JPH0127582B2 - - Google Patents
Info
- Publication number
- JPH0127582B2 JPH0127582B2 JP55006007A JP600780A JPH0127582B2 JP H0127582 B2 JPH0127582 B2 JP H0127582B2 JP 55006007 A JP55006007 A JP 55006007A JP 600780 A JP600780 A JP 600780A JP H0127582 B2 JPH0127582 B2 JP H0127582B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- chip
- wafer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP600780A JPS56103455A (en) | 1980-01-22 | 1980-01-22 | Semiconductor ic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP600780A JPS56103455A (en) | 1980-01-22 | 1980-01-22 | Semiconductor ic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56103455A JPS56103455A (en) | 1981-08-18 |
| JPH0127582B2 true JPH0127582B2 (https=) | 1989-05-30 |
Family
ID=11626663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP600780A Granted JPS56103455A (en) | 1980-01-22 | 1980-01-22 | Semiconductor ic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56103455A (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5892230A (ja) * | 1981-11-27 | 1983-06-01 | Mitsubishi Electric Corp | 半導体装置 |
| KR101223759B1 (ko) | 2012-02-24 | 2013-01-17 | 주식회사 보루인터내셔날 | 진공용기용 고무밀봉재 및 이를 이용한 진공용기 뚜껑 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5845822B2 (ja) * | 1975-03-07 | 1983-10-12 | セイコーエプソン株式会社 | シユウセキカイロ |
| JPS5654577Y2 (https=) * | 1976-12-28 | 1981-12-19 |
-
1980
- 1980-01-22 JP JP600780A patent/JPS56103455A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56103455A (en) | 1981-08-18 |
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