JPH0128674Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] This invention relates to a semiconductor opener device that exposes a semiconductor chip sealed in plastic so that it can be used for inspection during failure analysis or quality check. It is something.

[Prior Art] Conventionally, sulfuric acid is generally used as a solution for dissolving semiconductor packages, and the sulfuric acid is heated to about 290° C. in order to dissolve efficiently.

For this reason, the semiconductor opening process section is provided with an electromagnetic control valve that releases steam generated during heating into the atmosphere.

[Problems to be solved by the invention] In such an apparatus, the hot sulfuric acid in the semiconductor opening process section is discharged once the work is completed and replaced with fresh sulfuric acid. At this time, the new sulfuric acid was heated to about 290°C, but raising the temperature from room temperature to about 290°C took a long time and was not desirable from an efficiency standpoint.

Therefore, this idea was developed to remove the sulfuric acid from the standby state by approximately
The object of the present invention is to provide a semiconductor opener device that can control the temperature up to 250 degrees Celsius and can easily process the steam generated during standby.

[Means for Solving the Problems] In order to achieve the above-mentioned object, this invention includes a storage tank portion for securing a predetermined amount of liquid for dissolution, and a storage tank portion communicating with the tank portion and supplying steam. a semiconductor opening process section that has a control valve that releases it into the atmosphere and sprays a dissolving liquid onto a semiconductor package; a discharge means that discharges the liquid that has finished its work in the semiconductor opening process section; In an opener device equipped with a drain liquid storage tank section for temporarily storing discharged drain liquid, a preheating heater section is provided which communicates with the semiconductor opening process section and raises the melting liquid to a predetermined temperature. A bypass passage is provided in the heater tank to allow vapor in the heater tank to escape to the semiconductor opening process section side.

[Operation] In the semiconductor opening process section, steam is discharged from the control valve. Meanwhile, hot sulfuric acid is injected onto the semiconductor package, and the injection is continued until the chip is exposed. At this time, the sulfuric acid in the standby state is heated to a predetermined temperature by the preheater section. The steam generated in the preheater section during heating flows through the bypass passage toward the semiconductor opening process section, and escapes into the atmosphere together with the steam generated from the process section.

[Example] Hereinafter, an example of this invention will be described in detail based on the accompanying drawings.

The drawing shows a schematic diagram of the entire device, which includes a storage tank section 1, a preheater section 3, a semiconductor opening process section 5, a waste liquid cooling section 7, and a waste liquid storage tank section 9. These are housed in a main body case (not shown).

The main body 11 of the tank 7 of the storage tank section 1 is made of an acid-resistant synthetic resin material, and a first electromagnetic valve 13 that is normally closed is provided at the top. Further, the tank body 11 communicates with a heater tank 17 of the preheating heater section 3 via a second solenoid valve 15 which is normally closed, and the heater tank 17 is arranged at a lower position than the tank body 11. As a result, the tank body 11
The sulfuric acid inside is fed into the heater tank 17 by a drop.

The heater tank 11 communicates with the semiconductor opening process section 5 via a liquid feeding pipe 18. Liquid sending pipe 1
A bypass passage 19 extending from the heater tank 17 is connected to the heater tank 8 , so that the steam in the heater tank 17 escapes to the liquid sending pipe 18 via the bypass passage 19 .

Further, the heater tank 17 is provided with a heat source section 21 such as a nichrome wire, in which the temperature of sulfuric acid in the heater tank 17 is controlled at approximately 250° C. by a temperature sensor _S1 .

The first and second solenoid valves 13 and 15 are the heater tank 1
It is controlled to open and close freely by a liquid level sensor 23 provided in heater tank 17 that detects the presence or absence of sulfuric acid, and opens when sensor 23 detects on the liquid level that the sulfuric acid in heater tank 17 is empty. . As a result, the tank body 11 is opened to the atmosphere, while the sulfuric acid in the tank body 11 flows into the heater tank 17 by a drop.

The air pump 25 is driven by a desired driving means, and a normally closed third air pump is provided on the discharge side of the pump 25.
A solenoid valve 27 and a fourth solenoid valve 29 are provided in series with the solenoid valve 27 . The fourth solenoid valve 29 is a three-way valve having ports P, _P1 , and _P2 .
_P1 communicates with the heater tank 17, port _P2 communicates with the semiconductor opening process section 5, and the third solenoid valve 2
Port P communicating with port P 7 communicates with port P ₂ which is normally open.

The third solenoid valve 27 is opened by a signal from a start switch (not shown) and the liquid level sensor 23, and at the same time port _P1 of the fourth solenoid valve 29 is opened by a signal from the liquid level sensor 23.
It communicates with

Further, the third solenoid valve 27 is connected to an electrode sensor 4 which will be described later.
It is controlled to open by a command signal from 3. The temperature sensor _S1 has a function of suppressing the output of a start command signal even if the start switch is operated when the temperature of the sulfuric acid is about 250°C or lower.

On the other hand, the heater tank 17 and the liquid sending pipe 18
The semiconductor opening process section 5 communicates with a workbench 33 on which a DIP type semiconductor 31 is set, a dissolution tank 35 disposed below the workbench 33, and a package 31a of the semiconductor 31 in which sulfuric acid is injected. The dissolving tank 35 is connected to a workbench 33.
The workbench 33 is exposed from the main body case (not shown).

The sulfuric acid in the dissolution tank 35 is forcibly sent to the drain cooling unit 7 side by the air pressure acting inside the dissolution tank 35. A liquid level sensor 3 is installed in the dissolution tank 35.
9, a temperature sensor 41, and the electrode sensor 43 are provided, respectively. The liquid level sensor 39 is connected to the dissolving tank 3
Detects the presence or absence of sulfuric acid in 5.

The temperature sensor 41 has the function of controlling the heat source section 45 such as nichrome wire to maintain the temperature of the sulfuric acid in the dissolution tank 35 at around 290°C, and turns on the pump 37 when it detects that the temperature has reached about 290°C. do. Further, the electrode sensor 43 detects the current flowing through the sulfuric acid when the package 31a is opened and the internal chip is exposed. Then, a timer activated after the detection stops driving the pump 37 after a certain period of time has elapsed, while opening the third solenoid valve 27 and closing the fifth solenoid valve 47, which will be described later. Note that the electrode sensor 43 and the chip terminal of the semiconductor 31 are
It is designed to be electrically connected to a holder (not shown) that holds it, and an electric circuit is formed via sulfuric acid.

The melting tank 35 is provided with a trap 49 that returns the condensate to the melting tank 35 when the steam condenses, and the trap 49 leads to a normally open fifth solenoid valve 47 that releases the steam to the atmosphere. .

The drained liquid cooling section 7 consists of a cooling trap 51 that communicates with the dissolving tank 35 and a cooling fan 53 that blows cooling air to the trap 51. The cooling fan 53 cools the drained liquid in the trap 51 to about 100°C. until it cools down.

The drain liquid storage tank section 9 communicates with the cooling trap 51 and is made of a synthetic resin material whose inner surface is treated with fluororesin (Teflon). When you touch it, an electric current flows through the drain, letting you know when it's full. As a result, even if the start switch is turned on, the function remains in a stopped state.

In addition, the full tank part 55 can be detached from the bellows 57 and can be replaced with a new tank part.

In the opener device configured in this way,
The semiconductor 31 is set on the workbench 33 and the start switch is turned on. As a result, the tank body 11
The sulfuric acid inside is sent into the heater tank 17 when the first and second solenoid valves 13 and 15 are opened. The sulfuric acid in the heater tank 17 is heated to about 250° C. by the heat source section 21. At this time, the generated steam escapes from the bypass passage 19 to the liquid sending pipe 18. On the other hand, when the sulfuric acid reaches about 250° C., the third solenoid valve 27 opens, and the port P ₁ of the fourth solenoid valve 29 communicates with the port P, so that air pressure acts on the heater tank 17 . As a result, the hot sulfuric acid in the heater tank 17 is sent into the dissolution tank 35.

The hot sulfuric acid in the dissolution tank 35 is heated by the heat source 45 to approximately
Raised to 290℃. The steam generated at this time escapes into the atmosphere through the electromagnetic valve 47 together with the steam sent from the bypass passage 19. When the temperature sensor 41 detects that the temperature has reached approximately 290°C, the pump 37 is turned on and hot sulfuric acid is injected into the package 31a. Thereafter, the injection is continued until the package 31a is dissolved and the chip is exposed. When the chip is exposed, the electrode sensor 43 detects the current flowing through the sulfuric acid, and after a certain period of time after detection, the pump 37 is stopped and the third solenoid valve 27
Let's open. As a result, air pressure acts on the inside of the melting tank 35, and the melt is sent to the cooling trap 51, where it is cooled to about 100° C. and then discharged to the tank section 55.

Thereafter, the semiconductor 31 is reset and the start switch is turned on to enter the step of opening the package 31a. At this time, the sulfuric acid in the heater tank 17 is approximately 250
℃, the target temperature can be quickly raised to about 290℃ in the dissolution tank 35, and the work can be carried out efficiently.

[Effects of the invention] As explained above, according to the opener device of this invention, the melting liquid in the standby state can be raised to a predetermined temperature in advance by the preheating heater section, so that The heating time to reach the target temperature is greatly shortened, improving work efficiency. Further, the steam generated in the heater section can be released into the atmosphere by simply providing a bypass passage, and the structure can be simplified.

[Brief explanation of the drawing]

The attached drawing is a schematic explanatory diagram of the entire opener device implementing this invention. Explanation of main drawing symbols, 1...Storage tank, 3
... Preheating heater section, 5 ... Semiconductor opening process section, 9
... Drainage storage tank section, 17 ... Heater tank,
19... Bypass passage, 25... Pump (discharge means), 31... Semiconductor, 47... Fifth solenoid valve (control valve).

Claims (1)

[Scope of utility model registration request] a storage tank section for securing a predetermined amount of a dissolving liquid; a semiconductor opening process section that communicates with the tank section and has a control valve for releasing vapor into the atmosphere and sprays the dissolving liquid onto a semiconductor package; , an opener device comprising: a discharge means for discharging the waste liquid that has finished work in the semiconductor opening process section; and a waste liquid storage tank section for temporarily storing the waste liquid discharged by the means; A preheating heater section that communicates with the process section and raises the melting liquid to a predetermined temperature is provided, and a bypass passage is provided in the heater tank of the preheating heater section to allow vapor in the heater tank to escape to the semiconductor opening process section side. Characteristic semiconductor opener device.