KR950009614Y1 - Auto decap device - Google Patents

Abstract

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Description

Auto Decap Device

1 is a perspective view of an automatic decap device according to the present invention.

2 is an internal structure diagram of an automatic decap apparatus according to the present invention.

3 is a detailed structural diagram of a drill part, (b) a detailed structural diagram of a corrosion part, and (c) a detailed structural diagram of a washing part.

4 is a perspective view of a decapsulated semiconductor device.

* Explanation of symbols for main parts of the drawings

1: body 2: key part

3: switch 3a: enter switch

3b: step switch 3c: stop switch

4: window 5: drill part

5a: loading bar 5b: drill

5c: Height of moving bar to be raised 6: Corrosion part

6a: cylinder 6b: hood

7: washing part 7a: water tank

7b: water 8: drying part

8a: blower inlet 9: unloading unit

9a: unloading bar 10: rail

11: Chuck 12: Moving Bar

13: semiconductor device

The present invention relates to an automatic decap device of a semiconductor device (IC), and more particularly to an automatic decap device that is suitable for the 'failure analysis' of a defective device in the final inspection.

In the related art, a series of operations for decaping a chip in a packaged semiconductor device to remove chips from the upper end of the package, that is, drilling a semiconductor device and chemically treating chemicals There is a problem that it is harmful to the human body and has a high risk because it takes a lot of time because the work of corroding and washing with water and drying by manual process is used manually, especially chemicals, which are chemicals, are exposed to the air.

In addition, there was a problem that the operator can not perform the precise decap of the desired degree as manual.

Magnification of the present invention is devised to solve such a conventional problem, described in detail according to the embodiment shown in the accompanying drawings as follows.

Figure 1 is a perspective view of the device according to the present invention, Figure 2 is an internal structural view, Figure 3 (a) (b) (c) shows a detailed structure of the drill, corrosion and washing, respectively, Figure 4 It is a perspective view of the semiconductor device which completed the decap.

As shown in the figure, keys (2) and switches (3) for controlling all functions are provided at the front part of the main body (1), and the drill part (5) at the rear thereof. The corrosion part 6, the washing | cleaning part 7, the drying part 8, and the unloading part 9 are provided.

The switches 3 consist of an Enter key 3a, a Step key 3b and a Stop key 3c.

In addition, each part is provided with a window (4) to observe the progress of the work, and to stop the work is to open the window (4) of each part to take out the semiconductor element.

The drill part (5). The rail 10 is provided in the bottom of the corrosion part 6, the washing | cleaning part 7, the drying part 8, and the unloading part 9. As shown in FIG. In the drill part 5, a loading bar 5a connected to the start end of the rail 10 is mounted, and a drill 5b for drilling the semiconductor element 13 is installed.

The corrosion part 6 is mounted with a cylinder 6a for injecting chemicals, and a hood 6b for collecting the corrosive gas generated during the chemical corrosion process is mounted thereon.

The washing section 7 is formed with a water tank (7a) of the depth that the rail 10 can be submerged, the bushing element (13) is carried along the rail (10) by putting water in the water tank (7a) It is to be washed in the process of becoming.

The drying unit 8 is provided with a blower inlet 8a connected to a blower (not shown) to dry the element 13 which is cleaned by blowing air.

The unloading part 9 is provided with an unloading bar 9a connected to the final end of the rail 10 so that the decapsulated element 13 is pulled out through drilling, corrosion, washing and drying.

The element 13 is moved and lifted along the loading bar 5a, the rail 10 and the unloading bar 9a by the element transfer means.

The device transfer means is moved along the loading bar 5a, the rail 10, and the unloading bar 9a, and is provided to be movable up and down, and is coupled to the moving bar 12 to support the device. It consists of a chuck 11.

Here, the moving bar 12 is moved and lifted by the controller. For the lifting operation, a solenoid or a hydraulic or pneumatic cylinder or a linear lifting mechanism may be used as long as it is a means capable of linear movement in general.

Referring to the operation of the automatic dishing device of the present invention configured as described above, as shown in FIG. 2, the semiconductor element 13 to be decapsulated is inserted into the chuck 11 and placed on the loading bar 5a. According to the movement of the moving bar 12 controlled by the chuck 11 is moved to the drill working position of the drill unit 5 along the rail 10 and closes the window 4 after it is moved.

In this state, the depth to which the element l3 is to be drilled is input by the key 2, and then the enter switch 3a is pressed to the extent to which the chuck 11 will be raised up to the moving bar 12. ), The height 5c is determined.

When the drilling depth is determined and the step switch 3b is pressed, the drill 5b starts to rotate and the element 13 supported by the chuck 11 is drilled by the height as the chuck 11 rises.

When the element 13 is finished drilling by the depth input by the key 2, the rotation of the reel 5b is stopped.

When the next step switch 3b is pressed, the socket 11 on which the element 13 is supported is stopped by the rail 10 at the center of the corrosion portion 6, that is, the position shown in FIG. At this time, the corrosion solution contained in the cylinder (6a) by the sensor (not shown) drops onto the element 13 by the control of the controller to corrode the element 13, the corrosion gas generated by the corrosion, etc. Is collected by the hood 6b installed thereon and sent to a processing unit (not shown).

In this case, since the surface of the device 13 is ground by the drill 5b, the top surface of the device 13 is rapidly corroded to expose the chip.

When the corrosion is completed, the chuck 11 supporting the element 13 is transferred to the cleaning part 7 by the step switch 3b as shown in FIG. 3 (c) and passes through the cleaning part 7. In the process, the rail 10 is moved while the water (7b) contained in the water tank (7a) is locked, the washing by water washing is made.

The time to pass through the cleaning part 7 should be such that the device 13 can be sufficiently cleaned, which can be achieved by input to the controller by means of the key 2.

When the cleaning is completed, the chuck 11 supporting the element 13 is moved to the drying unit 8 along the rail 10 where the air is blown from the blower (not shown) and discharged from the blower inlet 8a. The wet element 13 is dried by the dry air to complete the decap.

After drying, it is moved to the undoing part 9, where the chuck 11 supporting the element 13 is moved to a position where it is easy to unload along the unloading bar 9a connected to the final end of the rail 10. The door 4 of the loading unit 9 may be opened and the decapsulated element 13 may be taken out.

As described above, according to the present invention, since the corrosive gas generated during the corrosive process is collected by the back light and sent to the treatment unit, the risk of industrial accidents such as safety accidents and occupational diseases caused by the corrosive gas of chemicals exposed to the outside can be prevented. The decap process and unloading process, such as the loading, drilling, corrosion, cleaning and drying of the device, are carried out automatically, so that the decapsulation can be performed easily.

Claims (7)

A drilling part 5 for grinding the surface of the device by the drill 5b, a corrosion part 6 for dropping the corrosion solution to bush the device, a cleaning part 7 for washing the bushing device, and A drying section 8 for drying the elements, an unloading section 9 for unloading the dried elements, and these drill sections 5. An element transfer means having a rail (10) mounted over the bush (6), the washing portion (7), the drying portion (8), and the unloading portion (9) to guide the element. Decap device. The method of claim 1, wherein the drill portion 5 is provided with a loading bar (5a) is connected to the start end of the rail 10 for transferring the element to a position coinciding with the center of the drill (5b) Automatic decap device. The method of claim 1. Automatic decap device, characterized in that the corrosion portion 6 is provided with a cylinder (6a) for accommodating the corrosion solution in the center position and a hood (6b) for discharging the bush gas on the upper portion. 2. The automatic decap apparatus according to claim 1, wherein the washing unit (7) is provided with a water tank (7a) disposed in the fresh water (7b) so that the element transported toward the rail (10) can be locked. . The method of claim 1. Automatic decap device, characterized in that the drying unit 8 is provided with a supply inlet (8a) for blowing hot and dry air. 2. The automatic decap device according to claim 1, wherein the unloading part (9) is provided with an unloading bar (9a) connected to the final end of the rail (10) for unloading the decap completed element to a withdrawal position. . According to claim 1, wherein the device conveying means is moved along the loading bar (5a) and the rail (10) and the unrolling bar (9a) and the movable bar 12 which is mounted to be elevated and lowered, and the movement bar (12) Automatic decap device, characterized in that consisting of a chuck (11) coupled to support the device.