JPH01210092A - 精密洗浄の乾燥方法 - Google Patents

精密洗浄の乾燥方法

Info

Publication number
JPH01210092A
JPH01210092A JP63033941A JP3394188A JPH01210092A JP H01210092 A JPH01210092 A JP H01210092A JP 63033941 A JP63033941 A JP 63033941A JP 3394188 A JP3394188 A JP 3394188A JP H01210092 A JPH01210092 A JP H01210092A
Authority
JP
Japan
Prior art keywords
pure water
cleaning
cleaned
water
precision
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63033941A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0448515B2 (enExample
Inventor
Toru Usui
臼井　徹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SONITSUKU FUEROO KK
Original Assignee
SONITSUKU FUEROO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SONITSUKU FUEROO KK filed Critical SONITSUKU FUEROO KK
Priority to JP63033941A priority Critical patent/JPH01210092A/ja
Priority to EP88118976A priority patent/EP0328746A3/en
Publication of JPH01210092A publication Critical patent/JPH01210092A/ja
Publication of JPH0448515B2 publication Critical patent/JPH0448515B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Surface Treatment Of Optical Elements (AREA)
JP63033941A 1988-02-18 1988-02-18 精密洗浄の乾燥方法 Granted JPH01210092A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP63033941A JPH01210092A (ja) 1988-02-18 1988-02-18 精密洗浄の乾燥方法
EP88118976A EP0328746A3 (en) 1988-02-18 1988-11-14 Drying method for precision washing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63033941A JPH01210092A (ja) 1988-02-18 1988-02-18 精密洗浄の乾燥方法

Publications (2)

Publication Number Publication Date
JPH01210092A true JPH01210092A (ja) 1989-08-23
JPH0448515B2 JPH0448515B2 (enExample) 1992-08-06

Family

ID=12400534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63033941A Granted JPH01210092A (ja) 1988-02-18 1988-02-18 精密洗浄の乾燥方法

Country Status (2)

Country Link
EP (1) EP0328746A3 (enExample)
JP (1) JPH01210092A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01130771A (ja) * 1987-10-05 1989-05-23 Nukem Gmbh 基板洗浄法及び基板洗浄装置
JPH03147325A (ja) * 1989-11-01 1991-06-24 Sonitsuku Fueroo Kk 精密洗浄の乾燥方法
JPH03235332A (ja) * 1990-02-10 1991-10-21 Sharp Corp 乾燥装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0428784B1 (en) * 1989-11-23 1995-03-15 Cfm Technologies, Inc. Process for drying surfaces
JP3187405B2 (ja) * 1990-01-07 2001-07-11 忠弘 大見 高温・高圧洗浄方法及び洗浄装置
DE4413077C2 (de) * 1994-04-15 1997-02-06 Steag Micro Tech Gmbh Verfahren und Vorrichtung zur chemischen Behandlung von Substraten
DE19613620C2 (de) * 1996-04-04 1998-04-16 Steag Micro Tech Gmbh Verfahren und Vorrichtung zum Trocknen von Substraten
DE19800584C2 (de) * 1998-01-09 2002-06-20 Steag Micro Tech Gmbh Verfahren und Vorrichtung zum Trocknen von Substraten
WO2000074113A1 (en) * 1999-05-27 2000-12-07 Lam Research Corporation Wafer drying apparatus and method
CN111906077B (zh) * 2020-06-29 2022-03-25 广州国显科技有限公司 清洗装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5176074A (ja) * 1974-12-26 1976-07-01 Suwa Seikosha Kk Handotaiuehaasenjosochi
JPS5871630A (ja) * 1981-10-23 1983-04-28 Matsushita Electric Ind Co Ltd 処理液による処理方法および処理装置
JPS60223130A (ja) * 1984-04-19 1985-11-07 Sharp Corp 基板の洗滌乾燥方法及びその装置
JPS61164692A (ja) * 1985-01-17 1986-07-25 島田理化工業株式会社 精密洗浄方法
JPS61272935A (ja) * 1985-05-28 1986-12-03 Nec Corp 半導体基板洗浄方法
US4722752A (en) * 1986-06-16 1988-02-02 Robert F. Orr Apparatus and method for rinsing and drying silicon wafers

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5176074A (ja) * 1974-12-26 1976-07-01 Suwa Seikosha Kk Handotaiuehaasenjosochi
JPS5871630A (ja) * 1981-10-23 1983-04-28 Matsushita Electric Ind Co Ltd 処理液による処理方法および処理装置
JPS60223130A (ja) * 1984-04-19 1985-11-07 Sharp Corp 基板の洗滌乾燥方法及びその装置
JPS61164692A (ja) * 1985-01-17 1986-07-25 島田理化工業株式会社 精密洗浄方法
JPS61272935A (ja) * 1985-05-28 1986-12-03 Nec Corp 半導体基板洗浄方法
US4722752A (en) * 1986-06-16 1988-02-02 Robert F. Orr Apparatus and method for rinsing and drying silicon wafers

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01130771A (ja) * 1987-10-05 1989-05-23 Nukem Gmbh 基板洗浄法及び基板洗浄装置
JPH03147325A (ja) * 1989-11-01 1991-06-24 Sonitsuku Fueroo Kk 精密洗浄の乾燥方法
JPH03235332A (ja) * 1990-02-10 1991-10-21 Sharp Corp 乾燥装置

Also Published As

Publication number Publication date
EP0328746A2 (en) 1989-08-23
JPH0448515B2 (enExample) 1992-08-06
EP0328746A3 (en) 1990-03-14

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