JPH0148210B2 - - Google Patents
Info
- Publication number
- JPH0148210B2 JPH0148210B2 JP58127353A JP12735383A JPH0148210B2 JP H0148210 B2 JPH0148210 B2 JP H0148210B2 JP 58127353 A JP58127353 A JP 58127353A JP 12735383 A JP12735383 A JP 12735383A JP H0148210 B2 JPH0148210 B2 JP H0148210B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- glass composition
- metal
- iron
- enamel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000203 mixture Substances 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 9
- 239000002994 raw material Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 229910052681 coesite Inorganic materials 0.000 claims 1
- 229910052906 cristobalite Inorganic materials 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 229910052682 stishovite Inorganic materials 0.000 claims 1
- 229910052905 tridymite Inorganic materials 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 210000003298 dental enamel Anatomy 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 230000005499 meniscus Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 229930014626 natural product Natural products 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Glass Compositions (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12735383A JPS6021829A (ja) | 1983-07-13 | 1983-07-13 | ガラス組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12735383A JPS6021829A (ja) | 1983-07-13 | 1983-07-13 | ガラス組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6021829A JPS6021829A (ja) | 1985-02-04 |
| JPH0148210B2 true JPH0148210B2 (ko) | 1989-10-18 |
Family
ID=14957829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12735383A Granted JPS6021829A (ja) | 1983-07-13 | 1983-07-13 | ガラス組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6021829A (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0793488B2 (ja) * | 1986-03-31 | 1995-10-09 | 日立化成工業株式会社 | ほうろう配線板の製造法 |
| JPH0240990A (ja) * | 1988-07-29 | 1990-02-09 | Matsushita Electric Ind Co Ltd | 回路基板 |
| JPH05253320A (ja) * | 1992-03-13 | 1993-10-05 | Taiei Shoko Kk | 缶潰し機能を有する用機具並びに缶潰しシステム |
| JP2595353Y2 (ja) * | 1992-05-22 | 1999-05-31 | 株式会社泰成工業所 | 空缶潰し機 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57140336A (en) * | 1979-11-05 | 1982-08-30 | Rca Corp | Devitrifiable glass frit |
-
1983
- 1983-07-13 JP JP12735383A patent/JPS6021829A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57140336A (en) * | 1979-11-05 | 1982-08-30 | Rca Corp | Devitrifiable glass frit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6021829A (ja) | 1985-02-04 |
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