JPH0140198Y2 - - Google Patents
Info
- Publication number
- JPH0140198Y2 JPH0140198Y2 JP1983053935U JP5393583U JPH0140198Y2 JP H0140198 Y2 JPH0140198 Y2 JP H0140198Y2 JP 1983053935 U JP1983053935 U JP 1983053935U JP 5393583 U JP5393583 U JP 5393583U JP H0140198 Y2 JPH0140198 Y2 JP H0140198Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- block body
- substrate
- adhesion
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983053935U JPS59159947U (ja) | 1983-04-11 | 1983-04-11 | 半導体装置の製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983053935U JPS59159947U (ja) | 1983-04-11 | 1983-04-11 | 半導体装置の製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59159947U JPS59159947U (ja) | 1984-10-26 |
| JPH0140198Y2 true JPH0140198Y2 (enExample) | 1989-12-01 |
Family
ID=30184287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983053935U Granted JPS59159947U (ja) | 1983-04-11 | 1983-04-11 | 半導体装置の製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59159947U (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2581054B2 (ja) * | 1987-02-18 | 1997-02-12 | 三菱電機株式会社 | 半導体製造装置 |
-
1983
- 1983-04-11 JP JP1983053935U patent/JPS59159947U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59159947U (ja) | 1984-10-26 |
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