JPH0145979B2 - - Google Patents

Info

Publication number
JPH0145979B2
JPH0145979B2 JP7695183A JP7695183A JPH0145979B2 JP H0145979 B2 JPH0145979 B2 JP H0145979B2 JP 7695183 A JP7695183 A JP 7695183A JP 7695183 A JP7695183 A JP 7695183A JP H0145979 B2 JPH0145979 B2 JP H0145979B2
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor device
semiconductor devices
characteristic
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7695183A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59202652A (ja
Inventor
Makoto Shimanuki
Takayoshi Shimomura
Mamoru Myamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7695183A priority Critical patent/JPS59202652A/ja
Publication of JPS59202652A publication Critical patent/JPS59202652A/ja
Publication of JPH0145979B2 publication Critical patent/JPH0145979B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP7695183A 1983-04-30 1983-04-30 半導体装置の製造方法 Granted JPS59202652A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7695183A JPS59202652A (ja) 1983-04-30 1983-04-30 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7695183A JPS59202652A (ja) 1983-04-30 1983-04-30 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS59202652A JPS59202652A (ja) 1984-11-16
JPH0145979B2 true JPH0145979B2 (enrdf_load_stackoverflow) 1989-10-05

Family

ID=13620075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7695183A Granted JPS59202652A (ja) 1983-04-30 1983-04-30 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS59202652A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02230760A (ja) * 1989-03-02 1990-09-13 Rohm Co Ltd 半導体部品の製造方法
JPH065759A (ja) * 1992-06-23 1994-01-14 Sharp Corp 半導体デバイスの製造方法
JP3862411B2 (ja) * 1998-05-12 2006-12-27 三菱電機株式会社 半導体装置の製造方法及びその構造
US20080265248A1 (en) * 2007-04-27 2008-10-30 Microchip Technology Incorporated Leadframe Configuration to Enable Strip Testing of SOT-23 Packages and the Like
DE102013217892A1 (de) * 2012-12-20 2014-06-26 Continental Teves Ag & Co. Ohg Elektronische Vorrichtung und Verfahren zur Herstellung einer elektronischen Vorrichtung
CN106926565B (zh) * 2017-03-30 2023-05-05 深圳市极而峰工业设备有限公司 Lcd立面导电银浆印刷装置

Also Published As

Publication number Publication date
JPS59202652A (ja) 1984-11-16

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