
US5357008A (en) * 1992-01-22 1994-10-18 W. R. Grace & Co.-Conn. Latent curing agent for epoxy resin and its preparation
US5591814A (en) * 1993-02-18 1997-01-07 W. R. Grace & Co.-Conn. Curing agent masterbatch for epoxy resin and their preparation
AU2003303860A1 (en) * 2003-02-06 2004-08-30 Matsushita Electric Works, Ltd. Epoxy resin composition, semiconductor devices having cured layers of the composition, and process for production of the devices
US8513363B2 (en) 2010-10-29 2013-08-20 Cheil Industries, Inc. Adhesive composition
US20140150970A1 (en) 2010-11-19 2014-06-05 Ppg Industries Ohio, Inc. Structural adhesive compositions
JP2014065782A (ja) * 2012-09-25 2014-04-17 Asahi Kasei E-Materials Corp エポキシ樹脂用硬化剤、及び該硬化剤を含有する硬化性エポキシ樹脂組成物
JP7062613B2 (ja) * 2019-04-10 2022-05-06 タツタ電線株式会社 樹脂組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5287167A (en) * 1976-01-14 1977-07-20 Mitsubishi Petrochem Co Ltd Preparation of curing agents

Also Published As

Publication number Publication date
JPS5813623A (ja) 1983-01-26

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