JPH0131688B2 - - Google Patents
Info
- Publication number
- JPH0131688B2 JPH0131688B2 JP8886582A JP8886582A JPH0131688B2 JP H0131688 B2 JPH0131688 B2 JP H0131688B2 JP 8886582 A JP8886582 A JP 8886582A JP 8886582 A JP8886582 A JP 8886582A JP H0131688 B2 JPH0131688 B2 JP H0131688B2
- Authority
- JP
- Japan
- Prior art keywords
- discharge
- supply
- workpieces
- wire
- discharged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 12
- 230000007246 mechanism Effects 0.000 claims description 4
- 238000012790 confirmation Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8886582A JPS58206132A (ja) | 1982-05-27 | 1982-05-27 | 搬送方式 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8886582A JPS58206132A (ja) | 1982-05-27 | 1982-05-27 | 搬送方式 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58206132A JPS58206132A (ja) | 1983-12-01 |
| JPH0131688B2 true JPH0131688B2 (es) | 1989-06-27 |
Family
ID=13954897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8886582A Granted JPS58206132A (ja) | 1982-05-27 | 1982-05-27 | 搬送方式 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58206132A (es) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2625749B2 (ja) * | 1987-08-25 | 1997-07-02 | ソニー株式会社 | 半導体装置組立システム |
| JP4597601B2 (ja) * | 2004-07-27 | 2010-12-15 | パナソニック株式会社 | 部品実装用装置の動作方法 |
| JP2007103872A (ja) * | 2005-10-07 | 2007-04-19 | Ultrasonic Engineering Co Ltd | ワイヤボンディング装置 |
-
1982
- 1982-05-27 JP JP8886582A patent/JPS58206132A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58206132A (ja) | 1983-12-01 |
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