JPH0123551B2 - - Google Patents
Info
- Publication number
- JPH0123551B2 JPH0123551B2 JP17011180A JP17011180A JPH0123551B2 JP H0123551 B2 JPH0123551 B2 JP H0123551B2 JP 17011180 A JP17011180 A JP 17011180A JP 17011180 A JP17011180 A JP 17011180A JP H0123551 B2 JPH0123551 B2 JP H0123551B2
- Authority
- JP
- Japan
- Prior art keywords
- water
- plating
- solution
- substrate
- immersing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 27
- 238000007747 plating Methods 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 238000007772 electroless plating Methods 0.000 claims description 14
- 239000012212 insulator Substances 0.000 claims description 11
- 239000007864 aqueous solution Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 239000000243 solution Substances 0.000 claims description 9
- 238000005406 washing Methods 0.000 claims description 7
- 101150003085 Pdcl gene Proteins 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000003929 acidic solution Substances 0.000 claims 1
- 239000012670 alkaline solution Substances 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 229910052763 palladium Inorganic materials 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 8
- 238000007654 immersion Methods 0.000 description 5
- 229910006404 SnO 2 Inorganic materials 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 229910001432 tin ion Inorganic materials 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000001235 sensitizing effect Effects 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- -1 palladium ions Chemical class 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17011180A JPS5794563A (en) | 1980-12-02 | 1980-12-02 | Electroless plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17011180A JPS5794563A (en) | 1980-12-02 | 1980-12-02 | Electroless plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5794563A JPS5794563A (en) | 1982-06-12 |
| JPH0123551B2 true JPH0123551B2 (enrdf_load_stackoverflow) | 1989-05-02 |
Family
ID=15898838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17011180A Granted JPS5794563A (en) | 1980-12-02 | 1980-12-02 | Electroless plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5794563A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60141874A (ja) * | 1983-12-28 | 1985-07-26 | Seiko Epson Corp | 無電解メツキ方法 |
| US4910049A (en) * | 1986-12-15 | 1990-03-20 | International Business Machines Corporation | Conditioning a dielectric substrate for plating thereon |
-
1980
- 1980-12-02 JP JP17011180A patent/JPS5794563A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5794563A (en) | 1982-06-12 |
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