JPH01249824A - Resin composition for sealing - Google Patents
Resin composition for sealingInfo
- Publication number
- JPH01249824A JPH01249824A JP7589288A JP7589288A JPH01249824A JP H01249824 A JPH01249824 A JP H01249824A JP 7589288 A JP7589288 A JP 7589288A JP 7589288 A JP7589288 A JP 7589288A JP H01249824 A JPH01249824 A JP H01249824A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- indene
- styrene copolymer
- epoxy
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 14
- 239000011342 resin composition Substances 0.000 title claims description 17
- 229920003986 novolac Polymers 0.000 claims abstract description 15
- 229920006026 co-polymeric resin Polymers 0.000 claims abstract description 14
- 239000005011 phenolic resin Substances 0.000 claims abstract description 13
- 239000003822 epoxy resin Substances 0.000 claims abstract description 12
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 12
- 239000011256 inorganic filler Substances 0.000 claims abstract description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 239000010680 novolac-type phenolic resin Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 9
- 239000000203 mixture Substances 0.000 abstract description 7
- 239000000843 powder Substances 0.000 abstract description 7
- 229920005989 resin Polymers 0.000 abstract description 7
- 239000011347 resin Substances 0.000 abstract description 7
- 238000005476 soldering Methods 0.000 abstract description 7
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 abstract description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000377 silicon dioxide Substances 0.000 abstract description 4
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 abstract description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- 150000001875 compounds Chemical class 0.000 abstract description 2
- 229920001577 copolymer Polymers 0.000 abstract 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 10
- 239000012778 molding material Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 5
- 239000001993 wax Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 241001220666 Parallage Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007171 acid catalysis Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011280 coal tar Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical class [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 1
- -1 paraffins Chemical class 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 150000003613 toluenes Chemical class 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
「発明の目的コ
（産業上の利用分野）
本発明は、耐湿性、半田耐熱性、成形性に優れた、電子
・電気部品等の封止用樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION Object of the Invention (Field of Industrial Application) The present invention relates to a resin composition for sealing electronic and electrical parts, etc., which has excellent moisture resistance, soldering heat resistance, and moldability.
（従来の技術）
近年、半導体、集積回路の分野における高集積化、高信
頼性化の技術開発と同時に、半導体装置の実装工程の自
動化が推進されている。 例えば、フラットパラゲージ
型の半導体装置を回路基板に取り付ける場合、従来はリ
ードビン毎に半田付けを行っていたが、最近は半導体装
置全体を２５０℃に加熱した半田浴に浸漬して、半田付
けを行う方法が採用されている。(Prior Art) In recent years, along with technological developments for higher integration and higher reliability in the field of semiconductors and integrated circuits, automation of semiconductor device mounting processes has been promoted. For example, when attaching a flat parallage type semiconductor device to a circuit board, soldering was traditionally done for each lead bin, but recently the entire semiconductor device is immersed in a solder bath heated to 250°C. The method is adopted.
従来のエポキシ樹脂、ノボラック型フェノール樹脂およ
び無機質充填剤からなる樹脂組成物で封止した半導体装
置では、装置全体の半田浴浸漬を行うと耐湿性が低下す
るという欠点がある。 特に吸湿した半導体装置を半田
浸漬すると封止樹脂と半導体チップおよびフレームとの
間に剥がれが生じ、著しい耐湿劣化をおこし、電極の腐
蝕による断線や水分によるリーク電流を生じ、長期間の
信顆性を保証することができないという欠点がある。
また、第三成分を配合し改良する方法も試みられている
が、−ｉには配合することによる離型性等成形性が悪く
なる欠点があった。 このため、耐湿性の影響が少なく
、半導体装置全体の半田浴浸漬をしても耐湿劣化の少な
い成形性のよい封止用樹脂の開発が強く要望されていた
。A semiconductor device sealed with a conventional resin composition comprising an epoxy resin, a novolac type phenol resin, and an inorganic filler has a drawback that moisture resistance is reduced when the entire device is immersed in a solder bath. In particular, when a semiconductor device that has absorbed moisture is immersed in solder, peeling occurs between the sealing resin and the semiconductor chip and frame, causing a significant deterioration of moisture resistance, causing wire breakage due to electrode corrosion, and leakage current due to moisture, resulting in long-term reliability. The disadvantage is that it cannot be guaranteed.
In addition, attempts have been made to improve the composition by adding a third component, but -i has the drawback that moldability such as mold releasability deteriorates due to the addition of a third component. For this reason, there has been a strong demand for the development of a sealing resin with good moldability that has less influence on moisture resistance and exhibits less deterioration in moisture resistance even when the entire semiconductor device is immersed in a solder bath.
（発明が解決しようとする問題点）
本発明は、上記の欠点を解消し、要望に応えるなめにな
されたもので、吸湿の影響が少なく、特に半田浴浸漬後
の耐湿性および半田耐熱性に優れた成形性のよい封止用
樹脂組成物を提供しようとするものである。(Problems to be Solved by the Invention) The present invention has been made to solve the above-mentioned drawbacks and meet the demands.It has less influence of moisture absorption, and has particularly good moisture resistance after immersion in a solder bath and soldering heat resistance. The present invention aims to provide a sealing resin composition with excellent moldability.
［発明の構成］
〈問題点を解決するための手段）
本発明者は、上記の目的を達成しようと鋭意研究を重ね
た結果、クマロン・インデン・スチレン共重合樹脂を配
合した樹脂組成物によって、半田浴浸漬後の耐湿性およ
び半田耐熱性が向上し、かつ成形性がよくなることを見
いだし、本発明を完成したものである。 すなわち、本
発明は、（Ａ）エポキシ樹脂、
（Ｂ）ノボラック型フェノール樹脂、
（Ｃ）クマロン・インデン・スチレン共重合樹脂および
（Ｄ）無機質充填剤
を必須成分とし、全体の樹脂組成物に対して、前記（Ｃ
）クマロン・インデン・スチレン共重合樹脂を０．１〜
１０重量％、また前記（Ｄ）の無機質充填剤を２５〜９
０重量％含有することを特徴とする封止用樹脂組成物で
ある。 そして、エポキシ基（ａ ）とフェノール性水
酸基（ｂ）との当量比［（ａ）／（ｂ）］が０．１〜１
０の範囲内にある封止用樹脂組成物である。[Structure of the Invention] <Means for Solving the Problems> As a result of extensive research in an attempt to achieve the above object, the present inventor has achieved the following by using a resin composition containing a coumaron-indene-styrene copolymer resin. The present invention was completed based on the discovery that the moisture resistance and solder heat resistance after immersion in a solder bath are improved, and the moldability is improved. That is, the present invention has (A) an epoxy resin, (B) a novolac type phenol resin, (C) a coumaron-indene-styrene copolymer resin, and (D) an inorganic filler as essential components, and Then, the above (C
) Coumaron-indene-styrene copolymer resin from 0.1 to
10% by weight, and 25 to 9% of the inorganic filler (D)
This is a sealing resin composition characterized by containing 0% by weight. The equivalent ratio [(a)/(b)] of the epoxy group (a) and the phenolic hydroxyl group (b) is 0.1 to 1.
The sealing resin composition is within the range of 0.
本発明に用いる（Ａ）エポキシ樹脂としては、その分子
中にエポキシ基を少なくとも２個有する化合物である限
り、分子構造、分子量など特に制限はなく、一般に封止
用材料として使用されているものを広く包含することが
できる。 例えば、ビスフェノール型の芳香族系、シク
ロヘキサン誘導体等の脂環族系、さらに次の一般式で示
されるエポキシノボラック系の樹脂が挙げられる。The epoxy resin (A) used in the present invention is not particularly limited in terms of molecular structure and molecular weight, as long as it is a compound that has at least two epoxy groups in its molecule. Can be broadly encompassed. Examples include aromatic resins such as bisphenol, alicyclic resins such as cyclohexane derivatives, and epoxy novolac resins represented by the following general formula.
（但し、式中Ｒ′は水素原子、ハロゲン原子又はアルキ
ル基を、Ｒ２は水素原子又はアルキル基を、ｎは１以上
の整数をそれぞれ表す）
これらのエポキシ樹脂は単独もしくは２種以上混合して
用いる。(However, in the formula, R' represents a hydrogen atom, a halogen atom, or an alkyl group, R2 represents a hydrogen atom or an alkyl group, and n represents an integer of 1 or more.) These epoxy resins may be used alone or in combination of two or more. use
本発明に用いる（Ｂ）ノボラック型フェノール樹脂とし
ては、フェノール、アルキルフェノール等のフェノール
顕とホルムアルデヒドあるいはバラホルムアルデヒドと
を反応させて得られるノボラック型フェノール樹脂およ
びこれらの変性樹脂、例えばエポキシ化もしくはブチル
化ノボラック型フェノール樹脂等が挙げられ、これらの
樹脂は単独もしくは２種以上混合して用いる。 ノボラ
ック型フェノール樹脂の配合割合は、前述したエポキシ
樹脂のエポキシ基（ａ ）とノボラック型フェノール樹
脂のフェノール性水酸基（ｂ ）との当量比［（ａ）／
（ｂ）］が０．１〜１０の範囲内であることが望ましい
、 当量比が０，１未満もしくは１０を超えると、耐湿
性、成形作業性および硬化物の電気特性が悪くなり、い
ずれの場合も好ましくない、 従って、上記の範囲内に
限定するのがよい。The novolak type phenolic resin (B) used in the present invention includes novolak type phenol resins obtained by reacting phenol compounds such as phenol and alkylphenols with formaldehyde or paraformaldehyde, and modified resins thereof, such as epoxidized or butylated novolaks. Examples include type phenol resins, and these resins may be used alone or in combination of two or more. The blending ratio of the novolac type phenolic resin is determined by the equivalent ratio of the epoxy group (a) of the epoxy resin described above and the phenolic hydroxyl group (b) of the novolac type phenol resin [(a)/
(b)] is preferably within the range of 0.1 to 10. If the equivalence ratio is less than 0.1 or exceeds 10, the moisture resistance, molding workability, and electrical properties of the cured product will deteriorate, and any Therefore, it is better to limit it within the above range.
本発明に用いる（Ｃ）クマロン・インデン・スチレン共
重合樹脂としては、次の構造式を有するもので
（但し、式中ｎは１以上の整数を表す）クマロン・イン
デン・スチレン共重合樹脂は、工業的にはクマロン、イ
ンデンを含むコールタール留分と、スチレンとを熱重合
または：ａ硫酸触楳やフッ化ホウ素錯塩触媒を用いて重
合させる方法などによって得られるもので、上記構造を
有するものであればよく、特に分子量、分子構造に制限
はなく、広く使用することができる。 クマロン・イン
デン・スチレン共重合樹脂の配合割合は、全体の樹脂組
成物に対して０．１〜１０重量％含有することが好まし
い、 その割合が０．１重量％未満では半田耐熱性に効
果なく、また１０重量％を超えると粘度増加、離型性が
悪く成形性に悪影響を与え、実用に適さず好ましくない
。The coumaron-indene-styrene copolymer resin (C) used in the present invention has the following structural formula (where n represents an integer of 1 or more). Industrially, it is obtained by thermal polymerization of coal tar fraction containing coumaron and indene and styrene, or by polymerization using sulfuric acid catalysis or a boron fluoride complex catalyst, and has the above structure. There are no particular restrictions on molecular weight or molecular structure, and a wide range of uses can be used. The compounding ratio of the coumaron-indene-styrene copolymer resin is preferably 0.1 to 10% by weight based on the entire resin composition. If the ratio is less than 0.1% by weight, it has no effect on soldering heat resistance. Moreover, if it exceeds 10% by weight, the viscosity will increase, the mold releasability will be poor, and the moldability will be adversely affected, making it unsuitable for practical use.
本発明に用いる（Ｄ＞無機質充填剤としては、シリカ粉
末、アルミナ、二酸化アンチモン、タルク、炭酸カルシ
ウム、チタンホワイト、クレー、マイカ、ベンガラ、ガ
ラスｍ維等が挙げられ、これらは単独もしくは２種以上
混合して使用する。Examples of inorganic fillers used in the present invention (D> Mix and use.
これらの中でも特にシリカ粉末やアルミナ粉末が好まし
く、よく使用される。 ＠機質充填剤の配合割合は、全
体の樹脂組成物に対して２５〜９０重量％含有すること
が好ましい、 その割合が２５重量％未満では、耐湿性
、半田耐熱性、機械的特性および成形性が悪くなり、ま
た９０重量％を超えるとカサバリが大きくなり成形性が
悪く実用に適さない。Among these, silica powder and alumina powder are particularly preferred and often used. @The content of the structural filler is preferably 25 to 90% by weight based on the entire resin composition. If the proportion is less than 25% by weight, moisture resistance, soldering heat resistance, mechanical properties, and moldability will be affected. Moreover, if it exceeds 90% by weight, the bulk will be large and the moldability will be poor, making it unsuitable for practical use.
本発明の封止用樹脂組成物は、エポキシ樹脂、ノボラッ
ク型フェノール樹脂、クマロン・インデン・スチレン共
重合樹脂および無機質充填剤を必須成分とするが、本発
明の目的を損なわないかぎり、必要に応じて天然ワック
ス類、合成ワックス類、直鎖脂肪酸の金属塩、酸アミド
、エステル類、パラフィン類などの離型剤、塩素化パラ
フィン、ブロム化トルエン、ヘキサブロムベンゼン、三
酸化アンチモンなどの難燃剤、カーボンブラック、ベン
ガラなどの着色剤、シランカップリング剤、種々の硬化
促進剤等を適宜添加配合することができる。The sealing resin composition of the present invention contains an epoxy resin, a novolac type phenol resin, a coumaron-indene-styrene copolymer resin, and an inorganic filler as essential components, but as long as the purpose of the present invention is not impaired, as necessary. natural waxes, synthetic waxes, metal salts of linear fatty acids, acid amides, esters, mold release agents such as paraffins, flame retardants such as chlorinated paraffins, brominated toluene, hexabromobenzene, antimony trioxide, Coloring agents such as carbon black and red iron oxide, silane coupling agents, various curing accelerators, and the like can be appropriately added and blended.
本発明の封止用樹脂組成物を成形材料として製造する場
合の一般的な方法は、エポキシ樹脂、ノボラック型フェ
ノール樹脂、クマロン・インデン・スチレン共重合樹脂
、無機質充填剤、その他の原料成分を所定の組成比に選
んで、ミキサー等によって十分均一に混合した後、更に
熱ロールによる溶融混合処理、またはニーダ等による混
合処理を行い、次いで冷却固化させ、適当な大きさに粉
砕して成形材料とする。 こうして製造した成形材料は
、電子部品或いは電気部品の封止、被覆、絶縁等に適用
することができる。A general method for producing the encapsulating resin composition of the present invention as a molding material is to mix epoxy resin, novolac type phenol resin, coumaron-indene-styrene copolymer resin, inorganic filler, and other raw materials in a specified manner. After selecting the composition ratio and mixing it sufficiently uniformly using a mixer, etc., it is further melted and mixed using hot rolls, or mixed using a kneader, etc., then cooled and solidified, and pulverized to an appropriate size to form a molding material. do. The molding material thus produced can be applied to sealing, covering, insulating, etc. electronic or electrical components.
（作用）
本発明において、クマロン・インデン・スチレン共重合
樹脂を用いたことによって目的とする特性が得られるも
のである。 クマロン・インデン・スチレン共重合樹脂
は、封圧用樹脂組成物と半導体チップとの密着性、また
封止用樹脂組成物とリードフレームとの密着性を向上さ
せ、半田浴に浸漬しても耐湿性の劣化を少なくする。(Function) In the present invention, the desired characteristics can be obtained by using the coumaron-indene-styrene copolymer resin. The coumaron-indene-styrene copolymer resin improves the adhesion between the sealing resin composition and the semiconductor chip, as well as the adhesiveness between the sealing resin composition and the lead frame, and is moisture resistant even when immersed in a solder bath. Reduce deterioration of
（実施例）
次に本発明を実施例によって具体的に説明するが、本発
明はこれらの実施例によって限定されるものではない、
以下の実施例および比較例において「％Ｊとあるのは
「重量％」を意味する。(Examples) Next, the present invention will be specifically explained by examples, but the present invention is not limited by these examples.
In the following Examples and Comparative Examples, "%J" means "% by weight".
実施例 １
クレゾールノボラックエポキシ樹脂（エポキシ当量２１
５） １７％にノボラック型フェノール樹脂（フェノー
ル当量１０７） ８％、クマロン・インデン・スチレ
ン共重合樹脂３２％、硬化促進剤０．３％、溶融シリカ
粉末７１％、エステル系ワックス０．３％およびシラン
系カップリング剤０．４％を配合し、常温で混合し更に
９０〜９５℃で混練冷却した後、粉砕して成形材料を製
造しな、 この成形材料を１７０℃に加熱した金型内に
トランスファー注入し硬化させて成形品（封止品）をつ
くった。 この成形品について耐湿性等の特性を試験し
なのでその結果を第１表に示した。 特に耐湿性におい
て本発明の顕著な効果が認められた。Example 1 Cresol novolak epoxy resin (epoxy equivalent weight 21
5) 17%, novolac type phenol resin (phenol equivalent: 107) 8%, coumaron-indene-styrene copolymer resin 32%, curing accelerator 0.3%, fused silica powder 71%, ester wax 0.3% and Blend 0.4% of a silane coupling agent, mix at room temperature, knead and cool at 90-95°C, and then crush to produce a molding material. This molding material is heated to 170°C in a mold. A molded product (sealed product) was created by transfer injection and curing. This molded article was tested for properties such as moisture resistance, and the results are shown in Table 1. In particular, the remarkable effects of the present invention on moisture resistance were observed.
実施例 ２
クレゾールノボラックエポキシ樹脂（エポキシ当量２１
５） １５％に、ノボラック型フェノール樹脂（フェノ
ール当量１０７） ７％、クマロン・インデン・スチ
レン共重合樹脂６％、硬化促進剤０，３％、シリカ粉末
７１％、エステル系ワックス０．３％およびシラン系カ
ップリング剤０．４％を実施例１と同様に混合、混練、
粉砕して成形材料を製造した。Example 2 Cresol novolac epoxy resin (epoxy equivalent weight 21
5) 15%, novolac type phenol resin (phenol equivalent: 107) 7%, coumaron-indene-styrene copolymer resin 6%, hardening accelerator 0.3%, silica powder 71%, ester wax 0.3% and 0.4% of the silane coupling agent was mixed and kneaded in the same manner as in Example 1.
It was crushed to produce a molding material.
また実施例１と同様にして成形品をつくり耐湿性等の特
性試験を行ったので、その結果を°第１表に示した。
耐湿性において本発明の顕著な効果が認められた。In addition, molded products were made in the same manner as in Example 1 and property tests such as moisture resistance were conducted, and the results are shown in Table 1.
The remarkable effect of the present invention on moisture resistance was observed.
比較例
クレゾールノボラックエポキシ樹脂（エポキシ当量２１
５） １９％にノボラック型フェノール樹脂（フェノー
ル当量１０７） ９％、シリカ粉末７１％、トリフェ
ニルホスフィン０．３％、エステル系ワックス０．３％
およびシラン系カップリング剤０．４％を実施例１と同
様にして成形材料を製造した。Comparative example Cresol novolac epoxy resin (epoxy equivalent: 21
5) 19%, novolac type phenolic resin (phenol equivalent: 107) 9%, silica powder 71%, triphenylphosphine 0.3%, ester wax 0.3%
A molding material was produced in the same manner as in Example 1 except that 0.4% of the silane coupling agent was added.
この成形材料を用いて成形品とし、成形品の緒特性につ
いて実施例１と同様にして試験を行い、その結果を第１
表に示した。This molding material was used to make a molded product, and the properties of the molded product were tested in the same manner as in Example 1.
Shown in the table.
第１表
（単位）
＊１ ニドランスファー成形によって直径５０＋ａＰ、
厚さ３ｎｎの成形品をつくり、これを １２７℃、２気
圧の飽和水蒸気中に２４時間放置し、増加した重量によ
って求めた。Table 1 (unit) *1 Diameter 50+aP by Nidor transfer molding,
A molded article with a thickness of 3 nn was made, and the molded article was left in saturated steam at 127° C. and 2 atm for 24 hours, and the increase in weight was determined.
＊２：吸水率の試験と同じ成形品をつくり、これを１７
５℃で８時間の後硬化を行い、適当な大きさのテストピ
ースとし、熱機器分析装置を用いて測定しな。*2: Make the same molded product as in the water absorption test, and test this with 17
After curing for 8 hours at 5°C, test pieces of appropriate size were prepared and measured using a thermal instrument analyzer.
＊３：成形材料を用いて２本以上のアルミニウム配線を
有するシリコン製チップ（テスト用素子）を通常の４２
７０イフレームに接着し、１７５℃で２分間トランスフ
ァー成形して５ｘ １０ｘ １．５ｎｎのフラットパッ
ケージ型成形品をつくり、その後１７５℃で８時間後硬
化を行った。 この成形品を予め４０℃、９０％ＲＨ，
１０（１時間の吸湿処理をした後、２５０℃の半田浴に
１０秒間浸漬した。 その後１２７℃、２．５気圧の飽
和水蒸気中でＰＣＴを行い、アルミニウムの腐食による
断線を不良として評価した。*3: Using a molding material, a silicon chip (test element) with two or more aluminum wirings is
It was adhered to a 70 frame and transfer-molded at 175°C for 2 minutes to produce a flat package molded product of 5 x 10 x 1.5 nn, and then post-cured at 175°C for 8 hours. This molded product is heated at 40℃ and 90%RH in advance.
10 (After 1 hour of moisture absorption treatment, it was immersed in a 250°C solder bath for 10 seconds. After that, PCT was performed in saturated steam at 127°C and 2.5 atm, and disconnections due to aluminum corrosion were evaluated as defects.
［発明の効果］
以上の説明および第１表から明らかなように、本発明の
封止用樹脂組成物は、配合したホットメルト接着剤によ
って半導体チップやリードフレームに対する密着性が良
いために、吸湿の影響が少なく、半田浴に浸漬した後で
も耐湿性に優れ、その結果、電極の腐食による断線や水
分によるリーク電流の発生などを著しく低減することが
でき、しかも長時間に渡って信頼性を保証することがで
きる。 また、２５０℃の半田浴浸漬にもかかわらず優
れた半田耐熱性を示した。[Effects of the Invention] As is clear from the above explanation and Table 1, the encapsulating resin composition of the present invention has good adhesion to semiconductor chips and lead frames due to the blended hot melt adhesive, so it does not absorb moisture. It has excellent moisture resistance even after being immersed in a solder bath, and as a result, it can significantly reduce the occurrence of wire breakage due to electrode corrosion and leakage current due to moisture, and it also maintains reliability over a long period of time. can be guaranteed. Furthermore, it exhibited excellent soldering heat resistance despite being immersed in a 250°C solder bath.
特許出願人 東芝ケミカル株式会社Patent applicant: Toshiba Chemical Corporation
Claims (1)
）のクマロン・インデン・スチレン共重合樹脂を０．１
〜１０重量％、また前記（Ｄ）の無機質充填剤を２５〜
９０重量％含有することを特徴とする封止用樹脂組成物
。 ２、エポキシ樹脂のエポキシ基（ａ）と、ノボラック型
フェノール樹脂のフェノール性水酸基（ｂ）との当量比
［（ａ）／（ｂ）］が０．１〜１０の範囲内にある特許
請求の範囲第１項記載の封止用樹脂組成物。[Claims] 1. The entire resin composition contains (A) an epoxy resin, (B) a novolac type phenol resin, (C) a coumaron-indene-styrene copolymer resin, and (D) an inorganic filler as essential components. For the above (C
) coumaron-indene-styrene copolymer resin of 0.1
~10% by weight, and 25~10% by weight of the inorganic filler (D) above.
A sealing resin composition characterized by containing 90% by weight. 2. A patent claim in which the equivalent ratio [(a)/(b)] between the epoxy group (a) of the epoxy resin and the phenolic hydroxyl group (b) of the novolac type phenolic resin is within the range of 0.1 to 10. The sealing resin composition according to scope 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63075892A JP2588861B2 (en) | 1988-03-31 | 1988-03-31 | Resin composition for sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63075892A JP2588861B2 (en) | 1988-03-31 | 1988-03-31 | Resin composition for sealing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01249824A true JPH01249824A (en) | 1989-10-05 |
| JP2588861B2 JP2588861B2 (en) | 1997-03-12 |
Family
ID=13589423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63075892A Expired - Lifetime JP2588861B2 (en) | 1988-03-31 | 1988-03-31 | Resin composition for sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2588861B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020105279A (en) * | 2018-12-26 | 2020-07-09 | 住友ベークライト株式会社 | Resin composition, resin film with carrier using the same, prepreg, laminate, printed wiring board and semiconductor device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3280215A (en) * | 1962-09-10 | 1966-10-18 | Ceilcote Company Inc | Modification of epoxy polymer with coumarone-indene resin |
| JPS61123618A (en) * | 1984-11-20 | 1986-06-11 | Sanyo Kokusaku Pulp Co Ltd | Novel epoxy resin and production thereof |
| JPS62240312A (en) * | 1986-04-11 | 1987-10-21 | Toshiba Chem Corp | Resin composition for use in sealing |
| JPS6399218A (en) * | 1986-06-13 | 1988-04-30 | Nippon Steel Chem Co Ltd | Epoxy modified hydrocarbon resin |
-
1988
- 1988-03-31 JP JP63075892A patent/JP2588861B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3280215A (en) * | 1962-09-10 | 1966-10-18 | Ceilcote Company Inc | Modification of epoxy polymer with coumarone-indene resin |
| JPS61123618A (en) * | 1984-11-20 | 1986-06-11 | Sanyo Kokusaku Pulp Co Ltd | Novel epoxy resin and production thereof |
| JPS62240312A (en) * | 1986-04-11 | 1987-10-21 | Toshiba Chem Corp | Resin composition for use in sealing |
| JPS6399218A (en) * | 1986-06-13 | 1988-04-30 | Nippon Steel Chem Co Ltd | Epoxy modified hydrocarbon resin |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020105279A (en) * | 2018-12-26 | 2020-07-09 | 住友ベークライト株式会社 | Resin composition, resin film with carrier using the same, prepreg, laminate, printed wiring board and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2588861B2 (en) | 1997-03-12 |
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