JPH0130315B2 - - Google Patents

Info

Publication number
JPH0130315B2
JPH0130315B2 JP56109538A JP10953881A JPH0130315B2 JP H0130315 B2 JPH0130315 B2 JP H0130315B2 JP 56109538 A JP56109538 A JP 56109538A JP 10953881 A JP10953881 A JP 10953881A JP H0130315 B2 JPH0130315 B2 JP H0130315B2
Authority
JP
Japan
Prior art keywords
source
region
drain
insulating layer
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56109538A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5750476A (en
Inventor
Harari Eryaho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JPS5750476A publication Critical patent/JPS5750476A/ja
Publication of JPH0130315B2 publication Critical patent/JPH0130315B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
    • G11C16/0425—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a merged floating gate and select transistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H01L29/0638—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layer, e.g. with channel stopper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
    • H01L29/7881—Programmable transistors with only two possible levels of programmation
    • H01L29/7884—Programmable transistors with only two possible levels of programmation charging by hot carrier injection
    • H01L29/7885—Hot carrier injection from the channel

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
JP56109538A 1980-09-08 1981-07-15 High efficiency non-volatile eprom and eeprom Granted JPS5750476A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/184,739 US4409723A (en) 1980-04-07 1980-09-08 Method of forming non-volatile EPROM and EEPROM with increased efficiency

Publications (2)

Publication Number Publication Date
JPS5750476A JPS5750476A (en) 1982-03-24
JPH0130315B2 true JPH0130315B2 (US20080094685A1-20080424-C00004.png) 1989-06-19

Family

ID=22678138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56109538A Granted JPS5750476A (en) 1980-09-08 1981-07-15 High efficiency non-volatile eprom and eeprom

Country Status (3)

Country Link
US (1) US4409723A (US20080094685A1-20080424-C00004.png)
JP (1) JPS5750476A (US20080094685A1-20080424-C00004.png)
DE (1) DE3117719A1 (US20080094685A1-20080424-C00004.png)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS577162A (en) * 1980-06-17 1982-01-14 Toshiba Corp Nonvolatile semiconductor memory and manufacture therefor
JPS5857750A (ja) * 1981-10-01 1983-04-06 Seiko Instr & Electronics Ltd 不揮発性半導体メモリ
JPS5963763A (ja) * 1982-10-05 1984-04-11 Fujitsu Ltd 半導体装置の製造方法
US4697330A (en) * 1983-02-23 1987-10-06 Texas Instruments Incorporated Floating gate memory process with improved dielectric
US4949154A (en) * 1983-02-23 1990-08-14 Texas Instruments, Incorporated Thin dielectrics over polysilicon
USRE34535E (en) * 1983-02-23 1994-02-08 Texas Instruments Incorporated Floating gate memory with improved dielectric
JPS6038799A (ja) * 1983-08-11 1985-02-28 Seiko Instr & Electronics Ltd 半導体不揮発性メモリ用読み出し回路
US4517731A (en) * 1983-09-29 1985-05-21 Fairchild Camera & Instrument Corporation Double polysilicon process for fabricating CMOS integrated circuits
US4769340A (en) * 1983-11-28 1988-09-06 Exel Microelectronics, Inc. Method for making electrically programmable memory device by doping the floating gate by implant
JPS60148168A (ja) * 1984-01-13 1985-08-05 Seiko Instr & Electronics Ltd 半導体不揮発性メモリ
US4639893A (en) * 1984-05-15 1987-01-27 Wafer Scale Integration, Inc. Self-aligned split gate EPROM
DE3576245D1 (de) * 1984-05-17 1990-04-05 Toshiba Kawasaki Kk Verfahren zur herstellung eines nichtfluechtigen halbleiter-eeprom-elementes.
JPS6160997A (ja) * 1984-08-30 1986-03-28 石川島播磨重工業株式会社 シ−ルド掘削工法における細粒土の分級方法及び装置
IT1213218B (it) * 1984-09-25 1989-12-14 Ates Componenti Elettron Processo per la fabbricazione di una cella di memoria non volatile con area di ossido sottile di dimensioni molto piccole, e cella ottenuta con il processo suddetto.
US5225719A (en) * 1985-03-29 1993-07-06 Advanced Micro Devices, Inc. Family of multiple segmented programmable logic blocks interconnected by a high speed centralized switch matrix
US4824795A (en) * 1985-12-19 1989-04-25 Siliconix Incorporated Method for obtaining regions of dielectrically isolated single crystal silicon
US4735919A (en) * 1986-04-15 1988-04-05 General Electric Company Method of making a floating gate memory cell
US4783766A (en) * 1986-05-30 1988-11-08 Seeq Technology, Inc. Block electrically erasable EEPROM
IT1191561B (it) * 1986-06-03 1988-03-23 Sgs Microelettrica Spa Dispositivo di memoria non labile a semiconduttore con porta non connessa (floating gate) alterabile elettricamente
IT1191566B (it) * 1986-06-27 1988-03-23 Sgs Microelettronica Spa Dispositivo di memoria non labile a semiconduttore del tipo a porta non connessa (floating gate) alterabile elettricamente con area di tunnel ridotta e procedimento di fabbricazione
US5034786A (en) * 1986-08-29 1991-07-23 Waferscale Integration, Inc. Opaque cover for preventing erasure of an EPROM
US4758869A (en) * 1986-08-29 1988-07-19 Waferscale Integration, Inc. Nonvolatile floating gate transistor structure
US4794565A (en) * 1986-09-15 1988-12-27 The Regents Of The University Of California Electrically programmable memory device employing source side injection
US5016215A (en) * 1987-09-30 1991-05-14 Texas Instruments Incorporated High speed EPROM with reverse polarity voltages applied to source and drain regions during reading and writing
US4905062A (en) * 1987-11-19 1990-02-27 Texas Instruments Incorporated Planar famos transistor with trench isolation
US5014097A (en) * 1987-12-24 1991-05-07 Waferscale Integration, Inc. On-chip high voltage generator and regulator in an integrated circuit
US4858185A (en) * 1988-01-28 1989-08-15 National Semiconductor Corporation Zero power, electrically alterable, nonvolatile latch
EP0326877B1 (en) * 1988-02-05 1995-04-05 Texas Instruments Incorporated Electrically-erasable, electrically-programmable read-only memory cell
DE68922005T2 (de) * 1988-02-05 1995-08-10 Texas Instruments Inc Elektrisch löschbare und programmierbare Nur-Lesespeicherzelle.
US4998220A (en) * 1988-05-03 1991-03-05 Waferscale Integration, Inc. EEPROM with improved erase structure
US5445980A (en) 1988-05-10 1995-08-29 Hitachi, Ltd. Method of making a semiconductor memory device
US5153144A (en) * 1988-05-10 1992-10-06 Hitachi, Ltd. Method of making tunnel EEPROM
US5198380A (en) * 1988-06-08 1993-03-30 Sundisk Corporation Method of highly compact EPROM and flash EEPROM devices
US5268318A (en) * 1988-06-08 1993-12-07 Eliyahou Harari Highly compact EPROM and flash EEPROM devices
US5268319A (en) * 1988-06-08 1993-12-07 Eliyahou Harari Highly compact EPROM and flash EEPROM devices
FR2634318B1 (fr) * 1988-07-13 1992-02-21 Commissariat Energie Atomique Procede de fabrication d'une cellule de memoire integree
US4958321A (en) * 1988-09-22 1990-09-18 Advanced Micro Devices, Inc. One transistor flash EPROM cell
US5016216A (en) * 1988-10-17 1991-05-14 Waferscale Integration, Inc. Decoder for a floating gate memory
JPH03209728A (ja) * 1989-10-11 1991-09-12 Mitsubishi Electric Corp 半導体装置
US5036378A (en) * 1989-11-01 1991-07-30 At&T Bell Laboratories Memory device
JPH06120514A (ja) * 1991-01-17 1994-04-28 Texas Instr Inc <Ti> 不揮発性メモリ・セル構造体とその製造法
US5396459A (en) * 1992-02-24 1995-03-07 Sony Corporation Single transistor flash electrically programmable memory cell in which a negative voltage is applied to the nonselected word line
JP3008812B2 (ja) * 1995-03-22 2000-02-14 日本電気株式会社 不揮発性半導体記憶装置およびその製造方法
KR100475719B1 (ko) * 1997-06-30 2005-07-07 주식회사 하이닉스반도체 반도체장치의게이트전극
FR2769747B1 (fr) * 1997-10-15 2001-10-05 Sgs Thomson Microelectronics Perfectionnement aux memoires non volatiles programmables par effet dit "de porteurs chauds" et effacables par effet tunnel
WO2000001015A1 (fr) * 1998-06-30 2000-01-06 Sharp Kabushiki Kaisha Dispositif semi-conducteur et son procede de fabrication
JP2001093996A (ja) * 1999-09-27 2001-04-06 Toshiba Corp 半導体装置の製造方法
US6384448B1 (en) 2000-02-28 2002-05-07 Micron Technology, Inc. P-channel dynamic flash memory cells with ultrathin tunnel oxides
US6249460B1 (en) * 2000-02-28 2001-06-19 Micron Technology, Inc. Dynamic flash memory cells with ultrathin tunnel oxides
US6639835B2 (en) 2000-02-29 2003-10-28 Micron Technology, Inc. Static NVRAM with ultra thin tunnel oxides
US7064034B2 (en) * 2002-07-02 2006-06-20 Sandisk Corporation Technique for fabricating logic elements using multiple gate layers
US7015111B2 (en) * 2003-10-28 2006-03-21 Micron Technology, Inc. Use of selective oxidation to form asymmetrical oxide features during the manufacture of a semiconductor device
US7057931B2 (en) * 2003-11-07 2006-06-06 Sandisk Corporation Flash memory programming using gate induced junction leakage current
JP2006344809A (ja) * 2005-06-09 2006-12-21 Toshiba Corp 半導体装置及びその製造方法
US7374996B2 (en) * 2005-11-14 2008-05-20 Charles Kuo Structured, electrically-formed floating gate for flash memories

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE7907193L (sv) * 1978-09-28 1980-03-29 Rca Corp Bestendigt minne
US4342099A (en) * 1979-06-18 1982-07-27 Texas Instruments Incorporated Electrically erasable programmable MNOS read only memory
US4267632A (en) * 1979-10-19 1981-05-19 Intel Corporation Process for fabricating a high density electrically programmable memory array
US4328565A (en) * 1980-04-07 1982-05-04 Eliyahou Harari Non-volatile eprom with increased efficiency

Also Published As

Publication number Publication date
US4409723A (en) 1983-10-18
DE3117719A1 (de) 1982-04-01
JPS5750476A (en) 1982-03-24
DE3117719C2 (US20080094685A1-20080424-C00004.png) 1988-04-28

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