JPH0122755B2 - - Google Patents

Info

Publication number
JPH0122755B2
JPH0122755B2 JP10857879A JP10857879A JPH0122755B2 JP H0122755 B2 JPH0122755 B2 JP H0122755B2 JP 10857879 A JP10857879 A JP 10857879A JP 10857879 A JP10857879 A JP 10857879A JP H0122755 B2 JPH0122755 B2 JP H0122755B2
Authority
JP
Japan
Prior art keywords
dry film
adhesive tape
film
applying
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10857879A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5632799A (en
Inventor
Kyotaka Myagawa
Mitsuo Yamashita
Ayako Myahara
Kenji Yamamoto
Keiji Kurosawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10857879A priority Critical patent/JPS5632799A/ja
Publication of JPS5632799A publication Critical patent/JPS5632799A/ja
Publication of JPH0122755B2 publication Critical patent/JPH0122755B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP10857879A 1979-08-28 1979-08-28 Method of manufacturing printed circuit board Granted JPS5632799A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10857879A JPS5632799A (en) 1979-08-28 1979-08-28 Method of manufacturing printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10857879A JPS5632799A (en) 1979-08-28 1979-08-28 Method of manufacturing printed circuit board

Publications (2)

Publication Number Publication Date
JPS5632799A JPS5632799A (en) 1981-04-02
JPH0122755B2 true JPH0122755B2 (enrdf_load_stackoverflow) 1989-04-27

Family

ID=14488359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10857879A Granted JPS5632799A (en) 1979-08-28 1979-08-28 Method of manufacturing printed circuit board

Country Status (1)

Country Link
JP (1) JPS5632799A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006237088A (ja) * 2005-02-22 2006-09-07 Sumitomo Metal Electronics Devices Inc 多層プリント配線板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524711B2 (enrdf_load_stackoverflow) * 1974-03-27 1980-07-01

Also Published As

Publication number Publication date
JPS5632799A (en) 1981-04-02

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