JPH0128674Y2 - - Google Patents
Info
- Publication number
- JPH0128674Y2 JPH0128674Y2 JP771686U JP771686U JPH0128674Y2 JP H0128674 Y2 JPH0128674 Y2 JP H0128674Y2 JP 771686 U JP771686 U JP 771686U JP 771686 U JP771686 U JP 771686U JP H0128674 Y2 JPH0128674 Y2 JP H0128674Y2
- Authority
- JP
- Japan
- Prior art keywords
- section
- tank
- semiconductor
- heater
- sulfuric acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 30
- 239000007788 liquid Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 19
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 239000002699 waste material Substances 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 56
- 238000001816 cooling Methods 0.000 description 9
- 238000004090 dissolution Methods 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910001120 nichrome Inorganic materials 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Weting (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP771686U JPH0128674Y2 (enrdf_load_stackoverflow) | 1986-01-24 | 1986-01-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP771686U JPH0128674Y2 (enrdf_load_stackoverflow) | 1986-01-24 | 1986-01-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62120345U JPS62120345U (enrdf_load_stackoverflow) | 1987-07-30 |
| JPH0128674Y2 true JPH0128674Y2 (enrdf_load_stackoverflow) | 1989-08-31 |
Family
ID=30791426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP771686U Expired JPH0128674Y2 (enrdf_load_stackoverflow) | 1986-01-24 | 1986-01-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0128674Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6278677B2 (ja) * | 2013-12-03 | 2018-02-14 | 日本サイエンティフィック株式会社 | プラスチックモールドされた半導体集積回路パッケージの開封装置及びプラスチックモールドされた半導体集積回路パッケージの開封方法 |
-
1986
- 1986-01-24 JP JP771686U patent/JPH0128674Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62120345U (enrdf_load_stackoverflow) | 1987-07-30 |
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