JPH0128501B2 - - Google Patents

Info

Publication number
JPH0128501B2
JPH0128501B2 JP56138177A JP13817781A JPH0128501B2 JP H0128501 B2 JPH0128501 B2 JP H0128501B2 JP 56138177 A JP56138177 A JP 56138177A JP 13817781 A JP13817781 A JP 13817781A JP H0128501 B2 JPH0128501 B2 JP H0128501B2
Authority
JP
Japan
Prior art keywords
substrate
pad portion
insulating film
semiconductor device
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56138177A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5839024A (ja
Inventor
Seiichi Hirata
Tooru Masaoka
Akira Sakagami
Takao Fujizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP56138177A priority Critical patent/JPS5839024A/ja
Publication of JPS5839024A publication Critical patent/JPS5839024A/ja
Publication of JPH0128501B2 publication Critical patent/JPH0128501B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Wire Bonding (AREA)
JP56138177A 1981-09-02 1981-09-02 半導体装置 Granted JPS5839024A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56138177A JPS5839024A (ja) 1981-09-02 1981-09-02 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56138177A JPS5839024A (ja) 1981-09-02 1981-09-02 半導体装置

Publications (2)

Publication Number Publication Date
JPS5839024A JPS5839024A (ja) 1983-03-07
JPH0128501B2 true JPH0128501B2 (https=) 1989-06-02

Family

ID=15215841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56138177A Granted JPS5839024A (ja) 1981-09-02 1981-09-02 半導体装置

Country Status (1)

Country Link
JP (1) JPS5839024A (https=)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5177058U (https=) * 1974-12-11 1976-06-17

Also Published As

Publication number Publication date
JPS5839024A (ja) 1983-03-07

Similar Documents

Publication Publication Date Title
US5288661A (en) Semiconductor device having bonding pad comprising buffer layer
US20050104202A1 (en) Semiconductor device
US6812581B2 (en) Chip size package with stress relieving internal terminal
JPH11261010A5 (https=)
JPH0128501B2 (https=)
JPH0553303B2 (https=)
US6404060B1 (en) Semiconductor device having a chip-on-chip structure
JPH05160304A (ja) 半導体装置
JP3372169B2 (ja) 半導体パッケージ
JPH07335818A (ja) 半導体装置
JP2826432B2 (ja) 半導体装置
JPH0778910A (ja) 半導体装置
JPS6119163A (ja) 半導体集積回路
JP2704085B2 (ja) 半導体装置
JP2940523B2 (ja) 半導体装置及びその実装方法
JPH05152508A (ja) 半導体装置
JP2651132B2 (ja) 半導体装置
JPS63111651A (ja) 半導体装置
JPS62166557A (ja) 半導体静電破壊保護装置
JPS63283138A (ja) 半導体装置
JPH04113639A (ja) 半導体装置
JPS6065578A (ja) シヨツトキ−バリヤダイオ−ド
JPS63175447A (ja) 半導体装置
JPS6129138A (ja) 半導体装置
JPS618963A (ja) 半導体装置