JPH0136702B2 - - Google Patents

Info

Publication number
JPH0136702B2
JPH0136702B2 JP57082583A JP8258382A JPH0136702B2 JP H0136702 B2 JPH0136702 B2 JP H0136702B2 JP 57082583 A JP57082583 A JP 57082583A JP 8258382 A JP8258382 A JP 8258382A JP H0136702 B2 JPH0136702 B2 JP H0136702B2
Authority
JP
Japan
Prior art keywords
lead member
solder
chip
semiconductor chip
piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57082583A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58199534A (ja
Inventor
Shigemi Ono
Susumu Akyama
Shigeo Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP57082583A priority Critical patent/JPS58199534A/ja
Publication of JPS58199534A publication Critical patent/JPS58199534A/ja
Publication of JPH0136702B2 publication Critical patent/JPH0136702B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H10W72/073—
    • H10W72/07336—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/07636—
    • H10W72/352—
    • H10W72/50—
    • H10W72/5363—
    • H10W72/5366—
    • H10W72/5434—
    • H10W72/5449—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—
    • H10W90/763—
    • H10W90/766—

Landscapes

  • Wire Bonding (AREA)
JP57082583A 1982-05-17 1982-05-17 半導体素子のリ−ド部材の接続方法 Granted JPS58199534A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57082583A JPS58199534A (ja) 1982-05-17 1982-05-17 半導体素子のリ−ド部材の接続方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57082583A JPS58199534A (ja) 1982-05-17 1982-05-17 半導体素子のリ−ド部材の接続方法

Publications (2)

Publication Number Publication Date
JPS58199534A JPS58199534A (ja) 1983-11-19
JPH0136702B2 true JPH0136702B2 (show.php) 1989-08-02

Family

ID=13778498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57082583A Granted JPS58199534A (ja) 1982-05-17 1982-05-17 半導体素子のリ−ド部材の接続方法

Country Status (1)

Country Link
JP (1) JPS58199534A (show.php)

Also Published As

Publication number Publication date
JPS58199534A (ja) 1983-11-19

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