JPH01198495A - 電解金属箔の製造方法とそれに用いる装置 - Google Patents
電解金属箔の製造方法とそれに用いる装置Info
- Publication number
- JPH01198495A JPH01198495A JP2124888A JP2124888A JPH01198495A JP H01198495 A JPH01198495 A JP H01198495A JP 2124888 A JP2124888 A JP 2124888A JP 2124888 A JP2124888 A JP 2124888A JP H01198495 A JPH01198495 A JP H01198495A
- Authority
- JP
- Japan
- Prior art keywords
- anode
- electrolyte
- space
- metal foil
- cathode cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011888 foil Substances 0.000 title claims abstract description 46
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 38
- 239000002184 metal Substances 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims description 27
- 239000003792 electrolyte Substances 0.000 claims abstract description 56
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims description 64
- 239000008151 electrolyte solution Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 28
- 239000000243 solution Substances 0.000 claims description 4
- 238000007599 discharging Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 239000007789 gas Substances 0.000 description 17
- 239000011889 copper foil Substances 0.000 description 15
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 14
- 229910001882 dioxygen Inorganic materials 0.000 description 14
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- 238000007747 plating Methods 0.000 description 7
- 229910052697 platinum Inorganic materials 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 238000011109 contamination Methods 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 4
- 229910000457 iridium oxide Inorganic materials 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000011133 lead Substances 0.000 description 3
- 239000003595 mist Substances 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012811 non-conductive material Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- UGWKCNDTYUOTQZ-UHFFFAOYSA-N copper;sulfuric acid Chemical compound [Cu].OS(O)(=O)=O UGWKCNDTYUOTQZ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Electrolytic Production Of Metals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2124888A JPH01198495A (ja) | 1988-02-02 | 1988-02-02 | 電解金属箔の製造方法とそれに用いる装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2124888A JPH01198495A (ja) | 1988-02-02 | 1988-02-02 | 電解金属箔の製造方法とそれに用いる装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01198495A true JPH01198495A (ja) | 1989-08-10 |
| JPH031390B2 JPH031390B2 (enrdf_load_stackoverflow) | 1991-01-10 |
Family
ID=12049760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2124888A Granted JPH01198495A (ja) | 1988-02-02 | 1988-02-02 | 電解金属箔の製造方法とそれに用いる装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01198495A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0778361A2 (en) | 1995-12-06 | 1997-06-11 | Mitsui Mining & Smelting Co., Ltd. | A copper foil for a printed circuit board, a process and an apparatus for producing the same |
| KR100356308B1 (ko) * | 1999-06-22 | 2002-10-18 | 가-텍 인코포레이티드 | 금속 포일 제조용 애노드 구조 |
-
1988
- 1988-02-02 JP JP2124888A patent/JPH01198495A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0778361A2 (en) | 1995-12-06 | 1997-06-11 | Mitsui Mining & Smelting Co., Ltd. | A copper foil for a printed circuit board, a process and an apparatus for producing the same |
| KR100356308B1 (ko) * | 1999-06-22 | 2002-10-18 | 가-텍 인코포레이티드 | 금속 포일 제조용 애노드 구조 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH031390B2 (enrdf_load_stackoverflow) | 1991-01-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |