JPH0416432Y2 - - Google Patents

Description

[Detailed description of the invention] [Field of industrial application] This invention is a semiconductor opener device that exposes a semiconductor chip sealed with plastic and can be used for inspection during failure analysis or quality check. This invention relates to a top cover locking device that covers a semiconductor during operation.

[Prior Art] An opener device for checking a semiconductor sealed in plastic has a structure in which a dissolving solution is sprayed onto a semiconductor package placed on an etch plate to open the package and expose the chip.

[Problems to be Solved by the Invention] As described above, a semiconductor package is opened using a dissolving liquid, and heated hot sulfuric acid is used as the dissolving liquid.

For this reason, during melting, the semiconductor is covered by a top cover to ensure safety, and the top cover is restrained and controlled by a locking device so as not to open during operation.

By the way, semiconductor packages are made of epoxy resin or the like, so when they are opened, they are burned by hot sulfuric acid, resulting in a black and dirty appearance. This stain reacts with acid and becomes stronger over time, and in some cases there was a risk that it would interfere with analysis.

In addition, since corrosion progresses due to acid, after opening,
It is desirable to quickly clean the chips as soon as they are exposed. However, since the upper lid is controlled to be unlocked after the hot sulfuric acid draining process is completed, there is a problem in that it takes a long time to take out the semiconductors.

Therefore, the object of this invention is to provide a top lid locking device for an opener device, which unlocks the top lid when the chip is exposed after opening the semiconductor package, thereby speeding up the removal of the semiconductor.

[Means for Solving the Problems] In order to achieve the above-mentioned object, in this invention, a dissolving solution is injected onto a semiconductor package covered by an upper lid and placed on an etch plate. In an opener device comprising a semiconductor opening for exposing a chip and a detection means for detecting when the semiconductor chip is exposed, the top cover of the semiconductor opening is locked by a locking device, and the locking device is configured to lock the top cover of the semiconductor opening by a locking device. The lock is released by the chip exposure signal.

[Operation] In this device, when the semiconductor package is opened and the chip is exposed, the lock device in the locked state outputs a chip exposure signal, and the lock is released by the signal. For this reason, the time to take out the semiconductor is faster,
Quick cleaning becomes possible. As a result, the analysis will not be hindered.

[Embodiment] Hereinafter, an embodiment of this invention will be described in detail with reference to the drawings of FIGS. 1 to 3.

The drawing shows a schematic diagram of the entire device, which includes a storage tank section 1, a preheater section 3, a semiconductor opening section 5, a waste liquid cooling section 7, and a waste liquid storage tank section 9. These are housed within the fuselage 10.

The tank 7 main body 11 of the storage tank section 1 is made of acid-resistant synthetic resin material, and has a normally closed first tank at the top.
A solenoid valve 13 is provided. Further, the tank body 11 communicates with a heater tank 17 of the preheating heater section 3 via a second solenoid valve 15 which is normally closed, and the heater tank 17 is arranged at a lower position than the tank body 11. Thereby, the sulfuric acid in the tank body 11 is sent into the heater tank 17 by a drop.

The heater tank 17 is connected to an air pump 25 which will be described later.
The sulfuric acid in the tank 17 is forced out by the air pressure from the tank 17. heater tank 1
7 is provided with a heat source section 21 such as a nichrome wire, which controls the sulfuric acid in the tank 17 to about 250.degree. C. by means of a temperature sensor 19.

The first and second solenoid valves 13 and 15 are the heater tank 1
It is controlled to open and close freely by a liquid level sensor 23 provided in the heater tank 17 that detects the presence or absence of sulfuric acid, and opens when the liquid level sensor 23 detects that the sulfuric acid in the heater tank 17 is empty. As a result, the tank body 11 is opened to the atmosphere, while the sulfuric acid inside the tank body flows into the heater tank 17 by a drop.

The air pump 25 is driven by a desired driving means, and a normally closed third air pump is provided on the discharge side of the pump 25.
A solenoid valve 27 and a fourth solenoid valve 29 are provided in series with the solenoid valve 27 . The fourth solenoid valve 29 has a normally closed port _P1 and a normally open port _P2 in addition to the port P communicating with the third solenoid valve 27.
The port _P1 is in communication with the heater tank 17, and the port _P2 is in communication with the semiconductor opening 5.

The third solenoid valve 27 is opened by a signal from a start switch (not shown) and the liquid level sensor 23, and at the same time port _P1 of the fourth solenoid valve 29 is opened by a signal from the liquid level sensor 23.
The normally open fifth solenoid valve 31 is controlled to be closed. The fifth electromagnetic valve 31 is provided in the heater tank 17 to release steam.

The temperature sensor 19 has a function of suppressing the output of a start command signal even if the start switch is operated when the temperature of the sulfuric acid is about 250° C. or lower.

On the other hand, the semiconductor opening 5 includes an etch plate 33 for setting a DIP type semiconductor W, and a dissolution tank 35 disposed below the etch plate 33.
The dissolving tank 35 is in communication with the heater tank 17.

The sulfuric acid in the dissolution tank 35 is forcibly sent to the drain cooling unit 7 side by the air pressure acting inside the dissolution tank 35. A liquid level sensor 3 is installed in the dissolution tank 35.
9, a temperature sensor 41, and an electrode sensor 43, respectively. The liquid level sensor 39 is connected to the dissolving tank 35
Detects the presence or absence of sulfuric acid in the liquid.

The temperature sensor 41 has a function of controlling the heat source section 45 such as a nichrome wire to maintain the temperature of the sulfuric acid in the dissolution tank 35 at around 290°C, and turns on the pump 37 when it detects that the temperature has reached about 290°C. do. Further, the electrode sensor 43 serves as a detection means for detecting the current flowing through the sulfuric acid when the package of the semiconductor W is opened and the internal chip is exposed. It has a function of stopping the driving of the motor and unlocking a locking device 47, which will be described later. Note that the electrode sensor 43 and the chip terminal of the semiconductor W are electrically connected to a holder 49 that holds the semiconductor W, so that an electric circuit is formed via sulfuric acid.

The dissolving tank 35 is provided with a trap 51 that returns the condensed liquid to the dissolving tank 35 when the vapor is condensed.
It continues to a normally open sixth solenoid valve 53 that allows the air to escape.

On the other hand, the body 10 is provided with an upper lid 55 that covers the semiconductor W.

The upper lid 55 is rotatable about a hinge 57, and is provided inside with a press spring 59 that holds the holder 49 when the upper lid 55 is closed. The top lid 55 is locked by a locking device 47.

An operating arm 61 of the locking device 47 is rotatably supported on the body 10 by a pivot 61a. Actuation arm 6
A lock pin 63 connected to the upper end of the upper lid 5
It is detachably inserted into an engagement hole 65 provided in 5. The lower end of the actuating arm 61 is connected to an actuating rod 69 that expands and contracts by a solenoid 67, and when the solenoid 67 is turned off, the lock pin 63 is closed.
is retracted by the action of a spring 68 provided on the pin 63, and is released from the engagement hole 65, resulting in an unlocked state.

Also, when the solenoid 67 is turned on, the lock pin 63
moves forward and engages with the engagement hole 65, resulting in a locked state. The solenoid 67 is turned off by a chip exposure signal from the electrode sensor 43 and turned on by a start switch (not shown).

The drained liquid cooling section 7 consists of a cooling trap 69 that communicates with the dissolving tank 35 and a cooling fan 71 that blows cooling air to the trap 69. The cooling fan 71 cools the drained liquid in the trap 69 to about 100°C. It will be cooled down to.

The drained liquid storage tank section 9 communicates with the cooling trap 69 and is made of a synthetic resin material such as fluororesin (Teflon), and drains when a pair of liquid level sensors 75 provided on the tank body 73 touch the liquid surface. A current flows through it, allowing you to know when it's full. As a result, even if the start switch is turned on, the function remains in a stopped state.

In addition, when the tank body 73 is full, the bellows 75
It can be detached and replaced with a new tank body.

In the opener device configured as described above, after the semiconductor W is set on the etching plate 33, the upper lid 55 is closed and the start switch is turned on. As a result, the sulfuric acid in the tank body 11 is released from the heater tank 1 by opening the first and second solenoid valves 13 and 15.
Sent into 7. The sulfuric acid in the heater tank 17 is heated to about 250° C. by the heat source 21. When the sulfuric acid reaches approximately 250℃, the third solenoid valve 27
is open, port P ₁ of the fourth solenoid valve 29 communicates with port P, and air pressure acts on the heater tank 17 . As a result, the hot sulfuric acid in the heater tank 17 is transferred to the melting tank 3.
Sent into 5.

The hot sulfuric acid in the dissolution tank 35 is heated by the heat source 45 to approximately
Raised to 290℃. When the temperature sensor 41 detects that the temperature has reached approximately 290°C, the pump 37 is turned on and hot sulfuric acid is injected into the semiconductor W package. Thereafter, the injection continues until the package melts and the chip is exposed. When the chip is exposed, the electrode sensor 43 detects the current flowing through the sulfuric acid, and the sensor 45 is activated. As a result, the pump 37 is stopped after a certain period of time has elapsed after the detection, and a chip exposure signal is passed to the solenoid 67, so that the solenoid 67 is turned off. As a result, the locking device 47 becomes unlocked, so that the upper lid 55 can be opened and the semiconductor W can be removed and quickly cleaned.

Next, after placing and setting a new semiconductor W on the etching plate 33, the top cover 55 is closed and the lock pin 6 is closed.
3 is in a locked state in which it engages with the engagement hole 65.
Next, turn on the start switch (not shown). As a result, air pressure from the air pump 25 acts within the dissolution tank 35, and the drained liquid that has finished its work is sent to the cooling trap 69. At the same time, preheating heater section 3
fresh sulfuric acid is pumped in, then pump 3
By the operation 7, the above-described semiconductor unsealing operation is repeated.

[Effect of the invention] As explained above, according to the top cover locking device of the opener device of this invention, when the semiconductor is opened and the chip is exposed, the locking device can be unlocked by the chip exposure signal from the detection means. Therefore, after opening the package, the semiconductor can be quickly taken out and then quickly cleaned. Therefore, contamination such as burn-in is minimized and accurate analysis results can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway side view of the opener device of this invention, FIG. 2 is a plan view of the same, and FIG. 3 is a schematic explanatory diagram showing the overall connected state. Explanation of main drawing symbols, 5...Semiconductor opening,
33...etch plate, 43...detection means (electrode sensor), 47...lock device.

Claims (1)

[Scope of utility model registration request] An opener equipped with a semiconductor opening that is covered by an upper lid and that injects a solution into a semiconductor package set on an etch plate to expose the chip, and a detection means that detects when the semiconductor chip is exposed. A top lid locking device for an opener device, wherein the top lid of the semiconductor opening is locked by a locking device, and the locking device is unlocked by a chip exposure signal from the detection means.