JPH0131294B2 - - Google Patents
Info
- Publication number
- JPH0131294B2 JPH0131294B2 JP58082230A JP8223083A JPH0131294B2 JP H0131294 B2 JPH0131294 B2 JP H0131294B2 JP 58082230 A JP58082230 A JP 58082230A JP 8223083 A JP8223083 A JP 8223083A JP H0131294 B2 JPH0131294 B2 JP H0131294B2
- Authority
- JP
- Japan
- Prior art keywords
- cylinder
- mold
- pressure
- resin sealing
- pneumatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/70—Means for plasticising or homogenising the moulding material or forcing it into the mould, combined with mould opening, closing or clamping devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8223083A JPS59207636A (ja) | 1983-05-11 | 1983-05-11 | 半導体樹脂封止装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8223083A JPS59207636A (ja) | 1983-05-11 | 1983-05-11 | 半導体樹脂封止装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59207636A JPS59207636A (ja) | 1984-11-24 |
JPH0131294B2 true JPH0131294B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-06-26 |
Family
ID=13768600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8223083A Granted JPS59207636A (ja) | 1983-05-11 | 1983-05-11 | 半導体樹脂封止装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59207636A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0368996U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1989-11-01 | 1991-07-08 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6279633A (ja) * | 1985-10-03 | 1987-04-13 | Mitsubishi Electric Corp | 樹脂封止装置 |
JPS62154914U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1986-03-24 | 1987-10-01 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5229957A (en) * | 1975-09-03 | 1977-03-07 | Hitachi Ltd | Oil immersed electric apparatus |
JPS5229857A (en) * | 1975-09-03 | 1977-03-07 | Hitachi Ltd | Method of filling resin and apparatus |
JPS5850582B2 (ja) * | 1979-08-24 | 1983-11-11 | 道男 長田 | 半導体封入成形方法とその金型装置 |
JPS5649207A (en) * | 1979-09-28 | 1981-05-02 | Hitachi Ltd | Molding die |
JPS5775435A (en) * | 1980-10-29 | 1982-05-12 | Mitsubishi Electric Corp | Liquid transfer molding |
JPS6431294A (en) * | 1987-07-27 | 1989-02-01 | Hino Motors Ltd | Vehicle abnormality sensing informing device |
-
1983
- 1983-05-11 JP JP8223083A patent/JPS59207636A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0368996U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1989-11-01 | 1991-07-08 |
Also Published As
Publication number | Publication date |
---|---|
JPS59207636A (ja) | 1984-11-24 |