JPH0142346Y2 - - Google Patents
Info
- Publication number
- JPH0142346Y2 JPH0142346Y2 JP1983190689U JP19068983U JPH0142346Y2 JP H0142346 Y2 JPH0142346 Y2 JP H0142346Y2 JP 1983190689 U JP1983190689 U JP 1983190689U JP 19068983 U JP19068983 U JP 19068983U JP H0142346 Y2 JPH0142346 Y2 JP H0142346Y2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- pellet
- bonding pad
- semiconductor device
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H10W72/90—
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- H10W72/07551—
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- H10W72/07552—
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- H10W72/07553—
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- H10W72/07554—
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- H10W72/50—
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- H10W72/527—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/537—
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- H10W72/547—
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- H10W72/59—
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- H10W72/926—
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- H10W72/932—
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- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983190689U JPS6099536U (ja) | 1983-12-10 | 1983-12-10 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983190689U JPS6099536U (ja) | 1983-12-10 | 1983-12-10 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6099536U JPS6099536U (ja) | 1985-07-06 |
| JPH0142346Y2 true JPH0142346Y2 (enExample) | 1989-12-12 |
Family
ID=30410812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983190689U Granted JPS6099536U (ja) | 1983-12-10 | 1983-12-10 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6099536U (enExample) |
-
1983
- 1983-12-10 JP JP1983190689U patent/JPS6099536U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6099536U (ja) | 1985-07-06 |
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