JPH0147278B2 - - Google Patents
Info
- Publication number
- JPH0147278B2 JPH0147278B2 JP57036477A JP3647782A JPH0147278B2 JP H0147278 B2 JPH0147278 B2 JP H0147278B2 JP 57036477 A JP57036477 A JP 57036477A JP 3647782 A JP3647782 A JP 3647782A JP H0147278 B2 JPH0147278 B2 JP H0147278B2
- Authority
- JP
- Japan
- Prior art keywords
- diffusion bonding
- bonding
- diffusion
- bonding method
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/004—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a metal of the iron group
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3647782A JPS58154476A (ja) | 1982-03-10 | 1982-03-10 | 拡散接合法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3647782A JPS58154476A (ja) | 1982-03-10 | 1982-03-10 | 拡散接合法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58154476A JPS58154476A (ja) | 1983-09-13 |
JPH0147278B2 true JPH0147278B2 (enrdf_load_stackoverflow) | 1989-10-13 |
Family
ID=12470890
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3647782A Granted JPS58154476A (ja) | 1982-03-10 | 1982-03-10 | 拡散接合法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58154476A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01159612A (ja) * | 1987-12-17 | 1989-06-22 | Matsushita Electric Ind Co Ltd | 液晶表示装置 |
US5471970A (en) * | 1994-03-16 | 1995-12-05 | Diamant Boart, Inc. | Method of manufacturing a segmented diamond blade |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3678570A (en) * | 1971-04-01 | 1972-07-25 | United Aircraft Corp | Diffusion bonding utilizing transient liquid phase |
BE795663A (fr) * | 1972-03-20 | 1973-06-18 | United Aircraft Corp | Feuille intermediaire pour soudures par diffusion |
US4005988A (en) * | 1975-12-19 | 1977-02-01 | United Technologies Corporation | Interlayer for transient liquid phase diffusion bonding |
JPS6036356B2 (ja) * | 1981-07-13 | 1985-08-20 | 株式会社日立製作所 | 拡散接合法 |
JPS5868489A (ja) * | 1981-10-21 | 1983-04-23 | Hitachi Ltd | 被接合体およびその接合方法 |
-
1982
- 1982-03-10 JP JP3647782A patent/JPS58154476A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58154476A (ja) | 1983-09-13 |
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