WO2022124129A1 - 樹脂組成物、プリプレグ、樹脂シート、金属箔張積層板、及びプリント配線板 - Google Patents
樹脂組成物、プリプレグ、樹脂シート、金属箔張積層板、及びプリント配線板 Download PDFInfo
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- WO2022124129A1 WO2022124129A1 PCT/JP2021/043773 JP2021043773W WO2022124129A1 WO 2022124129 A1 WO2022124129 A1 WO 2022124129A1 JP 2021043773 W JP2021043773 W JP 2021043773W WO 2022124129 A1 WO2022124129 A1 WO 2022124129A1
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- OZGHELYGAUYWFC-UHFFFAOYSA-N bis(4-cyanatophenyl) carbonate Chemical compound C=1C=C(OC#N)C=CC=1OC(=O)OC1=CC=C(OC#N)C=C1 OZGHELYGAUYWFC-UHFFFAOYSA-N 0.000 description 1
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- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical class COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
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- 125000003538 pentan-3-yl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])[H] 0.000 description 1
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- RGBXDEHYFWDBKD-UHFFFAOYSA-N propan-2-yl propan-2-yloxy carbonate Chemical compound CC(C)OOC(=O)OC(C)C RGBXDEHYFWDBKD-UHFFFAOYSA-N 0.000 description 1
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- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
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- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
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- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- KOWVWXQNQNCRRS-UHFFFAOYSA-N tris(2,4-dimethylphenyl) phosphate Chemical compound CC1=CC(C)=CC=C1OP(=O)(OC=1C(=CC(C)=CC=1)C)OC1=CC=C(C)C=C1C KOWVWXQNQNCRRS-UHFFFAOYSA-N 0.000 description 1
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- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
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Classifications
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- B32—LAYERED PRODUCTS
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/06—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/02—Layered products comprising a layer of natural or synthetic rubber with fibres or particles being present as additives in the layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0066—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
- C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/5399—Phosphorus bound to nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Definitions
- the present invention relates to a resin composition, a prepreg, a resin sheet, and a metal foil-clad laminate, a printed wiring board, and a semiconductor device manufactured using the same.
- Patent Document 1 describes excellent heat resistance by using a polyphenylene ether resin in which both sides of a molecular chain are modified with unsaturated bond substituents and three or more specific crosslinkable curing agents. It has been reported that a thermosetting resin composition having low dielectric properties and various physical properties at the same time, a prepreg using the composition, a laminated sheet and a printed circuit board can be obtained.
- Laminated boards for printed wiring boards are required to have crack resistance in addition to dielectric loss tangent characteristics (low dielectric loss tangent) and copper foil peel strength.
- the crack resistance indicates the insulation reliability when the bending test is performed while passing a current through the substrate on which the circuit is drawn, and means that dielectric breakdown does not occur even if the number of bendings is large.
- the copper foil-clad laminate disclosed in the above patent document has good dielectric loss tangent characteristics and the like, but still has a problem in crack resistance.
- the present invention provides a resin capable of obtaining a metal foil-clad laminate having good copper foil peel strength and dielectric positive contact characteristics (low dielectric positive contact), and also having excellent crack resistance and solder heat resistance. It is an object of the present invention to provide a composition, a printed wiring board using the metal leaf-clad laminate, and a semiconductor device.
- thermosetting compound (A) a thermoplastic elastomer (B), and a phosphorus-based flame retardant (C).
- the content of the thermoplastic elastomer (B) in the resin composition is 1 to 30 parts by mass with respect to 100 parts by mass of the resin solid content.
- a resin composition in which the content of the phosphorus-based flame retardant (C) in the resin composition is 1 to 30 parts by mass with respect to 100 parts by mass of the resin solid content.
- the phosphorus-based flame retardant (C) is at least one selected from the group consisting of an aromatic condensed phosphoric acid ester (C-1) and a cyclic phosphazene compound (C-2), which is the above [1] or [2].
- the aromatic condensed phosphoric acid ester (C-1) is a compound represented by the following formula (1)
- the cyclic phosphazene compound (C-2) is a compound represented by the following formula (2).
- n represents an integer of 3 to 6.
- the styrene-based elastomer is a styrene-butadiene-styrene block copolymer, a styrene-isoprene-styrene block copolymer, a styrene-hydrogenated butadiene-styrene block copolymer, and a styrene-hydrogenated isoprene-styrene block copolymer.
- thermosetting compound (A) contains at least one selected from the group consisting of a cyanic acid ester compound, a maleimide compound, a polyphenylene ether compound, an epoxy compound, a phenol compound, and a curable polyimide compound.
- [8] The resin composition according to any one of the above [1] to [7], wherein the resin composition further contains a filler.
- a metal leaf-clad laminate comprising at least one prepreg according to the above [11] and a metal foil laminated on one side or both sides of the prepreg.
- a metal foil-clad laminate comprising at least one resin sheet according to the above [12] and a metal foil laminated on one side or both sides of the resin sheet.
- a printed wiring board including an insulating layer and a conductor layer arranged on the surface of the insulating layer.
- a semiconductor device By using the resin composition of the present invention, a metal foil-clad laminate having good copper foil peel strength and dielectric tangential properties, and also having excellent crack resistance and solder heat resistance, and a printed wiring board using the same. , A semiconductor device can be provided.
- the resin composition of this embodiment is A resin composition containing a thermosetting compound (A), a thermoplastic elastomer (B), and a phosphorus-based flame retardant (C).
- the content of the thermoplastic elastomer (B) in the resin composition is 1 to 30 parts by mass with respect to 100 parts by mass of the resin solid content.
- the content of the phosphorus-based flame retardant (C) in the resin composition is 1 to 30 parts by mass with respect to 100 parts by mass of the resin solid content.
- resin solid content in the resin composition means a component of the resin composition excluding the solvent and the filler, and 100 parts by mass of the resin solid content means the resin composition, unless otherwise specified. It means that the total of the components excluding the solvent and the filler in the product is 100 parts by mass.
- the resin composition of the present embodiment and the components constituting the resin composition will be described first, and then the prepreg, the resin sheet, the metal leaf-clad laminate, and the like obtained by using the resin composition will be described.
- the resin composition in the present embodiment contains a thermosetting compound (A), a thermoplastic elastomer (B), and a phosphorus-based flame retardant (C).
- thermosetting compound (A) is not particularly limited as long as it is a thermosetting compound, and includes, for example, a cyanic acid ester compound, a maleimide compound, a polyphenylene ether compound, an epoxy compound, a phenol compound, and a curable polyimide compound. It is preferable to include one or more selected from the group.
- the cyanate ester compound according to the present embodiment is not particularly limited as long as it is a resin having an aromatic moiety substituted with at least one cyanato group (cyanic acid ester group) in the molecule, but is substituted with at least one cyanato group.
- a cyanate ester compound having two or more aromatic moieties in the molecule is more preferable.
- the lower limit of the number of cyanato groups contained in the cyanate ester compound is preferably 2 or more, and more preferably 3 or more. By setting the number of cyanato groups to the above lower limit or more, the heat resistance tends to be further improved.
- the upper limit is not particularly specified, but may be, for example, 50 or less.
- Examples of the cyanic acid ester compound in the present embodiment include the compound represented by the formula (5).
- Ar 1 independently represents a phenylene group which may have a substituent, a naphthylene group which may have a substituent, or a biphenylene group which may have a substituent.
- R 81 may independently have a hydrogen atom, an alkyl group having 1 to 6 carbon atoms which may have a substituent, an aryl group having 6 to 12 carbon atoms which may have a substituent, and a substituent.
- a good alkoxy group having 1 to 4 carbon atoms, an aralkyl group having a substituent in which an alkyl group having 1 to 6 carbon atoms and an aryl group having 6 to 12 carbon atoms are bonded, or an alkyl group having 1 to 6 carbon atoms may be used. It is selected from any one of the alkylaryl groups which may have a substituent in which an aryl group having 6 to 12 carbon atoms is bonded.
- N 6 represents the number of cyanato groups bonded to Ar 1 .
- N 7 represents the number of R 81 bonded to Ar 1.
- n 6 represents the average number of iterations and is an integer from 0 to 50.
- the cyanate ester compound may be a mixture of compounds with different n 8 ; Z is independent of each other.
- the alkyl group in R 81 of the formula (5) may have a linear structure, a branched chain structure, a cyclic structure (cycloalkyl group or the like).
- the hydrogen atom in the alkyl group in the alkyl group in R 81 and the aryl group in R 81 of the formula (5) is a halogen atom such as a fluorine atom or a chlorine atom, an alkoxy group such as a methoxy group or a phenoxy group, a cyano group or the like. It may be replaced with.
- alkyl group examples include methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, isobutyl group, tert-butyl group, n-pentyl group, 1-ethylpropyl group and 2,2-dimethylpropyl group.
- alkyl group examples include a group, a cyclopentyl group, a hexyl group, a cyclohexyl group, a trifluoromethyl group and the like.
- the aryl group include a phenyl group, a xylyl group, a mesityl group, a naphthyl group, a phenoxyphenyl group, an ethylphenyl group, an o-, m- or p-fluorophenyl group, a dichlorophenyl group, a dicyanophenyl group and a trifluorophenyl.
- Examples thereof include a group, a methoxyphenyl group, an o-, m- or a p-tolyl group.
- alkoxy group examples include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, an n-butoxy group, an isobutoxy group, a tert-butoxy group and the like.
- divalent organic group in Z of the formula (5) include a methylene group, an ethylene group, a trimethylene group, a cyclopentylene group, a cyclohexylene group, a trimethylcyclohexylene group, a biphenylylmethylene group, and a dimethylmethylene-phenylene.
- Examples of the divalent organic group having a nitrogen number of 1 to 10 in Z of the formula (5) include an imino group and a polyimide group.
- examples of Z in the formula (5) include those having a structure represented by the following formula (6) or the following formula (7).
- Ar 2 is selected from any one of a phenylene group, a naphthylene group and a biphenylene group.
- R 9 , R 10 , R 13 and R 14 are independently hydrogen atoms and have 1 to 1 carbon atoms, respectively. It is selected from any one of 6 alkyl groups, an aryl group having 6 to 12 carbon atoms, and an aryl group substituted with at least one of a trifluoromethyl group and a phenolic hydroxy group.
- R 11 , R 12 are independently selected from any one of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 12 carbon atoms, an alkoxy group having 1 to 4 carbon atoms and a hydroxy group.
- N 9 is 0. Although an integer of 5 is shown, the cyanate ester compound may be a mixture of compounds in which n 9 has a different group.
- Ar 3 is selected from any one of a phenylene group, a naphthylene group or a biphenylene group.
- R 15 and R 16 are independently hydrogen atoms, alkyl groups having 1 to 6 carbon atoms, and carbon. It is selected from any one of an aryl group having a number of 6 to 12, a benzyl group, an alkoxy group having 1 to 4 carbon atoms, and an aryl group substituted with at least one of a hydroxy group, a trifluoromethyl group and a cyanato group.
- n 10 represents an integer of 0 to 5
- the cyanate ester compound may be a mixture of compounds in which n 10 has a different group.
- n 11 represents an integer of 4 to 7.
- R 17 each independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
- Ar 2 of the formula (6) and Ar 3 of the formula (7) include a 1,4-phenylene group, a 1,3-phenylene group, a 4,4'-biphenylene group, and a 2,4'-biphenylene group.
- the alkyl and aryl groups in R 9 to R 14 of the formula (6) and R 15 and R 16 of the formula (7) are the same as those described in the formula (5).
- Examples of the cyanic acid ester compound represented by the formula (5) include a phenol novolac type cyanic acid ester compound, a naphthol aralkyl type cyanic acid ester compound, a biphenyl aralkyl type cyanic acid ester compound, and a naphthylene ether type cyanic acid ester compound.
- Examples thereof include a xylene resin type cyanate ester compound, an adamantan skeleton type cyanate ester compound, a bisphenol A type cyanate ester compound, a diallyl bisphenol A type cyanate ester compound, and a naphthol aralkyl type cyanate ester compound.
- cyanate ester compound represented by the formula (5) include cyanatobenzene, 1-cyanato-2-, 1-cyanato-3-, or 1-cyanato-4-methylbenzene, 1-.
- Cyanato-2-, 1-Cyanato-3-, or 1-Cyanato-4-methoxybenzene 1-Cyanato-2,3-,1-Cyanato-2,4-,1-Cyanato-2,5-,1 -Cyanato-2,6-, 1-Cyanato-3,4- or 1-Cyanato-3,5-dimethylbenzene, Cyanatoethylbenzene, Cyanatobutylbenzene, Cyanatooctylbenzene, Cyanatononylbenzene, 2-( 4-Cianaphenyl) -2-phenylpropane (cyanate of 4- ⁇ -cumylphenol), 1-cyanato-4-cyclohexylbenzene, 1-cyanato-4-vinylbenzene, 1-cyanato-2- or 1-cyana
- 1,4-disyanatobenzene 1,4-disyanato-2-tert-butylbenzene, 1,4-disyanato-2,4-dimethylbenzene, 1,4-disyanato-2,3,4-dimethylbenzene, 1 , 3-Disianat-2,4,6-trimethylbenzene, 1,3-Disyanato-5-methylbenzene, 1-Cyanato or 2-Cyanatonaphthalene, 1-Cyanato 4-methoxynaphthalene, 2-Cyanato-6-methyl Naphthalene, 2-cyanato-7-methoxynaphthalene, 2,2'-disamito-1,1'-binaphthyl, 1,3-,1,4-,1,5-,1,6-,1,7-, 2,3-,2,6-or 2,7-disianatocinaphthalene, 2,2'-or 4,4'-disyanatobiphenyl, 4,4'-disyanatooctafluorobiphenyl, 2,
- Phenol novolak resin and cresol novolak resin (a reaction of phenol, alkyl-substituted phenol or halogen-substituted phenol with a formaldehyde compound such as formalin or paraformaldehyde in an acidic solution by a known method), trisphenol novolak resin (hydroxyl).
- Phenol compound reacted in the presence of an acidic catalyst modified naphthalene formaldehyde resin (a reaction of a naphthalene formaldehyde resin and a hydroxy-substituted aromatic compound in the presence of an acidic catalyst by a known method), phenol-modified di.
- Cyclopentadiene resin phenolic resin having a polynaphthylene ether structure (a polyvalent hydroxynaphthalene compound having two or more phenolic hydroxy groups in one molecule was dehydrated and condensed in the presence of a basic catalyst by a known method.
- Phenolic resins such as those obtained by cilantic acid esterification by the same method as described above can be mentioned, but the present invention is not particularly limited. These cyanate ester compounds may be used alone or in combination of two or more.
- phenol novolac type cyanate ester compound naphthol aralkyl type cyanate ester compound, naphthylene ether type cyanate ester compound, bisphenol A type cyanate ester compound, bisphenol M type cyanate ester compound, diallyl bisphenol type cyanate ester Preferred, naphthol aralkyl-type cyanate ester compounds are particularly preferred.
- the cured product of the resin composition using these cyanate ester compounds has excellent properties such as heat resistance and low dielectric property (low dielectric constant, low dielectric loss tangent property), and the printed wiring including the cured product. Plates tend to be excellent in copper foil peel strength, mechanical strength, heat resistance, and low dielectric loss tangent.
- the content of the cyanic acid ester compound in the resin composition according to the present embodiment can be appropriately set according to the desired properties and is not particularly limited.
- the content of the cyanic acid ester compound is preferably 1 part by mass or more, more preferably 5 parts by mass or more, and 10 parts by mass when the resin solid content in the resin composition is 100 parts by mass. It is more preferably parts or more, and may be 15 parts by mass or more.
- the upper limit of the content is preferably 90 parts by mass or less, more preferably 80 parts by mass or less, further preferably 70 parts by mass or less, further preferably 60 parts by mass or less, and 55 parts by mass. It may be as follows.
- the low-dielectric property of the cured product of the resin composition becomes more excellent, and the printed wiring board containing the cured product tends to be more excellent in the low-dielectric loss tangent.
- Only one type of cyanic acid ester compound may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount is within the above range.
- the maleimide compound according to the present embodiment is not particularly limited as long as it is a compound having one or more maleimide groups in the molecule, but is preferably a compound having two or more maleimide groups in the molecule.
- Specific examples of the maleimide compound include, for example, N-phenylmaleimide, N-hydroxyphenylmaleimide, bis (4-maleimidephenyl) methane, 4,4'-diphenylmethane bismaleimide, and bis (3,5-dimethyl-4-maleimide).
- maleimide compounds represented by the following formulas (2), (3), (4) and (17) are particularly preferable in terms of low thermal expansion and improvement of heat resistance of the cured product of the resin composition. These maleimide compounds may be used alone or in combination of two or more.
- R 4 independently represents a hydrogen atom or a methyl group, and n 4 represents an integer of 1 or more.
- R 5 independently represents a hydrogen atom, an alkyl group or a phenyl group having 1 to 8 carbon atoms, and n 5 represents an integer of 1 or more and 10 or less.
- R 6 independently represents a hydrogen atom, a methyl group or an ethyl group
- R 7 independently represents a hydrogen atom or a methyl group.
- R 8 independently represents a hydrogen atom, a methyl group or an ethyl group.
- R 4 independently represents a hydrogen atom or a methyl group, and is preferably a hydrogen atom.
- n 4 represents an integer of 1 or more, and the upper limit of n 4 is usually 10, and from the viewpoint of solubility in an organic solvent, the upper limit of n 4 is preferably 10. It is 7, more preferably 5.
- the maleimide compound may contain two or more compounds having different n4s .
- R 5 is an independent hydrogen atom and an alkyl group having 1 to 8 carbon atoms (for example, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group and an isobutyl group). , T-butyl group, n-pentyl group, etc.), or phenyl group.
- the group is selected from the group consisting of a hydrogen atom, a methyl group, and a phenyl group. It is more preferably one of a hydrogen atom and a methyl group, and even more preferably a hydrogen atom.
- n 5 is preferably 4 or less, more preferably 3 or less, and even more preferably 2 or less.
- the maleimide compound may contain two or more compounds having different n5s .
- R 6 independently represents a hydrogen atom, a methyl group or an ethyl group
- R 7 independently represents a hydrogen atom or a methyl group.
- R 6 is preferably a methyl group or an ethyl group. Examples of such compounds include 3,3'-diethyl-5,5'-dimethyl-4,4'-diphenylmethanebismaleimide.
- R 8 is preferably a methyl group from the viewpoint of being more excellent in the low dielectric property of the cured product of the resin composition which independently exhibits a hydrogen atom, a methyl group or an ethyl group.
- examples of such compounds include 2,2-bis (4- (4-maleimidephenoxy) -phenyl) propane.
- the maleimide compound used in the present embodiment a commercially available maleimide compound may be used.
- the maleimide compound represented by the formula (2) "BMI-2300” manufactured by Daiwa Kasei Kogyo Co., Ltd., represented by the formula (3).
- the maleimide compound to be used is "MIR-3000” manufactured by Nippon Kayaku Co., Ltd.
- the maleimide compound represented by the formula (4) is "BMI-70” manufactured by KI Kasei Co., Ltd.
- the maleimide represented by the formula (17) As the compound, "BMI-80" manufactured by KI Kasei Co., Ltd. can be preferably used.
- the content of the maleimide compound in the resin composition according to the present embodiment can be appropriately set according to the desired properties and is not particularly limited.
- the content of the maleimide compound is preferably 1 part by mass or more, more preferably 10 parts by mass or more, and 20 parts by mass or more when the resin solid content in the resin composition is 100 parts by mass. Is even more preferable.
- the upper limit value is preferably 90 parts by mass or less, more preferably 70 parts by mass or less, further preferably 60 parts by mass or less, and may be 50 parts by mass or less. Within such a range, the cured product of the resin composition tends to more effectively exhibit high heat resistance and low water absorption. Only one type of maleimide compound may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount is within the above range.
- the polyphenylene ether compound according to this embodiment includes the formula (8) :.
- R 8 , R 9 , R 10 , and R 11 each independently represent an alkyl group, an aryl group, a halogen atom, or a hydrogen atom having 6 or less carbon atoms.
- the compound contains a polymer of the structural unit represented by.
- the polyphenylene ether compound has the formula (9) :.
- R 12 , R 13 , R 14 , R 18 , and R 19 each independently represent an alkyl group or a phenyl group having 6 or less carbon atoms.
- R 15 , R 16 , and R 17 are respectively. Independently represents a hydrogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group.
- R 20 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , and R 27 each independently represent a hydrogen atom and an alkyl group or phenyl group having 6 or less carbon atoms.
- -A- may further include a structure represented by a linear, branched or cyclic divalent hydrocarbon group having 20 or less carbon atoms.
- Examples of -A- in the formula (10) include a methylene group, an ethylidene group, a 1-methylethylidene group, a 1,1-propyridene group, a 1,4-phenylenebis (1-methylethylidene) group and a 1,3-.
- Examples thereof include, but are not limited to, a divalent organic group such as a phenylenebis (1-methylethylidene) group, a cyclohexylidene group, a phenylmethylene group, a naphthylmethylene group and a 1-phenylethylidene group.
- polyphenylene ether compound a part or all of the terminal was functionalized with an ethylenically unsaturated group such as a vinylbenzyl group, an epoxy group, an amino group, a hydroxyl group, a mercapto group, a carboxy group, a methacryl group, a silyl group and the like.
- Modified polyphenylene ether can also be used. These may be used individually by 1 type or in combination of 2 or more types. Examples of the modified polyphenylene ether having a hydroxyl group at the end include SA90 manufactured by SABIC Innovative Plastics Co., Ltd. Examples of the polyphenylene ether having a methacrylic group at the end include SA9000 manufactured by SABIC Innovative Plastics Co., Ltd.
- the method for producing the modified polyphenylene ether is not particularly limited as long as the effect of the present invention can be obtained.
- it can be produced by the method described in Japanese Patent No. 4591665.
- the modified polyphenylene ether preferably contains a modified polyphenylene ether having an ethylenically unsaturated group at the terminal.
- the ethylenically unsaturated group include an alkenyl group such as an ethenyl group, an allyl group, an acrylic group, a methacrylic group, a propenyl group, a butenyl group, a hexenyl group and an octenyl group, a cycloalkenyl group such as a cyclopentenyl group and a cyclohexenyl group, and vinyl.
- Examples thereof include an alkenylaryl group such as a benzyl group and a vinylnaphthyl group, and a vinylbenzyl group is preferable.
- the terminal ethylenically unsaturated group may be single or plural, may be the same functional group, or may be a different functional group.
- X represents an aromatic group
- -(YO) m- represents a polyphenylene ether moiety.
- R 1 , R 2 , and R 3 are independent hydrogen atoms, alkyl groups, and alkenyl groups, respectively. It represents a group or an alkynyl group, m represents an integer of 1 to 100, n represents an integer of 1 to 6, q represents an integer of 1 to 4, and m is preferably an integer of 1 or more and 50 or less. , More preferably an integer of 1 or more and 30 or less, and n is preferably an integer of 1 or more and 4 or less, more preferably 1 or 2, and ideally 1. It is preferably an integer of 1 or more and 3 or less, more preferably 1 or 2, and ideally 2.)
- the structure represented by is mentioned.
- the aromatic group represented by X in the formula (1) is a group obtained by removing q hydrogen atoms from one ring structure selected from a benzene ring structure, a biphenyl ring structure, an indenyl ring structure, and a naphthalene ring structure.
- a phenylene group, a biphenylene group, an indenylene group, and a naphthylene group can be mentioned, and a biphenylene group is preferable.
- the aromatic group represented by X is a diphenyl ether group in which an aryl group is bonded with an oxygen atom, a benzophenone group in which a carbonyl group is bonded, a 2,2-diphenylpropane group bonded by an alkylene group, or the like. May include. Further, the aromatic group may be substituted with a general substituent such as an alkyl group (preferably an alkyl group having 1 to 6 carbon atoms, particularly a methyl group), an alkenyl group, an alkynyl group or a halogen atom. However, since the aromatic group is substituted with the polyphenylene ether moiety via the oxygen atom, the limit of the number of general substituents depends on the number of the polyphenylene ether moiety.
- the structural unit represented by the above-mentioned formula (8), (9) or (10) can be used, and in particular, the structural unit represented by the formula (8) is included. Is particularly preferred.
- the modified polyphenylene ether represented by the formula (1) preferably has a number average molecular weight of 1000 or more and 7000 or less. Further, in the formula (1), one having a minimum melt viscosity of 50,000 Pa ⁇ s or less can be used. In particular, in the formula (1), those having a number average molecular weight of 1000 or more and 7000 or less and a minimum melt viscosity of 50,000 Pa ⁇ s or less are preferable.
- the number average molecular weight is measured using gel permeation chromatography according to a routine method. The number average molecular weight is more preferably 1000 to 3000. By setting the number average molecular weight to 1000 or more and 7000 or less, the effect of achieving both moldability and electrical characteristics is more effectively exhibited.
- the minimum melt viscosity is measured using a dynamic viscoelasticity measuring device according to a conventional method.
- the minimum melt viscosity is more preferably 500 to 50,000 Pa ⁇ s. By setting the minimum melt viscosity to 50,000 Pa ⁇ s or less, the effect of achieving both moldability and electrical characteristics is more effectively exhibited.
- the modified polyphenylene ether is preferably a compound represented by the following formula (11) in the formula (1).
- X is an aromatic group
- ⁇ (YO) m ⁇ indicates a polyphenylene ether moiety
- m indicates an integer of 1 to 100.
- M is preferably 1 or more. It is an integer of 50 or less, and more preferably an integer of 1 or more and 30 or less.
- X, ⁇ (YO) m ⁇ and m in the formula (11) are synonymous with those in the formula (1).
- X in the formula (1) and the formula (11) is the formula (12), the formula (13), or the formula (14), and ⁇ (YO) m ⁇ in the formula (1) and the formula (11) is ,
- Formula (15) or formula (16) may be arranged, or formula (15) and formula (16) may be block or randomly arranged structure.
- R 28 , R 29 , R 30 and R 31 each independently represent a hydrogen atom or a methyl group.
- —B— is a linear, branched or cyclic group having 20 or less carbon atoms. It is a divalent hydrocarbon group.
- -B- the same as the specific example of -A- in the formula (10) can be mentioned.
- -B- is a linear, branched or cyclic divalent hydrocarbon group having 20 or less carbon atoms.
- the method for producing the modified polyphenylene ether having the structure represented by the formula (11) is not particularly limited, and for example, the bifunctional phenylene ether obtained by oxidatively coupling a bifunctional phenol compound and a monofunctional phenol compound. It can be produced by converting the terminal phenolic hydroxyl group of the oligomer into vinylbenzyl ether. Further, as such a modified polyphenylene ether, a commercially available product can be used, and for example, OPE-2St1200 and OPE-2st2200 manufactured by Mitsubishi Gas Chemical Company, Inc. can be preferably used.
- the content of the polyphenylene ether compound in the resin composition according to the present embodiment is preferably 5 parts by mass or more, preferably 15 parts by mass or more, based on 100 parts by mass of the resin solid content of the resin composition. More preferably, it is 18 parts by mass or more.
- the upper limit of the content is preferably 80 parts by mass or less, more preferably 70 parts by mass or less, further preferably 50 parts by mass or less, and 40 parts by mass or less or 30 parts by mass. It may be as follows. By setting the content of the polyphenylene ether compound in such a range, the low-dielectric property, the metal leaf peel strength, and the heat resistance of the cured product of the resin composition tend to be more excellent.
- These polyphenylene ether compounds may be used alone or in admixture of two or more. When two or more types are used, it is preferable that the total amount is within the above range.
- epoxy compound any known epoxy compound or resin having two or more epoxy groups in one molecule can be appropriately used, and the type thereof is not particularly limited.
- bisphenol A type epoxy resin bisphenol E type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, bisphenol A novolak type epoxy resin, glycidyl ester type epoxy resin, aralkylnovolac Type epoxy resin, biphenyl aralkyl type epoxy resin, naphthylene ether type epoxy resin, cresol novolac type epoxy resin, polyfunctional phenol type epoxy resin, naphthalene type epoxy resin, anthracene type epoxy resin, naphthalene skeleton modified novolac type epoxy resin, phenol aralkyl Double bond of type epoxy resin, naphthol aralkyl type epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, alicyclic epoxy resin, polyol type epoxy
- Examples thereof include a compound obtained by epoxidizing the above, a compound obtained by reacting a hydroxyl group-containing silicone resin with epichlorohydrin, and the like.
- these epoxy compounds biphenyl aralkyl type epoxy resin, naphthylene ether type epoxy resin, polyfunctional phenol type epoxy resin, and naphthalene type epoxy resin are preferable in terms of flame retardancy and heat resistance. These epoxy compounds may be used alone or in combination of two or more.
- the content of the epoxy compound in the resin composition according to the present embodiment can be appropriately set according to the desired properties and is not particularly limited. Specifically, when the resin solid content in the resin composition is 100 parts by mass, the content of the epoxy compound is preferably 1 part by mass or more, more preferably 3 parts by mass or more, and 5 parts by mass or more. It is more preferable to have.
- the upper limit of the content is preferably 20 parts by mass or less, more preferably 10 parts by mass or less, further preferably 5 parts by mass or less, and particularly preferably 3 parts by mass or less.
- the phenol compound is not particularly limited as long as it is a compound or resin having two or more phenolic hydroxy groups in one molecule, and for example, bisphenol A type phenol resin, bisphenol E type phenol resin, bisphenol F type phenol resin, and the like.
- Biphenyl S-type phenol resin phenol novolak resin, Bisphenol A novolak type phenol resin, glycidyl ester type phenol resin, aralkyl novolak phenol resin, biphenyl aralkyl type phenol resin, cresol novolak type phenol resin, polyfunctional phenol resin, naphthol resin, naphthol novolac Resin, polyfunctional naphthol resin, anthracene type phenol resin, naphthalene skeleton modified novolak type phenol resin, phenol aralkyl type phenol resin, naphthol aralkyl type phenol resin, dicyclopentadiene type phenol resin, biphenyl type phenol resin, alicyclic phenol resin, Examples thereof include a polyol type phenol resin and a phosphorus-containing phenol resin.
- At least one selected from the group consisting of biphenyl aralkyl type phenol resin, naphthol aralkyl type phenol resin, and phosphorus-containing phenol resin is preferable from the viewpoint of further improving heat resistance and flame resistance.
- These phenol compounds may be used alone or in combination of two or more.
- the content of the phenol compound in the resin composition according to the present embodiment can be appropriately set according to the desired properties and is not particularly limited. Specifically, when the resin solid content in the resin composition is 100 parts by mass, the content of the phenol compound is preferably 1 part by mass or more, more preferably 3 parts by mass or more, and 5 parts by mass or more. It is more preferable to have.
- the upper limit of the content is preferably 20 parts by mass or less, more preferably 10 parts by mass or less, further preferably 5 parts by mass or less, and particularly preferably 3 parts by mass or less.
- the curable polyimide compound is not particularly limited as long as it is generally known, but bisallyl nadiimide is preferable from the viewpoint of low dielectric property, and it is particularly selected from the group consisting of the following formulas (17) and (18). It is preferably at least one kind.
- the content of the curable polyimide compound in the resin composition according to the present embodiment can be appropriately set according to the desired properties and is not particularly limited. Specifically, when the resin solid content in the resin composition is 100 parts by mass, the content of the curable polyimide compound is preferably 1 part by mass or more, more preferably 3 parts by mass or more, and 5 parts by mass. The above is more preferable.
- the upper limit of the content is preferably 30 parts by mass or less, more preferably 20 parts by mass or less, further preferably 10 parts by mass or less, and particularly preferably 5 parts by mass or less.
- the resin composition according to the present embodiment contains the thermoplastic elastomer (B), and the content of the thermoplastic elastomer (B) in the resin composition is 1 to 30 parts by mass with respect to 100 parts by mass of the resin solid content. ..
- the content of the thermoplastic elastomer (B) in the resin composition is 1 part by mass or more with respect to 100 parts by mass of the resin solid content
- the cured product of the resin composition has crack resistance, low dielectric constant, and low dielectric constant.
- the solder heat resistance of the cured product of the resin composition tends to be good.
- the content of the thermoplastic elastomer (B) is preferably 3 parts by mass or more, more preferably 5 parts by mass or more, and 8 parts by mass or more with respect to 100 parts by mass of the resin solid content of the resin composition. It is more preferable to have 10 parts by mass or more.
- the upper limit of the content is preferably 25 parts by mass or less, more preferably 22 parts by mass or less, and 20 parts by mass or less with respect to 100 parts by mass of the resin solid content of the resin composition. May be good.
- the content of the thermoplastic elastomer (B) is within the above range, the cured product of the resin composition tends to have more excellent crack resistance, low dielectric constant, low dielectric loss tangent property, and solder heat resistance.
- two or more kinds of thermoplastic elastomers (B) may be contained, and when two or more kinds are contained, it is preferable that the total amount thereof is within the above range.
- thermoplastic elastomer (B) is not particularly limited, and examples thereof include the following "styrene-based elastomers” and “other thermoplastic elastomers", but from the viewpoint of low dielectric constant and low dielectric direct contact. It is preferably a styrene-based elastomer.
- the "styrene-based elastomer” refers to an elastomer which is a block copolymer having a polystyrene block structure, and does not include a random copolymer.
- Styrene-hydrogenated isoprene-styrene block copolymer Styrene-hydrogenated isoprene-styrene block copolymer, styrene-butadiene block copolymer, styrene-isoprene block copolymer, styrene-hydrogenated butadiene block copolymer, styrene-hydrogenated isoprene block copolymer and styrene- At least one selected from the group consisting of hydrogenated (isoprene / butadiene) block copolymers can be mentioned. These styrene-based elastomers may be used alone or in combination of two or more.
- styrene-butadiene-styrene block copolymer styrene-isoprene-styrene block copolymer, styrene-hydrogenated butadiene-styrene block copolymer, and styrene-hydrogenated isoprene-styrene block copolymer are resin compositions. It is preferable because the cured product tends to give better low dielectric styrene.
- styrene (styrene unit) in the polystyrene block structure in the present embodiment one having a substituent may be used.
- styrene derivatives such as ⁇ -methylstyrene, 3-methylstyrene, 4-propylstyrene, and 4-cyclohexylstyrene can be used.
- the styrene content (hereinafter, also referred to as “styrene ratio”) in the styrene-based elastomer is not particularly limited, but is preferably 10% by mass or more, and more preferably 20% by mass or more.
- the upper limit of the styrene content is not particularly limited as long as it is less than 100% by mass, but is preferably less than 99% by mass, more preferably 70% by mass or less, for example. Within such a range, the solvent solubility and the compatibility with other compounds tend to be further improved.
- the styrene content is (a) / (b) ⁇ 100 when the mass of the styrene unit contained in the styrene-based elastomer is (a) g and the mass of the entire styrene-based elastomer is (b) g. It is a value expressed in (unit:%).
- styrene-based elastomer in the present embodiment, a commercially available product may be used, and examples thereof include TR2630 (manufactured by JSR Corporation) and TR2003 (manufactured by JSR Corporation) as the styrene-butadiene-styrene block copolymer. Be done.
- examples of the styrene-isoprene-styrene block copolymer include SIS5250 (manufactured by JSR Corporation).
- examples of the styrene-hydrogenated isoprene-styrene block copolymer include SEPTON2104 (manufactured by Kuraray Co., Ltd.).
- examples of the styrene-hydrogenated butadiene-styrene block copolymer include H-1043 (manufactured by Asahi Kasei Corporation).
- the content of the styrene-based elastomer is preferably 3 parts by mass or more, preferably 5 parts by mass or more, based on 100 parts by mass of the resin solid content of the resin composition. It is more preferably 8 parts by mass or more, and it may be 10 parts by mass or more.
- the upper limit of the content of the styrene-based elastomer is preferably 25 parts by mass or less, more preferably 22 parts by mass or less, and 20 parts by mass or less with respect to 100 parts by mass of the resin solid content of the resin composition. It may be.
- the cured product of the resin composition tends to have more excellent crack resistance, low dielectric constant, low dielectric loss tangent property, and solder heat resistance.
- two or more kinds of styrene-based elastomers may be contained, and when two or more kinds are contained, it is preferable that the total amount thereof is within the above range.
- thermoplastic elastomers are distinguished from “styrene-based elastomers”.
- the "styrene-based elastomer” indicates an elastomer having a polystyrene block structure and being a block copolymer, and the "other thermoplastic elastomer” indicates an elastomer other than that. That is, a random copolymer, a block copolymer having no styrene skeleton, or the like is applicable.
- the other thermoplastic elastomer is selected from the group consisting of, for example, polyisoprene, polybutadiene, styrene-butadiene random copolymer, butyl rubber, ethylene propylene rubber, fluororubber, silicone rubber, hydrogenated compounds thereof, and alkyl compounds thereof. At least one is mentioned. Among these, at least one selected from the group consisting of polyisoprene, polybutadiene, styrene-butadiene random copolymer, butyl rubber, and ethylene propylene rubber is more preferable from the viewpoint of being more excellent in compatibility with the polyphenylene ether compound. ..
- the resin composition in the present embodiment contains a phosphorus-based flame retardant (C), and the content of the phosphorus-based flame retardant (C) in the resin composition is 1 to 30% by mass with respect to 100 parts by mass of the resin solid content. It is a department.
- the content of the phosphorus-based flame retardant in the resin composition is 1 part by mass or more with respect to 100 parts by mass of the resin solid content, the cured product of the resin composition has crack resistance, low dielectric constant, and low dielectric loss tangent property.
- it is 30 parts by mass or less the copper foil peel strength, crack resistance, and solder heat resistance of the cured product of the resin composition tend to be good.
- the content of the phosphorus-based flame retardant (C) is preferably 3 parts by mass or more, more preferably 5 parts by mass or more, and 8 parts by mass or more with respect to 100 parts by mass of the resin solid content of the resin composition. Is more preferable, and it may be 10 parts by mass or more, or 15 parts by mass or more.
- the upper limit of the content is preferably 25 parts by mass or less, more preferably 22 parts by mass or less, and 20 parts by mass or less with respect to 100 parts by mass of the resin solid content of the resin composition. May be good.
- the cured product of the resin composition has higher crack resistance, low dielectric constant, low dielectric loss tangent property, copper foil peel strength, and solder heat resistance. It tends to be excellent.
- two or more kinds of phosphorus-based flame retardants (C) may be contained, and when two or more kinds are contained, it is preferable that the total amount thereof is within the above range.
- the content of the phosphorus-based flame retardant (C) is 15 with respect to 100 parts by mass of the resin solid content of the resin composition from the viewpoint of particularly enhancing the crack resistance and the copper foil peel strength of the cured product of the resin composition. It is preferably 2 parts by mass or more, and particularly preferably 20 parts by mass or more.
- the upper limit of the content of the phosphorus-based flame retardant (C) is preferably 30 parts by mass or less, more preferably 28 parts by mass or less, based on 100 parts by mass of the resin solid content of the resin composition. Yes, it may be 25 parts by mass or less.
- the resin solid content is 100. It is preferably 10 parts by mass or more, more preferably 15 parts by mass or more, further preferably 20 parts by mass or more, particularly preferably 25 parts by mass or more, and 30 parts by mass with respect to parts by mass. It may be more than a mass part. Further, since the solder heat resistance of the cured product of the resin composition tends to be further improved, the total content of the thermoplastic elastomer (B) and the phosphorus-based flame retardant (C) is 100 parts by mass of the resin solid content. On the other hand, it is preferably 60 parts by mass or less, more preferably 55 parts by mass or less, further preferably 50 parts by mass or less, and particularly preferably 40 parts by mass or less.
- the phosphorus-based flame retardant (C) is not particularly limited, and is, for example, red phosphorus, tricresyl phosphate, triphenyl phosphate, cresyldiphenyl phosphate, trixylenyl phosphate, trialkyl phosphate, dialkyl phosphate, tris (chloroethyl).
- Phosphazene, phosphazene, 10- (2,5-dihydroxyphenyl) -10H-9-oxa-10-phosphaphenanthrene-10-oxide and the like can be mentioned.
- the phosphorus-based flame retardant (C) is composed of an aromatic condensed phosphoric acid ester (C-1) and a cyclic phosphazene compound (C-2) from the viewpoints of low dielectric constant, low dielectric loss tangent property, and improved crack resistance. It is preferable to use one or more selected from the group.
- Examples of the aromatic condensed phosphoric acid ester (C-1) include resorcinol bis-diphenyl phosphate, bisphenol A bis-diphenyl phosphate, and a compound represented by the following formula (1). Above all, from the viewpoint of low dielectric constant and low dielectric loss tangent property, the compound represented by the following formula (1) is preferable.
- the cyclic phosphazene compound (C-2) is represented by hexaphenoxycyclotriphosphazene, hexafluorocyclotriphosphazene, pentafluoro (phenoxy) cyclotriphosphazene, ethoxy (pentafluoro) cyclotriphosphazene, and the following formula (2).
- Examples include compounds. Above all, from the viewpoint of solvent solubility, the compound represented by the following formula (2) is preferable.
- n an integer of 3 to 6.
- Examples of the compound represented by the above formula (2) include Ravitor FP-300B (manufactured by Fushimi Pharmaceutical Co., Ltd.).
- the resin composition according to the present embodiment contains a filler in order to improve low dielectric constant, low dielectric loss tangent property, flame resistance and low thermal expansion.
- a filler in order to improve low dielectric constant, low dielectric loss tangent property, flame resistance and low thermal expansion.
- known fillers can be appropriately used, and the types thereof are not particularly limited, and those generally used in the art can be preferably used.
- silicas such as natural silica, fused silica, synthetic silica, amorphous silica, aerodil, hollow silica, white carbon, titanium white, zinc oxide, magnesium oxide, zirconium oxide, boron nitride, coagulated boron nitride, silicon nitride.
- metal hydrates such as magnesium hydroxide
- oxidation Molybdenum compounds such as molybdenum and zinc molybdenate
- zinc borate zinc nitrate
- organic fillers such as styrene type, butadiene type, acrylic type rubber powder, core shell type rubber powder, silicone resin powder, silicone rubber powder, and silicone composite powder, etc. Can be mentioned. These fillers may be used alone or in combination of two or more. Among these, one or more selected from the group consisting of silicas, aluminum hydroxide, aluminum nitride, boron nitride, and forsterite, boehmite, magnesium oxide and magnesium hydroxide are preferable, and silicas and hydroxides are preferable. Aluminum, aluminum nitride, boron nitride, and forsterite are more preferred. By using these fillers, the cured product of the resin composition tends to have improved properties such as thermal expansion characteristics, dimensional stability, and flame retardancy.
- the content of the filler in the resin composition according to the present embodiment can be appropriately set according to the desired characteristics and is not particularly limited, but when the resin solid content in the resin composition is 100 parts by mass, it is not particularly limited. It is preferably 30 parts by mass or more, and more preferably 50 parts by mass or more.
- the upper limit is preferably 1600 parts by mass or less, more preferably 500 parts by mass or less, and particularly preferably 300 parts by mass or less.
- the content of the filler may be 75 to 250 parts by mass or 100 to 200 parts by mass. By setting the content of the filler in this range, the moldability of the resin composition tends to be improved.
- the resin composition may contain only one type of filler, or may contain two or more types of filler. When two or more kinds are contained, it is preferable that the total amount is within the above range.
- silane coupling agent those generally used for surface treatment of inorganic substances can be preferably used, and the type thereof is not particularly limited. Specifically, aminosilanes such as ⁇ -aminopropyltriethoxysilane and N- ⁇ - (aminoethyl) - ⁇ -aminopropyltrimethoxylane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ - (3,4).
- Epoxysilanes such as ethyltrimethoxysilane, ⁇ -methacryloxypropyltrimethoxysilanes, vinylsilanes such as vinyl-tri ( ⁇ -methoxyethoxy) silanes, N- ⁇ - (N-vinylbenzylaminoethyl)- Examples thereof include cationicsilane type such as ⁇ -aminopropyltrimethoxysilane hydrochloride and phenylsilane type.
- the silane coupling agent may be used alone or in combination of two or more. Further, as the wet dispersant, those generally used for paints can be preferably used, and the type thereof is not particularly limited.
- a copolymer-based wet dispersant is used, and specific examples thereof include DISPERBYK-110, 111, 161 and 180, 2009, 2152, BYK-W996, BYK-W9010 manufactured by Big Chemie Japan Co., Ltd. , BYK-W903, BYK-W940 and the like.
- the wet dispersant may be used alone or in combination of two or more.
- the content of the silane coupling agent is not particularly limited, and may be about 1 part by mass to 5 parts by mass with respect to 100 parts by mass of the resin solid content in the resin composition.
- the content of the dispersant (particularly the wet dispersant) is not particularly limited, and may be, for example, about 0.5 to 5 parts by mass with respect to 100 parts by mass of the resin solid content in the resin composition.
- the resin composition of the present embodiment may contain other components other than those described above.
- examples of other components include oxetane resins, benzoxazine compounds, flame retardants, curing accelerators, organic solvents and the like.
- the oxetane resin is not particularly limited, and is, for example, oxetane, alkyl oxetane (for example, 2-methyloxetane, 2,2-dimethyloxetane, 3-methyloxetane, 3,3-dimethyloxatan, etc.), 3-methyl-.
- the benzoxazine compound is not particularly limited as long as it is a compound having two or more dihydrobenzoxazine rings in one molecule, and for example, bisphenol A type benzoxazine BA-BXZ (product of Konishi Chemical Co., Ltd.), bisphenol F. Examples thereof include type benzoxazine BF-BXZ (product of Konishi Chemical Co., Ltd.) and bisphenol S type benzoxazine BS-BXZ (product of Konishi Chemical Co., Ltd.). These benzoxazine compounds may be used alone or in combination of two or more.
- the resin composition according to the present embodiment may contain a flame retardant other than the above-mentioned phosphorus-based flame retardant (C) in order to further improve the flame resistance.
- a flame retardant can be used, for example, brominated epoxy resin, brominated polycarbonate, brominated polystyrene, brominated styrene, brominated phthalimide, tetrabromobisphenol A, pentabromobenzyl (meth) acrylate.
- Pentabromotoluene tribromophenol, hexabromobenzene, decabromodiphenyl ether, bis-1,2-pentabromophenylethane, chlorinated polystyrene, halogenated flame retardants such as chlorinated paraffin, aluminum hydroxide, magnesium hydroxide, Examples thereof include inorganic flame retardants such as partial boehmite, boehmite, zinc borate and antimony trioxide, and silicone flame retardants such as silicone rubber and silicone resin. These flame retardants may be used alone or in combination of two or more.
- the content of the flame retardant is preferably 1 part by mass or more, and more preferably 5 parts by mass or more, with respect to 100 parts by mass of the resin solid content in the resin composition.
- the upper limit of the content is preferably 30 parts by mass or less, more preferably 20 parts by mass or less, and may be 15 parts by mass or less. Only one kind of flame retardant may be used, or two or more kinds may be used. When two or more types are used, it is preferable that the total amount is within the above range.
- the resin composition according to the present embodiment may contain a curing accelerator for appropriately adjusting the curing rate.
- a curing accelerator for appropriately adjusting the curing rate.
- the curing accelerator include those usually used as a curing accelerator such as maleimide compounds, cyanate esters compounds, and epoxy compounds, and organic metal salts (for example, zinc octylate, zinc naphthenate, cobalt naphthenate, etc.).
- dicyandiamide for example, dicyandiamide, benzyldimethylamine, 4-methyl-N, N-dimethylbenzylamine, etc.
- phosphorus compounds for example, phosphine-based compounds, phosphinoxide-based compounds, phosphonium salt-based compounds, diphosphin-based compounds, etc.
- epoxys for example, epoxys.
- -Imidazole adduct-based compounds peroxides (eg, benzoyl peroxide, p-chlorobenzoyl peroxide, di-t-butyl peroxide, diisopropylperoxycarbonate, di-2-ethylhexylperoxycarbonate, etc.), azo compounds (eg For example, azobisisobutyronitrile, etc.).
- peroxides eg, benzoyl peroxide, p-chlorobenzoyl peroxide, di-t-butyl peroxide, diisopropylperoxycarbonate, di-2-ethylhexylperoxycarbonate, etc.
- azo compounds eg For example, azobisisobutyronitrile, etc.
- the curing accelerator may be used alone or in combination of two or more.
- the content of the curing accelerator may be about 0.005 to 10 parts by mass with respect to 100 parts by mass of the resin solid content in the resin composition.
- the resin composition according to this embodiment may contain an organic solvent.
- the resin composition according to the present embodiment is in the form (solution or varnish) in which at least a part, preferably all of the above-mentioned various resin components are dissolved or compatible with an organic solvent.
- the organic solvent is not particularly limited as long as it is a polar organic solvent or a non-polar organic solvent capable of dissolving or compatible with at least a part, preferably all of the above-mentioned various resin components, and the polar organic solvent is, for example, a ketone.
- Classes eg, acetone, methyl ethyl ketone, methyl isobutyl ketone, etc.
- cellosolves eg, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, etc.
- esters eg, ethyl lactate, methyl acetate, ethyl acetate, butyl acetate, acetate, etc.
- examples thereof include isoamyl, ethyl lactate, methyl methoxypropionate, methyl hydroxyisobutyrate, etc.) amides (eg, dimethoxyacetamide, dimethylformamide, etc.)
- non-polar organic solvent include aromatic hydrocarbons (eg, toluene, xylene). Etc.). These organic solvents may be used alone or in combination of two or more.
- the resin composition according to the present embodiment may contain various polymer compounds such as thermosetting resins, thermoplastic resins, and oligomers thereof, and various additives other than the above components.
- Additives include UV absorbers, antioxidants, photopolymerization initiators, optical brighteners, photosensitizers, dyes, pigments, thickeners, flow modifiers, lubricants, defoaming agents, leveling agents, gloss. Agents, polymerization inhibitors and the like can be mentioned. These additives may be used alone or in combination of two or more.
- the resin composition according to the present embodiment can be prepared according to a conventional method, and contains a thermosetting compound (A), a thermoplastic elastomer (B) and a phosphorus-based flame retardant (C), and other optional components described above.
- the preparation method is not particularly limited as long as it is a method for obtaining a resin composition uniformly containing.
- the thermosetting compound (A), the thermoplastic elastomer (B), the phosphorus-based flame retardant (C), and the above-mentioned other optional components are sequentially added to the solvent and sufficiently stirred to relate to the present embodiment.
- the resin composition can be easily prepared.
- the prepreg according to the present embodiment includes a base material and a resin composition impregnated or coated on the base material.
- the resin composition is a resin composition containing the above-mentioned thermosetting compound (A), a specific amount of the thermoplastic elastomer (B), and a phosphorus-based flame retardant (C).
- the prepreg according to the present embodiment is obtained, for example, by impregnating or coating the base material with the resin composition according to the present embodiment and then semi-curing it by a method of drying at 120 to 220 ° C. for about 2 to 15 minutes. Be done.
- the amount of the resin composition (including the cured product of the resin composition) adhered to the substrate that is, the amount of the resin composition (including the filler) with respect to the total amount of the prepreg after semi-curing is 20 to 99% by mass. It is preferably in the range.
- the base material is not particularly limited as long as it is a base material used for various printed wiring board materials.
- the material of the base material for example, glass fiber (for example, E-glass, D-glass, L-glass, S-glass, T-glass, Q-glass, UN-glass, NE-glass, spherical glass, etc.)
- glass fiber for example, E-glass, D-glass, L-glass, S-glass, T-glass, Q-glass, UN-glass, UN-glass, NE-glass, spherical glass, etc.
- inorganic fibers other than glass for example, quartz, etc.
- organic fibers for example, polyimide, polyamide, polyester, liquid crystal polyester, polytetrafluoroethylene, etc.
- the form of the base material is not particularly limited, and examples thereof include woven fabrics, non-woven fabrics, rovings, chopped strand mats, and surfaced mats.
- base materials may be used alone or in combination of two or more.
- woven fabrics that have undergone super-opening treatment and filling treatment are preferable from the viewpoint of dimensional stability, and silane coupling agents such as epoxy silane treatment and amino silane treatment are preferable from the viewpoint of moisture absorption and heat resistance.
- a glass woven fabric surface-treated with is preferable. From the viewpoint of electrical characteristics, low dielectric glass cloth made of glass fibers exhibiting low dielectric constant and low dielectric loss tangent properties such as L-glass, NE-glass, and Q-glass is more preferable.
- the resin sheet according to this embodiment contains a resin composition.
- the resin composition is a resin composition containing the above-mentioned thermosetting compound (A), a specific amount of the thermoplastic elastomer (B), and a phosphorus-based flame retardant (C).
- the resin sheet may be a resin sheet with a support including a support and a layer formed from the resin composition according to the present embodiment arranged on the surface of the support.
- the resin sheet can be used as a build-up film or a dry film solder resist.
- the method for producing the resin sheet is not particularly limited, but for example, the resin sheet is obtained by applying (coating) a solution prepared by dissolving the resin composition according to the present embodiment in a solvent to a support and drying the resin sheet. The method can be mentioned.
- the support examples include polyethylene films, polypropylene films, polycarbonate films, polyethylene terephthalate films, ethylene tetrafluoroethylene copolymer films, and release films and polyimide films in which a release agent is applied to the surface of these films.
- examples thereof include an organic film base material, a conductor foil such as a copper foil and an aluminum foil, and a plate-like one such as a glass plate, a SUS plate, and an FRP, but the present invention is not particularly limited.
- a coating method for example, a method in which a solution obtained by dissolving the resin composition according to the present embodiment in a solvent is coated on a support with a bar coater, a die coater, a doctor blade, a baker applicator, or the like. Can be mentioned. Further, after drying, the support can be peeled off or etched from the resin sheet with the support on which the support and the resin composition are laminated to obtain a single-layer sheet (resin sheet).
- a support is used by supplying a solution obtained by dissolving the resin composition according to the present embodiment in a solvent into a mold having a sheet-shaped cavity and drying the resin composition to form a sheet. It is also possible to obtain a single-layer sheet (resin sheet) without any need.
- the drying conditions for removing the solvent are not particularly limited, but the solvent in the resin composition can be easily removed and dried. From the viewpoint of suppressing the progress of curing over time, a temperature of 20 ° C. to 200 ° C. for 1 to 90 minutes is preferable. Further, in the single-layer sheet or the resin sheet with a support, the resin composition can be used in an uncured state in which the solvent is simply dried, or if necessary, it is made into a semi-cured state (B stage). It can also be used.
- the thickness of the resin layer of the single-layer sheet or the resin sheet with a support according to the present embodiment can be adjusted by the concentration of the solution of the resin composition according to the present embodiment and the coating thickness, and is not particularly limited. From the viewpoint of facilitating the removal of the solvent during drying, 0.1 to 500 ⁇ m is preferable.
- the laminated board of this embodiment includes one or more selected from the group consisting of the above-mentioned prepreg and resin sheet.
- the resin composition used for each prepreg and the resin sheet may be the same or different.
- the resin compositions used for them may be the same or different.
- the metal foil-clad laminate according to the present embodiment includes at least one of the above-mentioned prepregs and metal foil laminated on one side or both sides of the prepreg. Further, the metal foil-clad laminate according to the present embodiment may include at least one of the above-mentioned resin sheets and the metal foil laminated on one side or both sides of the resin sheet. Further, the metal foil-clad laminate according to the present embodiment may include the above-mentioned laminate and the metal foil laminated on one side or both sides of the laminate.
- the resin composition used for each prepreg and the resin sheet may be the same or different, and when both the prepreg and the resin sheet are used, they are used.
- the resin compositions may be the same or different.
- the metal foil is laminated on one or more kinds selected from the group consisting of prepregs and resin sheets, and among them, one kind selected from the group consisting of prepregs and resin sheets. It is preferable that the metal foil is laminated so as to be in contact with the above surface. "The metal leaf is laminated so as to be in contact with one or more surfaces selected from the group consisting of the prepreg and the resin sheet” means that a layer such as an adhesive layer is included between the prepreg or the resin sheet and the metal leaf. It does not mean that the prepreg or resin sheet is in direct contact with the metal leaf. As a result, the metal leaf peel strength of the metal foil-clad laminate is increased, and the insulation reliability of the printed wiring board tends to be improved.
- the metal foil-clad laminate according to the present embodiment has one or more stacked prepregs and / or resin sheets according to the present embodiment, and metal foils arranged on one side or both sides of the prepregs and / or resin sheets. May be.
- a method for manufacturing a metal foil-clad laminate according to the present embodiment for example, a method of stacking one or more prepregs and / or resin sheets according to the present embodiment and arranging metal foils on one or both sides thereof for laminating and molding. Can be mentioned.
- Examples of the forming method include a method usually used for forming a laminated plate for a printed wiring board and a multilayer plate, and more specifically, a multi-stage press machine, a multi-stage vacuum press machine, a continuous forming machine, an autoclave forming machine and the like are used. Then, a method of laminating molding at a temperature of about 180 to 350 ° C., a heating time of about 100 to 300 minutes, and a surface pressure of about 20 to 100 kg / cm 2 can be mentioned.
- a multilayer board can be obtained by laminating and molding the prepreg and / or the resin sheet according to the present embodiment in combination with the wiring board for the inner layer separately prepared.
- a method for manufacturing a multilayer board for example, copper foils having a thickness of about 35 ⁇ m are arranged on both sides of the prepreg and / or the resin sheet according to the present embodiment in which one or more sheets are stacked, and laminated by the above molding method. After the copper foil-clad laminate is formed, an inner layer circuit is formed, and the circuit is blackened to form an inner layer circuit board. After that, the inner layer circuit board and the prepreg and / or resin according to the present embodiment are formed.
- a multilayer plate can be produced by alternately arranging the sheets one by one, further arranging the copper foil on the outermost layer, and laminating and molding under the above conditions, preferably under vacuum.
- the metal leaf-clad laminate according to the present embodiment can be suitably used as a printed wiring board.
- the metal foil-clad laminate of the present embodiment has a high metal leaf peel strength.
- the measured value obtained according to JIS C6481: 1996 is preferably 0.4 kN / m or more, and more preferably 0.5 kN / m or more.
- the upper limit of the metal leaf peel strength is not particularly specified, but is practically 1.4 kN / m or less, for example.
- the metal foil-clad laminate of the present embodiment preferably has a small dielectric loss tangent. Specifically, using a sample obtained by removing the metal foil from the metal foil-clad laminate by etching, the measured value of the dielectric tangent at 10 GHz measured by the cavity resonator perturbation method is 0. It is preferably less than 0035, more preferably less than 0.0030, and particularly preferably less than 0.0025.
- the lower limit of the dielectric loss tangent is not particularly limited, but for example, 0.0001 or more is practical.
- the metal foil in the present embodiment is not particularly limited, and examples thereof include gold foil, silver foil, copper foil, tin foil, nickel foil, and aluminum foil. Among them, copper foil is preferable.
- the copper foil is not particularly limited as long as it is generally used as a material for a printed wiring board, and examples thereof include copper foils such as rolled copper foils and electrolytic copper foils, and among them, copper foil peel strength and fine wiring. From the viewpoint of formability, electrolytic copper foil is preferable.
- the thickness of the copper foil is not particularly limited and may be about 1.5 to 70 ⁇ m.
- the roughness Rz of the copper foil surface measured according to JIS B0601: 2013 is adjusted to 0.2 to 4.0 ⁇ m.
- the roughness Rz of the copper foil surface is less than 0.2 ⁇ m, the roughness of the copper foil surface tends to be too small and the copper foil peel strength tends to be insufficient.
- the roughness Rz of the copper foil surface exceeds 4.0, the roughness of the copper foil surface becomes too large, and the dielectric loss tangent characteristics tend to deteriorate.
- the roughness Rz of the copper foil surface is more preferably 0.5 to 4 ⁇ m, further preferably 0.6 to 3 ⁇ m, and particularly preferably 0.7 to 2 ⁇ m from the viewpoint of reducing the dielectric loss tangent.
- the roughness Rz of the copper foil surface can be measured according to the method described in Examples described later.
- the printed wiring board according to the present embodiment includes an insulating layer and a conductor layer arranged on the surface of the insulating layer, and the insulating layer is formed from a layer formed from the resin composition according to the present embodiment and a prepreg. Includes at least one of the layers.
- a printed wiring board can be manufactured according to a conventional method, and the manufacturing method thereof is not particularly limited, but for example, it can be manufactured by using the above-mentioned metal leaf-clad laminated board.
- the following is an example of a method for manufacturing a printed wiring board. First, the above-mentioned metal foil-clad laminate is prepared. Next, the surface of the metal foil-clad laminate is etched to form an inner layer circuit, and an inner layer substrate is produced.
- the inner layer circuit surface of this inner layer substrate is surface-treated to increase the adhesive strength as necessary, then the required number of the above-mentioned prepregs is laminated on the inner layer circuit surface, and the metal foil for the outer layer circuit is laminated on the outer side thereof. Then, heat and pressurize to integrally mold. In this way, a multi-layer laminated board in which an insulating layer made of a base material and a cured product of a resin composition is formed between an inner layer circuit and a copper foil for an outer layer circuit is manufactured.
- a plated metal film for conducting the inner layer circuit and the metal foil for the outer layer circuit is formed on the wall surface of the holes, and further, the outer layer circuit is formed.
- a printed wiring board is manufactured by forming an outer layer circuit by etching a metal foil for use.
- the printed wiring board obtained in the above production example has an insulating layer and a conductor layer formed on the surface of the insulating layer, and the insulating layer is the resin composition according to the present embodiment described above and a cured product thereof.
- the configuration includes at least one of them. That is, the prepreg according to the above-mentioned embodiment (including at least one of the substrate and the resin composition according to the present embodiment impregnated or coated thereto and the cured product thereof), and the metal foil according to the above-mentioned present embodiment.
- the layer of the resin composition of the upholstered laminated board (the layer containing at least one of the resin composition of the present invention and the cured product thereof) is an insulating layer containing at least one of the resin composition and the cured product thereof according to the present embodiment. Will be composed of.
- the semiconductor device of this embodiment can be manufactured by mounting a semiconductor chip on a conductive portion of the printed wiring board of this embodiment.
- the conduction point is a place where an electric signal is transmitted in the multilayer printed wiring board, and the place may be a surface or an embedded place.
- the semiconductor chip is not particularly limited as long as it is an electric circuit element made of a semiconductor.
- the method for mounting the semiconductor chip when manufacturing the semiconductor device of the present embodiment is not particularly limited as long as the semiconductor chip functions effectively, but specifically, a wire bonding mounting method, a flip chip mounting method, and a bump. None Examples thereof include a mounting method using a build-up layer (BBUL), a mounting method using an anisotropic conductive film (ACF), and a mounting method using a non-conductive film (NCF).
- BBUL build-up layer
- ACF anisotropic conductive film
- NCF non-conductive film
- a test piece (30 mm ⁇ 150 mm ⁇ 0.8 mm) with a copper foil was prepared, and the sample from which the copper foil was removed by etching was used as JIS C2138: According to 2007, the dielectric positive contact at 10 GHz was measured by the cavity resonator perturbation method.
- the cavity resonator was manufactured by EM Lab Co., Ltd., and the network analyzer was 8722ES manufactured by Agilent.
- A, B, and C in the table were evaluated according to the following criteria. The closer the dielectric loss tangent is to 0, the better.
- test piece 50 mm ⁇ 50 mm ⁇ 0.8 mm
- solder heat resistance For the copper foil-clad laminate obtained in the examples or comparative examples, a test piece (50 mm ⁇ 50 mm ⁇ 0.8 mm) with a copper foil was prepared according to JIS C5012: 1992, and the solder heated to 288 ° C. After floating the test piece in the tank for 30 minutes, it was visually confirmed whether there was any abnormality such as delamination in the copper foil-clad laminate. A and B in the table were evaluated according to the following criteria. A: No delamination for 30 minutes B: Delamination occurs within 30 minutes
- reaction solution was allowed to stand to separate the organic phase and the aqueous phase.
- the obtained organic phase was washed 5 times with 1300 g of water, and the electric conductivity of the wastewater in the 5th washing was 5 ⁇ S / cm, and it was confirmed that the ionic compounds that could be removed were sufficiently removed by washing with water. ..
- the organic phase after washing with water was concentrated under reduced pressure, and finally concentrated to dryness at 90 ° C. for 1 hour to obtain 331 g of the desired 1-naphthol aralkyl-type cyanate ester compound (SNCN) (orange viscous substance).
- the mass average molecular weight Mw of the obtained SNCN was 600.
- Infrared absorption spectrum of SNCN showed absorption of 2250 cm -1 (cyanic acid ester group) and no absorption of hydroxy group.
- each component contained in the resin composition The following components were used as the components contained in the resin compositions of Examples or Comparative Examples.
- Maleimide resin MIR-3000, Polyphenylene ether resin manufactured by Nippon Kayaku Co., Ltd .: OPE-2St2200, manufactured by Mitsubishi Gas Chemical Company, Inc., number average molecular weight 2200, vinyl group equivalent: 1100 g / eq.
- Thermoplastic Elastomer Hydrogenated Styrene Thermoplastic Elastomer (SEBS), Tuftec H-1043, Phosphorus Flame Retardant 1: 1,3-Phenylenbis (2,6-di-xylenyl phosphate) manufactured by Asahi Kasei Co., Ltd., PX-200, Phosphorus Flame Retardant manufactured by Daihachi Chemical Industry Co., Ltd .2: Cyclic organophosphazen compound, Ravitor FP-300B, Filler manufactured by Fushimi Pharmaceutical Co., Ltd .: Spherical silica, SC2050-MB, Admatex Co., Ltd. Made, average particle diameter 0.5 ⁇ m
- the copper foil used in the examples or comparative examples is shown below.
- the roughness Rz is the roughness Rz of the surface in contact with the laminated prepreg in the example or comparative example measured by the method described above. In the examples or comparative examples, the measured roughness surface is arranged so as to be in contact with the surface of the laminated prepreg to obtain a copper foil-clad laminate.
- Copper foil: TQ-M5-VSP (manufactured by Mitsui Mining & Smelting Co., Ltd.), electrolytic copper foil, Rz 0.7 ⁇ m, thickness 12 ⁇ m
- Example 1 65 parts by mass of maleimide resin MIR-3000, 15 parts by mass of thermoplastic elastomer H-1043 (styrene ratio 67%), 20 parts by mass of phosphorus-based flame retardant PX-200, 100 parts by mass of filler SC2050-MB.
- Ethylmethylketone is used to mix and dilute to prepare a varnish, the obtained varnish is impregnated and coated on a glass woven cloth having a thickness of 0.075 mm, and heated and dried at 160 ° C. for 5 minutes to form a resin composition.
- a prepreg having a content of 60% by mass was obtained. Eight obtained prepregs were stacked and the copper foils shown above were placed one above the other, and laminated and molded at a pressure of 30 kgf / cm 2 and a temperature of 220 ° C. for 120 minutes. A laminated board was obtained.
- Example 2 65 parts by mass of polyphenylene ether resin OPE-2St2200, 15 parts by mass of thermoplastic elastomer H-1043 (styrene ratio 67%), 20 parts by mass of phosphorus-based flame retardant PX-200, 100 parts by mass of filler SC2050-MB, To prepare a varnish by mixing and diluting with ethyl methyl ketone, impregnating the obtained varnish on a glass woven cloth having a thickness of 0.075 mm, and heating and drying at 160 ° C. for 5 minutes to form a resin composition. A prepreg having a substance content of 60% by mass was obtained. Eight obtained prepregs were stacked and the copper foils shown above were placed one above the other, and laminated and molded at a pressure of 30 kgf / cm 2 and a temperature of 220 ° C. for 120 minutes. A laminated board was obtained.
- Example 3 75 parts by mass of polyphenylene ether resin OPE-2St2200, 5 parts by mass of thermoplastic elastomer H-1043 (styrene ratio 67%), 20 parts by mass of phosphorus-based flame retardant PX-200, 100 parts by mass of filler SC2050-MB, To prepare a varnish by mixing and diluting with ethyl methyl ketone, impregnating the obtained varnish on a glass woven cloth having a thickness of 0.075 mm, and heating and drying at 160 ° C. for 5 minutes to form a resin composition. A prepreg having a substance content of 60% by mass was obtained. Eight obtained prepregs were stacked and the copper foils shown above were placed one above the other, and laminated and molded at a pressure of 30 kgf / cm 2 and a temperature of 220 ° C. for 120 minutes. A laminated board was obtained.
- Example 4 35 parts by mass of maleimide resin MIR-3000, 20 parts by mass of polyphenylene ether resin OPE-2St2200, 10 parts by mass of SNCN, 15 parts by mass of thermoplastic elastomer H-1043 (styrene ratio 67%), phosphorus-based flame retardant PX- 20 parts by mass of 200 and 100 parts by mass of the filler SC2050-MB are mixed and diluted with ethyl methyl ketone to prepare a varnish, and the obtained varnish is impregnated into a glass woven cloth having a thickness of 0.075 mm. The coating was applied and dried by heating at 160 ° C. for 5 minutes to obtain a prepreg having a resin composition content of 60% by mass. Eight obtained prepregs were stacked and the copper foils shown above were placed one above the other, and laminated and molded at a pressure of 30 kgf / cm 2 and a temperature of 220 ° C. for 120 minutes. A laminated board was obtained.
- Example 5 35 parts by mass of maleimide resin MIR-3000, 20 parts by mass of polyphenylene ether resin OPE-2St2200, 10 parts by mass of SNCN, 15 parts by mass of thermoplastic elastomer H-1043 (styrene ratio 67%), phosphorus-based flame retardant Rabbitl FP 20 parts by mass of -300B and 100 parts by mass of the filler SC2050-MB were mixed and diluted with ethylmethylketone to prepare a varnish, and the obtained varnish was put into a glass woven cloth having a thickness of 0.075 mm. It was impregnated and dried by heating at 160 ° C. for 5 minutes to obtain a prepreg having a resin composition content of 60% by mass. Eight obtained prepregs were stacked and the copper foils shown above were placed one above the other, and laminated and molded at a pressure of 30 kgf / cm 2 and a temperature of 220 ° C. for 120 minutes. A laminated board was obtained.
- the copper foil-clad laminates of Examples 1 to 5 have good copper foil peel strength and low dielectric loss tangent, and also have crack resistance and solder heat resistance. It was confirmed to be excellent.
- the copper foil-clad laminate obtained by using the resin composition of the present invention has industrial applicability as a material for constituting a printed wiring board, a semiconductor device, or the like.
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Abstract
Description
[1]
熱硬化性化合物(A)、熱可塑性エラストマー(B)、及びリン系難燃剤(C)を含む樹脂組成物であって、
前記樹脂組成物中の前記熱可塑性エラストマー(B)の含有量が、樹脂固形分100質量部に対して1~30質量部であり、
前記樹脂組成物中の前記リン系難燃剤(C)の含有量が、樹脂固形分100質量部に対して1~30質量部である、樹脂組成物。
[2]
前記樹脂組成物中の前記リン系難燃剤(C)の含有量が、樹脂固形分100質量部に対して15~30質量部である、上記[1]に記載の樹脂組成物。
[3]
前記リン系難燃剤(C)が、芳香族縮合リン酸エステル(C-1)及び環状ホスファゼン化合物(C-2)からなる群より選択される1種以上である、上記[1]または[2]に記載の樹脂組成物。
[4]
前記芳香族縮合リン酸エステル(C-1)が、下記式(1)で表される化合物であり、前記環状ホスファゼン化合物(C-2)が、下記式(2)で表される化合物である、上記[3]に記載の樹脂組成物。
[5]
前記熱可塑性エラストマー(B)は、スチレン系エラストマーである、上記[1]~[4]のいずれかに記載の樹脂組成物。
[6]
前記スチレン系エラストマーは、スチレン-ブタジエン-スチレンブロック共重合体、スチレン-イソプレン-スチレンブロック共重合体、スチレン-水添ブタジエン-スチレンブロック共重合体、およびスチレン-水添イソプレン-スチレンブロック共重合体からなる群より選ばれる1種以上である、上記[5]に記載の樹脂組成物。
[7]
前記熱硬化性化合物(A)は、シアン酸エステル化合物、マレイミド化合物、ポリフェニレンエーテル化合物、エポキシ化合物、フェノール化合物、および硬化性ポリイミド化合物からなる群より選ばれる1種以上を含む、上記[1]~[6]のいずれかに記載の樹脂組成物。
[8]
前記樹脂組成物が充填材をさらに含有する、上記[1]~[7]のいずれかに記載の樹脂組成物。
[9]
前記充填材は、シリカ類、水酸化アルミニウム、窒化アルミニウム、窒化ホウ素、及びフォルステライトからなる群より選択される1種以上である、上記[8]に記載の樹脂組成物。
[10]
前記樹脂組成物中の前記充填材の含有量が、樹脂固形分100質量部に対して30~300質量部である、上記[8]又は[9]に記載の樹脂組成物。
[11]
基材と、前記基材に含浸又は塗布された上記[1]~[10]のいずれかに記載の樹脂組成物と、を含むプリプレグ。
[12]
上記[1]~[10]のいずれかに記載の樹脂組成物を含む、樹脂シート。
[13]
上記[11]記載のプリプレグ及び上記[12]記載の樹脂シートからなる群より選ばれる1種以上を含む、積層板。
[14]
少なくとも1枚の上記[11]記載のプリプレグと、前記プリプレグの片面又は両面に積層された金属箔と、を含む金属箔張積層板。
[15]
少なくとも1枚の上記[12]記載の樹脂シートと、前記樹脂シートの片面又は両面に積層された金属箔と、を含む金属箔張積層板。
[16]
絶縁層と、前記絶縁層の表面に配置された導体層と、を含むプリント配線板であって、
前記絶縁層が、上記[1]~[10]のいずれかに記載の樹脂組成物から形成された層及び上記[11]記載のプリプレグから形成された層の少なくとも一方を含む、プリント配線板。
[17]
上記[16]に記載のプリント配線板を用いて製造された半導体装置。
熱硬化性化合物(A)、熱可塑性エラストマー(B)、及びリン系難燃剤(C)を含む樹脂組成物であって、
前記樹脂組成物中の前記熱可塑性エラストマー(B)の含有量が、樹脂固形分100質量部に対して1~30質量部であり、
前記樹脂組成物中の前記リン系難燃剤(C)の含有量が、樹脂固形分100質量部に対して1~30質量部である。
本実施形態における樹脂組成物は、熱硬化性化合物(A)、熱可塑性エラストマー(B)、及びリン系難燃剤(C)を含む。
熱硬化性化合物(A)としては、熱硬化性の化合物であれば特に限定されないが、例えば、シアン酸エステル化合物、マレイミド化合物、ポリフェニレンエーテル化合物、エポキシ化合物、フェノール化合物、および硬化性ポリイミド化合物からなる群より選ばれる1種以上を含むことが好ましい。
本実施形態に係るシアン酸エステル化合物は、少なくとも1つのシアナト基(シアン酸エステル基)により置換された芳香族部分を分子内に有する樹脂であれば特に限定されないが、少なくとも1つのシアナト基により置換された芳香族部分を分子内に2つ以上有するシアン酸エステル化合物が、より好ましい。シアン酸エステル化合物が有するシアナト基の数の下限は、2以上であることが好ましく、3以上であることがより好ましい。シアナト基の数を上記下限値以上とすることにより、耐熱性がより向上する傾向にある。上限値については、特に定めるものではないが、例えば、50以下であってもよい。
アルキル基の具体例としては、メチル基、エチル基、プロピル基、イソプロピル基、n-ブチル基、イソブチル基、tert-ブチル基、n-ペンチル基、1-エチルプロピル基、2,2-ジメチルプロピル基、シクロペンチル基、ヘキシル基、シクロヘキシル基、トリフルオロメチル基等が挙げられる。
アリール基の具体例としては、フェニル基、キシリル基、メシチル基、ナフチル基、フェノキシフェニル基、エチルフェニル基、o-,m-又はp-フルオロフェニル基、ジクロロフェニル基、ジシアノフェニル基、トリフルオロフェニル基、メトキシフェニル基、o-,m-又はp-トリル基等が挙げられる。
アルコキシ基の具体例としては、メトキシ基、エトキシ基、プロポキシ基、イソプロポキシ基、n-ブトキシ基、イソブトキシ基、tert-ブトキシ基等が挙げられる。
式(5)のZにおける2価の有機基の具体例としては、メチレン基、エチレン基、トリメチレン基、シクロペンチレン基、シクロヘキシレン基、トリメチルシクロヘキシレン基、ビフェニルイルメチレン基、ジメチルメチレン-フェニレン-ジメチルメチレン基、フルオレンジイル基、フタリドジイル基等が挙げられる。前記2価の有機基中の水素原子は、フッ素原子、塩素原子等のハロゲン原子、メトキシ基、フェノキシ基等のアルコキシ基、シアノ基等で置換されていてもよい。式(5)のZにおける窒素数1~10の2価の有機基としては、イミノ基、ポリイミド基等が挙げられる。
シアン酸エステル化合物は1種のみ用いてもよいし、2種以上用いてもよい。2種以上用いる場合は、合計量が上記範囲となることが好ましい。
本実施形態に係るマレイミド化合物は、分子中に一個以上のマレイミド基を有する化合物であれば、特に限定されるものではないが、好ましくは分子中に2個以上のマレイミド基を有する化合物である。マレイミド化合物の具体例としては、例えば、N-フェニルマレイミド、N-ヒドロキシフェニルマレイミド、ビス(4-マレイミドフェニル)メタン、4,4’-ジフェニルメタンビスマレイミド、ビス(3,5-ジメチル-4-マレイミドフェニル)メタン、ビス(3,5-ジエチル-4-マレイミドフェニル)メタン、フェニルメタンマレイミド、o-フェニレンビスマレイミド、m-フェニレンビスマレイミド、p-フェニレンビスマレイミド、o-フェニレンビスシトラコンイミド、m-フェニレンビスシトラコンイミド、p-フェニレンビスシトラコンイミド、2,2-ビス(4-(4-マレイミドフェノキシ)-フェニル)プロパン、3,3’-ジエチル-5,5’-ジメチル-4,4’-ジフェニルメタンビスマレイミド、4-メチル-1,3-フェニレンビスマレイミド、1,6-ビスマレイミド-(2,2,4-トリメチル)ヘキサン、4,4’-ジフェニルエーテルビスマレイミド、4,4’-ジフェニルスルフォンビスマレイミド、1,3-ビス(3-マレイミドフェノキシ)ベンゼン、1,3-ビス(4-マレイミドフェノキシ)ベンゼン、4,4’-ジフェニルメタンビスシトラコンイミド、2,2-ビス[4-(4-シトラコンイミドフェノキシ)フェニル]プロパン、ビス(3,5-ジメチル-4-シトラコンイミドフェニル)メタン、ビス(3-エチル-5-メチル-4-シトラコンイミドフェニル)メタン、ビス(3,5-ジエチル-4-シトラコンイミドフェニル)メタン、下記式(2)、(3)、(4)及び(17)で表されるマレイミド化合物等が挙げられる。
これらの中でも、下記式(2)、(3)、(4)及び(17)で表されるマレイミド化合物が樹脂組成物の硬化物の低熱膨張性及び耐熱性向上の面で特に好ましい。これらのマレイミド化合物は、単独で用いても、2種以上を併用してもよい。
マレイミド化合物は1種のみ用いてもよいし、2種以上用いてもよい。2種以上用いる場合は、合計量が上記範囲となることが好ましい。
本実施形態に係るポリフェニレンエーテル化合物としては、式(8):
で表される構造単位の重合体を含む化合物であることが好ましい。
ポリフェニレンエーテル化合物は、式(9):
で表される構造、及び/又は、式(10):
末端が水酸基である変性ポリフェニレンエーテルとしては例えば、SABICイノベーティブプラスチックス社製SA90等が挙げられる。また、末端がメタクリル基であるポリフェニレンエーテルとしては例えば、SABICイノベーティブプラスチックス社製SA9000等が挙げられる。
で表される構造が挙げられる。
ここで、Xが表す芳香族基は、アリール基が酸素原子で結合されているジフェニルエーテル基等や、カルボニル基で結合されたベンゾフェノン基等、アルキレン基により結合された2,2-ジフェニルプロパン基等を含んでもよい。
また、芳香族基は、アルキル基(好適には炭素数1~6のアルキル基、特にメチル基)、アルケニル基、アルキニル基やハロゲン原子など、一般的な置換基によって置換されていてもよい。但し、芳香族基は、酸素原子を介してポリフェニレンエーテル部分に置換されているので、一般的置換基の数の限界は、ポリフェニレンエーテル部分の数に依存する。
数平均分子量は、定法に従ってゲル浸透クロマトグラフィーを使用して測定される。数平均分子量は、1000~3000であることがより好ましい。数平均分子量を1000以上7000以下とすることにより、成形性及び電気特性の両立という効果がより効果的に発揮される。
最低溶融粘度は、定法に従って動的粘弾性測定装置を使用して測定される。最低溶融粘度は、500~50000Pa・sがより好ましい。最低溶融粘度を50000Pa・s以下とすることにより、成形性及び電気特性の両立という効果がより効果的に発揮される。
式(11)におけるX、-(Y-O)m-及びmは、式(1)におけるものと同義である。
-B-は、式(10)における-A-の具体例と同じものが具体例として挙げられる。
-B-は、式(10)における-A-の具体例と同じものが具体例として挙げられる。
また、このような変性ポリフェニレンエーテルは市販品を用いることができ、例えば、三菱ガス化学(株)製OPE-2St1200、OPE-2st2200を好適に使用することができる。
これらのポリフェニレンエーテル化合物は1種単独で又は2種以上を適宜混合して使用することも可能である。2種以上用いる場合は、合計量が上記範囲となることが好ましい。
本実施形態に係るエポキシ化合物としては、1分子中に2個以上のエポキシ基を有するエポキシ化合物又は樹脂であれば、公知のものを適宜使用することができ、その種類は特に限定されない。具体的には、ビスフェノールA型エポキシ樹脂、ビスフェノールE型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、ビスフェノールAノボラック型エポキシ樹脂、グリシジルエステル型エポキシ樹脂、アラルキルノボラック型エポキシ樹脂、ビフェニルアラルキル型エポキシ樹脂、ナフチレンエーテル型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、多官能フェノール型エポキシ樹脂、ナフタレン型エポキシ樹脂、アントラセン型エポキシ樹脂、ナフタレン骨格変性ノボラック型エポキシ樹脂、フェノールアラルキル型エポキシ樹脂、ナフトールアラルキル型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、ビフェニル型エポキシ樹脂、脂環式エポキシ樹脂、ポリオール型エポキシ樹脂、リン含有エポキシ樹脂、グリシジルアミン、グリシジルエステル、ブタジエンなどの二重結合をエポキシ化した化合物、水酸基含有シリコーン樹脂類とエピクロロヒドリンとの反応により得られる化合物などが挙げられる。これらのエポキシ化合物のなかでは、ビフェニルアラルキル型エポキシ樹脂、ナフチレンエーテル型エポキシ樹脂、多官能フェノール型エポキシ樹脂、ナフタレン型エポキシ樹脂が難燃性、耐熱性の面で好ましい。これらのエポキシ化合物は、1種を単独で又は2種以上を組み合わせて用いることができる。
フェノール化合物としては、1分子中に2個以上のフェノール性ヒドロキシ基を有する化合物又は樹脂であれば特に限定されず、例えば、ビスフェノールA型フェノール樹脂、ビスフェノールE型フェノール樹脂、ビスフェノールF型フェノール樹脂、ビスフェノールS型フェノール樹脂、フェノールノボラック樹脂、ビスフェノールAノボラック型フェノール樹脂、グリシジルエステル型フェノール樹脂、アラルキルノボラックフェノール樹脂、ビフェニルアラルキル型フェノール樹脂、クレゾールノボラック型フェノール樹脂、多官能フェノール樹脂、ナフトール樹脂、ナフトールノボラック樹脂、多官能ナフトール樹脂、アントラセン型フェノール樹脂、ナフタレン骨格変性ノボラック型フェノール樹脂、フェノールアラルキル型フェノール樹脂、ナフトールアラルキル型フェノール樹脂、ジシクロペンタジエン型フェノール樹脂、ビフェニル型フェノール樹脂、脂環式フェノール樹脂、ポリオール型フェノール樹脂、リン含有フェノール樹脂等が挙げられる。これらの中でも、耐熱性、耐燃性をより一層向上する観点から、ビフェニルアラルキル型フェノール樹脂、ナフトールアラルキル型フェノール樹脂、及びリン含有フェノール樹脂からなる群より選択される少なくとも1種であることが好ましい。これらのフェノール化合物は、単独で用いても、2種以上を併用してもよい。
硬化性ポリイミド化合物は、一般に公知のものであれば特に限定されないが、低誘電特性の観点から、ビスアリルナジイミドが好ましく、中でも以下の式(17)及び(18)からなる群より選択される少なくとも1種であることが好ましい。
本実施形態に係る「スチレン系エラストマー」とは、ポリスチレンブロック構造を有するブロック共重合体であるエラストマーを指し、ランダム共重合体は含まない。
「その他の熱可塑性エラストマー」は、「スチレン系エラストマー」とは区別される。「スチレン系エラストマー」とは、ポリスチレンブロック構造を有し、かつブロック共重合体であるエラストマーを示し、「その他の熱可塑性エラストマー」とは、それ以外のエラストマーを示す。すなわち、ランダム共重合体、スチレン骨格を有しないブロック共重合体等が該当する。
その他の熱可塑性エラストマーとしては、例えばポリイソプレン、ポリブタジエン、スチレンブタジエンランダム共重合体、ブチルゴム、エチレンプロピレンゴム、フッ素ゴム、シリコーンゴム、それらの水添化合物、それらのアルキル化合物からなる群より選択される少なくとも1種が挙げられる。これらの中でも、ポリフェニレンエーテル化合物との相溶性により優れる観点から、ポリイソプレン、ポリブタジエン、スチレンブタジエンランダム共重合体、ブチルゴム、及びエチレンプロピレンゴムからなる群より選択される少なくとも1種であることがより好ましい。
本実施形態における樹脂組成物はリン系難燃剤(C)を含み、前記樹脂組成物中の前記リン系難燃剤(C)の含有量が、樹脂固形分100質量部に対して1~30質量部である。樹脂組成物中のリン系難燃剤の含有量が樹脂固形分100質量部に対して1質量部以上であると、樹脂組成物の硬化物の耐クラック性、低誘電率性、低誘電正接性が向上する傾向にあり、30質量部以下であると、樹脂組成物の硬化物の銅箔ピール強度、耐クラック性、半田耐熱性が良好となる傾向にある。
本実施形態に係る樹脂組成物は、低誘電率性、低誘電正接性、耐燃性及び低熱膨張性の向上のため、充填材を含むことが望ましい。本実施形態で使用される充填材としては、公知のものを適宜使用することができ、その種類は特に限定されず、当業界において一般に使用されているものを好適に用いることができる。具体的には、天然シリカ、溶融シリカ、合成シリカ、アモルファスシリカ、アエロジル、中空シリカ等のシリカ類、ホワイトカーボン、チタンホワイト、酸化亜鉛、酸化マグネシウム、酸化ジルコニウム、窒化ホウ素、凝集窒化ホウ素、窒化ケイ素、窒化アルミニウム、硫酸バリウム、水酸化アルミニウム、水酸化アルミニウム加熱処理品(水酸化アルミニウムを加熱処理し、結晶水の一部を減じたもの)、ベーマイト、水酸化マグネシウム等の金属水和物、酸化モリブデンやモリブデン酸亜鉛等のモリブデン化合物、ホウ酸亜鉛、錫酸亜鉛、アルミナ、クレー、カオリン、タルク、焼成クレー、焼成カオリン、焼成タルク、マイカ、E-ガラス、A-ガラス、NE-ガラス、C-ガラス、L-ガラス、D-ガラス、S-ガラス、M-ガラスG20、ガラス短繊維(Eガラス、Tガラス、Dガラス、Sガラス、Qガラス等のガラス微粉末類を含む。)、中空ガラス、球状ガラスなど無機系の充填材の他、スチレン型、ブタジエン型、アクリル型などのゴムパウダー、コアシェル型のゴムパウダー、シリコーンレジンパウダー、シリコーンゴムパウダー、シリコーン複合パウダーなど有機系の充填材などが挙げられる。これらの充填材は、単独で用いても、2種以上を併用してもよい。
これらの中でも、シリカ類、水酸化アルミニウム、窒化アルミニウム、窒化ホウ素、及びフォルステライト、ベーマイト、酸化マグネシウム及び水酸化マグネシウムからなる群から選択される1種又は2種以上が好ましく、シリカ類、水酸化アルミニウム、窒化アルミニウム、窒化ホウ素、及びフォルステライトがより好ましい。これらの充填材を使用することで、樹脂組成物の硬化物の、熱膨張特性、寸法安定性、難燃性などの特性が向上する傾向にある。
樹脂組成物は、充填材を、1種のみ含んでいてもよいし、2種以上含んでいてもよい。2種以上含む場合、合計量が上記範囲となることが好ましい。
シランカップリング剤としては、一般に無機物の表面処理に使用されているものを好適に用いることができ、その種類は特に限定されない。具体的には、γ-アミノプロピルトリエトキシシラン、N-β-(アミノエチル)-γ-アミノプロピルトリメトキシランなどのアミノシラン系、γ-グリシドキシプロピルトリメトキシシラン、β-(3,4-エポキシシクロヘキシル)エチルトリメトキシシランなどのエポキシシラン系、γ-メタアクリロキシプロピルトリメトキシシラン、ビニルートリ(β-メトキシエトキシ)シランなどのビニルシラン系、N-β-(N-ビニルベンジルアミノエチル)-γ-アミノプロピルトリメトキシシラン塩酸塩などのカチオニックシラン系、フェニルシラン系などが挙げられる。シランカップリング剤は、単独で用いても、2種以上を併用してもよい。
また、湿潤分散剤としては、一般に塗料用に使用されているものを好適に用いることができ、その種類は特に限定されない。好ましくは、共重合体ベースの湿潤分散剤が使用され、その具体例としては、ビックケミー・ジャパン(株)製のDISPERBYK-110、111、161、180、2009、2152、BYK-W996、BYK-W9010、BYK-W903、BYK-W940などが挙げられる。湿潤分散剤は、単独で用いても、2種以上を併用してもよい。
本実施形態の樹脂組成物は、上述した以外のその他成分が含まれていてよい。その他成分としては、例えば、オキセタン樹脂、ベンゾオキサジン化合物、難燃剤、硬化促進剤、有機溶剤等が挙げられる。
オキセタン樹脂としては、特に限定されず、例えば、オキセタン、アルキルオキセタン(例えば、2-メチルオキセタン、2,2-ジメチルオキセタン、3-メチルオキセタン、3,3-ジメチルオキサタン等)、3-メチル-3-メトキシメチルオキセタン、3,3-ジ(トリフルオロメチル)パーフルオキセタン、2-クロロメチルオキセタン、3,3-ビス(クロロメチル)オキセタン、ビフェニル型オキセタン、OXT-101(東亞合成(株)製品)、OXT-121(東亞合成(株)製品)等が挙げられる。これらのオキセタン樹脂は、単独で用いても、2種以上を併用してもよい。
ベンゾオキサジン化合物としては、1分子中に2個以上のジヒドロベンゾオキサジン環を有する化合物であれば特に限定されず、例えば、ビスフェノールA型ベンゾオキサジンBA-BXZ(小西化学(株)製品)、ビスフェノールF型ベンゾオキサジンBF-BXZ(小西化学(株)製品)、ビスフェノールS型ベンゾオキサジンBS-BXZ(小西化学(株)製品)等が挙げられる。これらのベンゾオキサジン化合物は、単独で用いても、2種以上を併用してもよい。
本実施形態に係る樹脂組成物は、耐燃性のさらなる向上のため、上述したリン系難燃剤(C)以外の難燃剤を含んでいてもよい。そのような難燃剤としては、公知のものが使用でき、例えば、臭素化エポキシ樹脂、臭素化ポリカーボネート、臭素化ポリスチレン、臭素化スチレン、臭素化フタルイミド、テトラブロモビスフェノールA、ペンタブロモベンジル(メタ)アクリレート、ペンタブロモトルエン、トリブロモフェノール、ヘキサブロモベンゼン、デカブロモジフェニルエーテル、ビス-1,2-ペンタブロモフェニルエタン、塩素化ポリスチレン、塩素化パラフィン等のハロゲン系難燃剤、水酸化アルミニウム、水酸化マグネシウム、部分ベーマイト、ベーマイト、ほう酸亜鉛、三酸化アンチモン等の無機系難燃剤、シリコーンゴム、シリコーンレジン等のシリコーン系難燃剤が挙げられる。これらの難燃剤は単独で用いても、2種以上を併用してもよい。
難燃剤は、1種のみ用いてもよいし、2種以上用いてもよい。2種以上用いる場合、合計量が上記範囲となることが好ましい。
本実施形態に係る樹脂組成物は、硬化速度を適宜調節するための硬化促進剤を含有してもよい。硬化促進剤としては、マレイミド化合物、シアン酸エステル化合物、エポキシ化合物などの硬化促進剤として通常用いられているものが挙げられ、有機金属塩類(例えば、オクチル酸亜鉛、ナフテン酸亜鉛、ナフテン酸コバルト、ナフテン酸銅、アセチルアセトン鉄、オクチル酸ニッケル、オクチル酸マンガン等)、フェノール化合物(例えば、フェノール、キシレノール、クレゾール、レゾルシン、カテコール、オクチルフェノール、ノニルフェノール等)、アルコール類(例えば、1-ブタノール、2-エチルヘキサノール等)、イミダゾール類(例えば、2-メチルイミダゾール、2-エチル-4-メチルイミダゾール、2-フェニルイミダゾール、1-シアノエチル-2-フェニルイミダゾール、1-シアノエチル-2-エチル-4-メチルイミダゾール、2-フェニル-4,5-ジヒドロキシメチルイミダゾール、2-フェニル-4-メチル-5-ヒドロキシメチルイミダゾール等)、及びこれらのイミダゾール類のカルボン酸若しくはその酸無水類の付加体等の誘導体、アミン類(例えば、ジシアンジアミド、ベンジルジメチルアミン、4-メチル-N,N-ジメチルベンジルアミン等)、リン化合物(例えば、ホスフィン系化合物、ホスフィンオキサイド系化合物、ホスホニウム塩系化合物、ダイホスフィン系化合物等)、エポキシ-イミダゾールアダクト系化合物、過酸化物(例えば、ベンゾイルパーオキサイド、p-クロロベンゾイルパーオキサイド、ジ-t-ブチルパーオキサイド、ジイソプロピルパーオキシカーボネート、ジ-2-エチルヘキシルパーオキシカーボネート等)、アゾ化合物(例えば、アゾビスイソブチロニトリル等)が挙げられる。硬化促進剤は、単独で用いても、2種以上を併用してもよい。
本実施形態に係る樹脂組成物は、有機溶剤を含有してもよい。この場合、本実施形態に係る樹脂組成物は、上述した各種樹脂成分の少なくとも一部、好ましくは全部が有機溶剤に溶解又は相溶した形態(溶液又はワニス)である。有機溶剤としては、上述した各種樹脂成分の少なくとも一部、好ましくは全部を溶解又は相溶可能な極性有機溶剤又は無極性有機溶剤であれば特に限定されず、極性有機溶剤としては、例えば、ケトン類(例えば、アセトン、メチルエチルケトン、メチルイソブチルケトン等)、セロソルブ類(例えば、プロピレングリコールモノメチルエーテル、プロピレングリコールモノメチルエーテルアセテート等)、エステル類(例えば、乳酸エチル、酢酸メチル、酢酸エチル、酢酸ブチル、酢酸イソアミル、乳酸エチル、メトキシプロピオン酸メチル、ヒドロキシイソ酪酸メチル等)アミド類(例えば、ジメトキシアセトアミド、ジメチルホルムアミド類等)が挙げられ、無極性有機溶剤としては、芳香族炭化水素(例えば、トルエン、キシレン等)が挙げられる。これらの有機溶剤は、単独で用いても、2種以上を併用してもよい。
本実施形態に係る樹脂組成物は、常法にしたがって調製することができ、熱硬化性化合物(A)、熱可塑性エラストマー(B)及びリン系難燃剤(C)、及び上述したその他の任意成分を均一に含有する樹脂組成物が得られる方法であれば、その調製方法は特に限定されない。例えば、熱硬化性化合物(A)、熱可塑性エラストマー(B)及びリン系難燃剤(C)、及び上述したその他の任意成分を順次溶剤に配合し、十分に撹拌することで本実施形態に係る樹脂組成物を容易に調製することができる。
本実施形態に係るプリプレグは、基材と、前記基材に含浸又は塗布された樹脂組成物とを含む。ここで、樹脂組成物は、上述した、熱硬化性化合物(A)と、特定量の熱可塑性エラストマー(B)及びリン系難燃剤(C)を含む樹脂組成物である。本実施形態に係るプリプレグは、例えば、本実施形態に係る樹脂組成物を基材に含浸又は塗布させた後、120~220℃で2~15分程度乾燥させる方法等によって半硬化させることにより得られる。この場合、基材に対する樹脂組成物(樹脂組成物の硬化物も含む)の付着量、すなわち半硬化後のプリプレグの総量に対する樹脂組成物量(充填材を含む。)は、20~99質量%の範囲であることが好ましい。
本実施形態に係る樹脂シートは樹脂組成物を含む。ここで、樹脂組成物は、上述した、熱硬化性化合物(A)と、特定量の熱可塑性エラストマー(B)及びリン系難燃剤(C)を含む樹脂組成物である。樹脂シートは、支持体と、前記支持体の表面に配置した本実施形態に係る樹脂組成物から形成された層とを含む支持体付き樹脂シートとしてもよい。樹脂シートは、ビルドアップ用フィルム又はドライフィルムソルダーレジストとして使用することができる。樹脂シートの製造方法としては、特に限定されないが、例えば、上記の本実施形態に係る樹脂組成物を溶剤に溶解させた溶液を支持体に塗布(塗工)し乾燥することで樹脂シートを得る方法が挙げられる。
本実施形態の積層板は、上述したプリプレグ及び樹脂シートからなる群より選ばれる1種以上を含む。プリプレグ及び樹脂シートについて2種以上が積層されている場合、各プリプレグ及び樹脂シートに用いられる樹脂組成物については同一であっても異なっていてもよい。また、プリプレグ及び樹脂シートの両方を用いる場合、それらに用いられる樹脂組成物は同一であっても異なっていてもよい。
本実施形態に係る金属箔張積層板は、少なくとも1枚の上述したプリプレグと、前記プリプレグの片面又は両面に積層された金属箔と、含む。
また、本実施形態に係る金属箔張積層板は、少なくとも1枚の上述した樹脂シートと、前記樹脂シートの片面又は両面に積層された金属箔と、を含んでいてもよい。
さらに、本実施形態に係る金属箔張積層板は、上述した積層板と、前記積層板の片面又は両面に積層された金属箔と、を含んでいてもよい。
本実施形態における金属箔は、特に限定されず、金箔、銀箔、銅箔、錫箔、ニッケル箔、アルミニウム箔等が挙げられるが、中でも、銅箔が好ましい。銅箔としては、一般にプリント配線板用材料に用いられるものであれば特に限定されないが、例えば、圧延銅箔、電解銅箔等の銅箔が挙げられ、中でも、銅箔ピール強度、微細配線の形成性の観点から、電解銅箔が好ましい。銅箔の厚さは、特に限定されず、1.5~70μm程度であってもよい。
ここで、銅箔表面の粗度Rzは、後述する実施例に記載された方法に従って測定することができる。
本実施形態に係るプリント配線板は、絶縁層と、絶縁層の表面に配置された導体層と、を含み、絶縁層が、本実施形態に係る樹脂組成物から形成された層及びプリプレグから形成された層の少なくとも一方を含む。このようなプリント配線板は、常法に従って製造でき、その製造方法は特に限定されないが、例えば、上述した金属箔張積層板を用いて製造できる。以下、プリント配線板の製造方法の一例を示す。まず上述した金属箔張積層板を用意する。次に、金属箔張積層板の表面にエッチング処理を施して内層回路の形成を行い、内層基板を作製する。この内層基板の内層回路表面に、必要に応じて接着強度を高めるための表面処理を行い、次いでその内層回路表面に上述したプリプレグを所要枚数重ね、さらにその外側に外層回路用の金属箔を積層し、加熱加圧して一体成形する。このようにして、内層回路と外層回路用の銅箔との間に、基材及び樹脂組成物の硬化物からなる絶縁層が形成された多層の積層板が製造される。次いで、この多層の積層板にスルーホールやバイアホール用の穴あけ加工を施した後、この穴の壁面に内層回路と外層回路用の金属箔とを導通させるめっき金属皮膜を形成し、さらに外層回路用の金属箔にエッチング処理を施して外層回路を形成することで、プリント配線板が製造される。
本実施形態の半導体装置は、本実施形態のプリント配線板の導通箇所に、半導体チップを実装することにより製造することができる。ここで、導通箇所とは、多層プリント配線板における電気信号を伝える箇所のことであって、その場所は表面であっても、埋め込まれた箇所であってもいずれでも構わない。また、半導体チップは半導体を材料とする電気回路素子であれば特に限定されない。
以下の実施例及び比較例において、各物性の測定及び各評価は以下に従って行った。
実施例又は比較例で用いた銅箔について、JIS B0601:2013に従って、積層したプリプレグに接触する面の粗度Rzを測定した。
実施例又は比較例で得られた銅箔張積層板について、銅箔付きの試験片(30mm×150mm×0.8mm)を作成し、銅箔をエッチングにより除去したサンプルを用いて、JIS C2138:2007に準じて、空洞共振器摂動法により、10GHzにおける誘電正接を測定した。空洞共振器は(株)EMラボ製、ネットワークアナライザーはAgilent製8722ESを使用した。
表中のA、B、Cは以下の通りの基準で評価した。誘電正接は0に近いほど、良好であることを意味する。
A:0.0025未満
B:0.0025以上、0.0030未満
C:0.0030以上、0.0035未満
実施例又は比較例で得られた銅箔張積層板について、銅箔付きの試験片(30mm×150mm×0.8mm)を作成し、JIS C6481:1996に準じて、試験数3で銅箔の引き剥がし強度を測定して、下限値の平均値を測定値とした。
表中のA、B、Cは以下の通りの基準で評価した。
A:0.5kN/m以上
B:0.4kN/m以上、0.5kN/m未満
C:0.4kN/m未満
実施例又は比較例で得られた銅箔張積層板について、JIS C5016:1994に準じて、銅箔に配線幅1mmの配線パターンを形成した試験片(15mm×130mm×0.1mm)を用い、試料の導体パターンの端子部に絶縁被覆した電線を取り付け,プランジャーに基板の上端部を固定、下端部に荷重1kgfを設置した後、通電状態のまま、角度135°、速度175cpmにて、両方向に屈曲を開始し、断線に至るまでの往復屈曲回数を測定した。表中のA、B、C、Dは以下の通りの基準で評価した。
A:90回以上
B:60回以上90回未満
C:40回以上60回未満
D:40回未満
実施例又は比較例で得られた銅箔張積層板について、JIS C5012:1992に準じて、銅箔付きの試験片(50mm×50mm×0.8mm)を作成し、288℃に加熱した半田が入った槽に、30分間試験片を浮かせた後に、銅箔張積層板にデラミネーションなどの異常がないか、目視で確認した。表中のA、Bは以下の通りの基準で評価した。
A:30分間デラミネーションなし
B:30分間以内でデラミネーション発生
α-ナフトールアラルキル樹脂(SN495V、OH基当量:236g/eq.、新日鐵化学(株)製)300g(OH基換算1.28mol)及びトリエチルアミン194.6g(1.92mol)(ヒドロキシ基1molに対して1.5mol)をジクロロメタン1800gに溶解させ、これを溶液1とした。
実施例又は比較例の樹脂組成物に含まれる各成分として、以下のものを用いた。
マレイミド樹脂:MIR-3000、日本化薬(株)製
ポリフェニレンエーテル樹脂:OPE-2St2200、三菱ガス化学(株)製、数平均分子量2200、ビニル基当量:1100g/eq.
熱可塑性エラストマー:水添スチレン系熱可塑性エラストマー(SEBS)、タフテックH-1043、旭化成(株)製
リン系難燃剤1:1,3-フェニレンビス(2,6-ジ-キシレニルホスフェート)、PX-200、大八化学工業(株)製
リン系難燃剤2:環状オルガノホスファゼン化合物、ラビトルFP-300B、伏見製薬所(株)製
充填材:球状シリカ、SC2050-MB、(株)アドマテックス製、平均粒子径0.5μm
実施例又は比較例で用いた銅箔を以下に示す。粗度Rzは、上述した方法で測定した、実施例又は比較例において積層したプリプレグと接触する面の粗度Rzである。実施例又は比較例においては、測定した粗度の面が積層したプリプレグの表面と接触するように配置して、銅箔張積層板を得ている。
銅箔:TQ-M5-VSP(三井金属鉱業(株)製)、電解銅箔、Rz=0.7μm、厚さ12μm
マレイミド樹脂MIR-3000を65質量部、熱可塑性エラストマーH-1043(スチレン比率67%)を15質量部、リン系難燃剤PX-200を20質量部、充填材SC2050-MBを100質量部、を、エチルメチルケトンを用いて混合・希釈してワニスを作成し、得られたワニスを厚さ0.075mmのガラス織布に含浸塗工し、160℃で5分間加熱乾燥して、樹脂組成物含有量60質量%のプリプレグを得た。得られたプリプレグを8枚重ねて上記に示した銅箔を上下に配置し、圧力30kgf/cm2、温度220℃で120分間の積層成型を行い、絶縁層厚さ0.8mmの銅箔張積層板を得た。
ポリフェニレンエーテル樹脂OPE-2St2200を65質量部、熱可塑性エラストマーH-1043(スチレン比率67%)を15質量部、リン系難燃剤PX-200を20質量部、充填材SC2050-MBを100質量部、を、エチルメチルケトンを用いて混合・希釈してワニスを作成し、得られたワニスを厚さ0.075mmのガラス織布に含浸塗工し、160℃で5分間加熱乾燥して、樹脂組成物含有量60質量%のプリプレグを得た。得られたプリプレグを8枚重ねて上記に示した銅箔を上下に配置し、圧力30kgf/cm2、温度220℃で120分間の積層成型を行い、絶縁層厚さ0.8mmの銅箔張積層板を得た。
ポリフェニレンエーテル樹脂OPE-2St2200を75質量部、熱可塑性エラストマーH-1043(スチレン比率67%)を5質量部、リン系難燃剤PX-200を20質量部、充填材SC2050-MBを100質量部、を、エチルメチルケトンを用いて混合・希釈してワニスを作成し、得られたワニスを厚さ0.075mmのガラス織布に含浸塗工し、160℃で5分間加熱乾燥して、樹脂組成物含有量60質量%のプリプレグを得た。得られたプリプレグを8枚重ねて上記に示した銅箔を上下に配置し、圧力30kgf/cm2、温度220℃で120分間の積層成型を行い、絶縁層厚さ0.8mmの銅箔張積層板を得た。
マレイミド樹脂MIR-3000を35質量部、ポリフェニレンエーテル樹脂OPE-2St2200を20質量部、SNCNを10質量部、熱可塑性エラストマーH-1043(スチレン比率67%)を15質量部、リン系難燃剤PX-200を20質量部、充填材SC2050-MBを100質量部、を、エチルメチルケトンを用いて混合・希釈してワニスを作成し、得られたワニスを厚さ0.075mmのガラス織布に含浸塗工し、160℃で5分間加熱乾燥して、樹脂組成物含有量60質量%のプリプレグを得た。得られたプリプレグを8枚重ねて上記に示した銅箔を上下に配置し、圧力30kgf/cm2、温度220℃で120分間の積層成型を行い、絶縁層厚さ0.8mmの銅箔張積層板を得た。
マレイミド樹脂MIR-3000を35質量部、ポリフェニレンエーテル樹脂OPE-2St2200を20質量部、SNCNを10質量部、熱可塑性エラストマーH-1043(スチレン比率67%)を15質量部、リン系難燃剤ラビトルFP-300Bを20質量部、充填材SC2050-MBを100質量部、を、エチルメチルケトンを用いて混合・希釈してワニスを作成し、得られたワニスを厚さ0.075mmのガラス織布に含浸塗工し、160℃で5分間加熱乾燥して、樹脂組成物含有量60質量%のプリプレグを得た。得られたプリプレグを8枚重ねて上記に示した銅箔を上下に配置し、圧力30kgf/cm2、温度220℃で120分間の積層成型を行い、絶縁層厚さ0.8mmの銅箔張積層板を得た。
マレイミド樹脂MIR-3000を81質量部、熱可塑性エラストマーH-1043(スチレン比率67%)を19質量部、充填材SC2050-MBを100質量部、を、エチルメチルケトンを用いて混合・希釈してワニスを作成し、得られたワニスを厚さ0.075mmのガラス織布に含浸塗工し、160℃で5分間加熱乾燥して、樹脂組成物含有量60質量%のプリプレグを得た。得られたプリプレグを8枚重ねて上記に示した銅箔を上下に配置し、圧力30kgf/cm2、温度220℃で120分間の積層成型を行い、絶縁層厚さ0.8mmの銅箔張積層板を得た。
ポリフェニレンエーテル樹脂OPE-2St2200を81質量部、熱可塑性エラストマーH-1043(スチレン比率67%)を19質量部、充填材SC2050-MBを100質量部、を、エチルメチルケトンを用いて混合・希釈してワニスを作成し、得られたワニスを厚さ0.075mmのガラス織布に含浸塗工し、160℃で5分間加熱乾燥して、樹脂組成物含有量60質量%のプリプレグを得た。得られたプリプレグを8枚重ねて上記に示した銅箔を上下に配置し、圧力30kgf/cm2、温度220℃で120分間の積層成型を行い、絶縁層厚さ0.8mmの銅箔張積層板を得た。
ポリフェニレンエーテル樹脂OPE-2St2200を94質量部、熱可塑性エラストマーH-1043(スチレン比率67%)を6質量部、充填材SC2050-MBを100質量部、を、エチルメチルケトンを用いて混合・希釈してワニスを作成し、得られたワニスを厚さ0.075mmのガラス織布に含浸塗工し、160℃で5分間加熱乾燥して、樹脂組成物含有量60質量%のプリプレグを得た。得られたプリプレグを8枚重ねて上記に示した銅箔を上下に配置し、圧力30kgf/cm2、温度220℃で120分間の積層成型を行い、絶縁層厚さ0.8mmの銅箔張積層板を得た。
マレイミド樹脂MIR-3000を44質量部、ポリフェニレンエーテル樹脂OPE-2St2200を25質量部、SNCNを13質量部、熱可塑性エラストマーH-1043(スチレン比率67%)を19質量部、充填材SC2050-MBを100質量部、を、エチルメチルケトンを用いて混合・希釈してワニスを作成し、得られたワニスを厚さ0.075mmのガラス織布に含浸塗工し、160℃で5分間加熱乾燥して、樹脂組成物含有量60質量%のプリプレグを得た。得られたプリプレグを8枚重ねて上記に示した銅箔を上下に配置し、圧力30kgf/cm2、温度220℃で120分間の積層成型を行い、絶縁層厚さ0.8mmの銅箔張積層板を得た。
マレイミド樹脂MIR-3000を26質量部、ポリフェニレンエーテル樹脂OPE-2St2200を15質量部、SNCNを8質量部、熱可塑性エラストマーH-1043(スチレン比率67%)を11質量部、リン系難燃剤PX-200を40質量部、充填材SC2050-MBを100質量部、を、エチルメチルケトンを用いて混合・希釈してワニスを作成し、得られたワニスを厚さ0.075mmのガラス織布に含浸塗工し、160℃で5分間加熱乾燥して、樹脂組成物含有量60質量%のプリプレグを得た。得られたプリプレグを8枚重ねて上記に示した銅箔を上下に配置し、圧力30kgf/cm2、温度220℃で120分間の積層成型を行い、絶縁層厚さ0.8mmの銅箔張積層板を得た。
マレイミド樹脂MIR-3000を26質量部、ポリフェニレンエーテル樹脂OPE-2St2200を15質量部、SNCNを8質量部、熱可塑性エラストマーH-1043(スチレン比率67%)を11質量部、リン系難燃剤ラビトルFP-300Bを40質量部、充填材SC2050-MBを100質量部、を、エチルメチルケトンを用いて混合・希釈してワニスを作成し、得られたワニスを厚さ0.075mmのガラス織布に含浸塗工し、160℃で5分間加熱乾燥して、樹脂組成物含有量60質量%のプリプレグを得た。得られたプリプレグを8枚重ねて上記に示した銅箔を上下に配置し、圧力30kgf/cm2、温度220℃で120分間の積層成型を行い、絶縁層厚さ0.8mmの銅箔張積層板を得た。
マレイミド樹脂MIR-3000を10質量部、ポリフェニレンエーテル樹脂OPE-2St2200を20質量部、SNCNを10質量部、熱可塑性エラストマーH-1043(スチレン比率67%)を40質量部、リン系難燃剤PX-200を20質量部、充填材SC2050-MBを100質量部、を、エチルメチルケトンを用いて混合・希釈してワニスを作成し、得られたワニスを厚さ0.075mmのガラス織布に含浸塗工し、160℃で5分間加熱乾燥して、樹脂組成物含有量60質量%のプリプレグを得た。得られたプリプレグを8枚重ねて上記に示した銅箔を上下に配置し、圧力30kgf/cm2、温度220℃で120分間の積層成型を行い、絶縁層厚さ0.8mmの銅箔張積層板を得た。
マレイミド樹脂MIR-3000を50質量部、ポリフェニレンエーテル樹脂OPE-2St2200を20質量部、SNCNを10質量部、リン系難燃剤PX-200を20質量部、充填材SC2050-MBを100質量部、を、エチルメチルケトンを用いて混合・希釈してワニスを作成し、得られたワニスを厚さ0.075mmのガラス織布に含浸塗工し、160℃で5分間加熱乾燥して、樹脂組成物含有量60質量%のプリプレグを得た。得られたプリプレグを8枚重ねて上記に示した銅箔を上下に配置し、圧力30kgf/cm2、温度220℃で120分間の積層成型を行い、絶縁層厚さ0.8mmの銅箔張積層板を得た。
Claims (17)
- 熱硬化性化合物(A)、熱可塑性エラストマー(B)、及びリン系難燃剤(C)を含む樹脂組成物であって、
前記樹脂組成物中の前記熱可塑性エラストマー(B)の含有量が、樹脂固形分100質量部に対して1~30質量部であり、
前記樹脂組成物中の前記リン系難燃剤(C)の含有量が、樹脂固形分100質量部に対して1~30質量部である、樹脂組成物。 - 前記樹脂組成物中の前記リン系難燃剤(C)の含有量が、樹脂固形分100質量部に対して15~30質量部である、請求項1に記載の樹脂組成物。
- 前記リン系難燃剤(C)が、芳香族縮合リン酸エステル(C-1)及び環状ホスファゼン化合物(C-2)からなる群より選択される1種以上である、請求項1または2に記載の樹脂組成物。
- 前記熱可塑性エラストマー(B)は、スチレン系エラストマーである、請求項1~4のいずれか一項に記載の樹脂組成物。
- 前記スチレン系エラストマーは、スチレン-ブタジエン-スチレンブロック共重合体、スチレン-イソプレン-スチレンブロック共重合体、スチレン-水添ブタジエン-スチレンブロック共重合体、およびスチレン-水添イソプレン-スチレンブロック共重合体からなる群より選ばれる1種以上である、請求項5に記載の樹脂組成物。
- 前記熱硬化性化合物(A)は、シアン酸エステル化合物、マレイミド化合物、ポリフェニレンエーテル化合物、エポキシ化合物、フェノール化合物、および硬化性ポリイミド化合物からなる群より選ばれる1種以上を含む、請求項1~6のいずれか一項に記載の樹脂組成物。
- 前記樹脂組成物が充填材をさらに含有する、請求項1~7のいずれか一項に記載の樹脂組成物。
- 前記充填材は、シリカ類、水酸化アルミニウム、窒化アルミニウム、窒化ホウ素、及びフォルステライトからなる群より選択される1種以上である、請求項8に記載の樹脂組成物。
- 前記樹脂組成物中の前記充填材の含有量が、樹脂固形分100質量部に対して30~300質量部である、請求項8又は9に記載の樹脂組成物。
- 基材と、前記基材に含浸又は塗布された請求項1~10のいずれか一項に記載の樹脂組成物と、を含むプリプレグ。
- 請求項1~10のいずれか一項に記載の樹脂組成物を含む、樹脂シート。
- 請求項11記載のプリプレグ及び請求項12記載の樹脂シートからなる群より選ばれる1種以上を含む、積層板。
- 少なくとも1枚の請求項11記載のプリプレグと、前記プリプレグの片面又は両面に積層された金属箔と、を含む金属箔張積層板。
- 少なくとも1枚の請求項12記載の樹脂シートと、前記樹脂シートの片面又は両面に積層された金属箔と、を含む金属箔張積層板。
- 絶縁層と、前記絶縁層の表面に配置された導体層と、を含むプリント配線板であって、
前記絶縁層が、請求項1~10のいずれか一項に記載の樹脂組成物から形成された層及び請求項11記載のプリプレグから形成された層の少なくとも一方を含む、プリント配線板。 - 請求項16に記載のプリント配線板を用いて製造された半導体装置。
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US20180208765A1 (en) * | 2017-01-20 | 2018-07-26 | Taiwan Union Technology Corporation | Resin Composition, and Prepreg, Metal-Clad Laminate, and Printed Circuit Board Using the Same |
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