JPH01299817A - 硬化性樹脂組成物 - Google Patents

硬化性樹脂組成物

Info

Publication number
JPH01299817A
JPH01299817A JP12864288A JP12864288A JPH01299817A JP H01299817 A JPH01299817 A JP H01299817A JP 12864288 A JP12864288 A JP 12864288A JP 12864288 A JP12864288 A JP 12864288A JP H01299817 A JPH01299817 A JP H01299817A
Authority
JP
Japan
Prior art keywords
imide
compound
epoxy resin
group
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12864288A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0470329B2 (enExample
Inventor
Eisaku Saito
斉藤　英作
Koji Sato
光司 佐藤
Tokio Yoshimitsu
吉光　時夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP12864288A priority Critical patent/JPH01299817A/ja
Publication of JPH01299817A publication Critical patent/JPH01299817A/ja
Publication of JPH0470329B2 publication Critical patent/JPH0470329B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP12864288A 1988-05-26 1988-05-26 硬化性樹脂組成物 Granted JPH01299817A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12864288A JPH01299817A (ja) 1988-05-26 1988-05-26 硬化性樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12864288A JPH01299817A (ja) 1988-05-26 1988-05-26 硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
JPH01299817A true JPH01299817A (ja) 1989-12-04
JPH0470329B2 JPH0470329B2 (enExample) 1992-11-10

Family

ID=14989869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12864288A Granted JPH01299817A (ja) 1988-05-26 1988-05-26 硬化性樹脂組成物

Country Status (1)

Country Link
JP (1) JPH01299817A (enExample)

Also Published As

Publication number Publication date
JPH0470329B2 (enExample) 1992-11-10

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