JPH0118035B2 - - Google Patents
Info
- Publication number
- JPH0118035B2 JPH0118035B2 JP58032777A JP3277783A JPH0118035B2 JP H0118035 B2 JPH0118035 B2 JP H0118035B2 JP 58032777 A JP58032777 A JP 58032777A JP 3277783 A JP3277783 A JP 3277783A JP H0118035 B2 JPH0118035 B2 JP H0118035B2
- Authority
- JP
- Japan
- Prior art keywords
- paste
- ceramics
- ceramic
- atmosphere
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Landscapes
- Manufacturing Of Electric Cables (AREA)
- Physical Vapour Deposition (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3277783A JPS59162192A (ja) | 1983-03-02 | 1983-03-02 | 非酸化物系セラミックスの表面に導電性膜を形成する方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3277783A JPS59162192A (ja) | 1983-03-02 | 1983-03-02 | 非酸化物系セラミックスの表面に導電性膜を形成する方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59162192A JPS59162192A (ja) | 1984-09-13 |
JPH0118035B2 true JPH0118035B2 (enrdf_load_stackoverflow) | 1989-04-03 |
Family
ID=12368268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3277783A Granted JPS59162192A (ja) | 1983-03-02 | 1983-03-02 | 非酸化物系セラミックスの表面に導電性膜を形成する方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59162192A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2676854B2 (ja) * | 1988-12-16 | 1997-11-17 | 日本油脂株式会社 | ポリオキシアルキレン不飽和エーテルーマレイン酸エステル共重合体およびその用途 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6028790B2 (ja) * | 1978-08-16 | 1985-07-06 | 日本特殊陶業株式会社 | 高アルミナ質セラミックスのメタライズ法 |
JPS56160704A (en) * | 1980-05-14 | 1981-12-10 | Matsushita Electric Ind Co Ltd | Metallized composition |
JPS5747782A (en) * | 1980-09-01 | 1982-03-18 | Hitachi Ltd | Formation of metal coating on silicon carbide sintered body |
-
1983
- 1983-03-02 JP JP3277783A patent/JPS59162192A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59162192A (ja) | 1984-09-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4663649A (en) | SiC sintered body having metallized layer and production method thereof | |
Burgess et al. | The Direct Bonding of Metals to Ceramics by the Gas‐Metal Eutectic Method | |
US5653379A (en) | Clad metal substrate | |
JP4081865B2 (ja) | 導体組成物の製造方法 | |
JPH0118035B2 (enrdf_load_stackoverflow) | ||
JP2578283B2 (ja) | 窒化アルミニウム基板のメタライズ方法 | |
JP3538549B2 (ja) | 配線基板およびその製造方法 | |
JPH02174145A (ja) | 窒化アルミニウム構造体及びその製造方法 | |
JPH05170552A (ja) | メタライズ層を有する窒化アルミニウム基板とそのメタライズ方法 | |
JPH0466688B2 (enrdf_load_stackoverflow) | ||
JP3977875B2 (ja) | アルミナ系セラミックス−アルミニウム合金の接合用ろう合金及び接合体 | |
JPS59217680A (ja) | 金属化ペ−スト及びセラミツクス製品 | |
US4950503A (en) | Process for the coating of a molybdenum base | |
JP3808376B2 (ja) | 配線基板 | |
JPS6228067A (ja) | セラミツクスの接合方法 | |
JPS61247672A (ja) | 金属粒子を基板に接着する方法 | |
KR900005304B1 (ko) | 집적회로용 기판의 제조방법 | |
JP2743558B2 (ja) | 銅導体ペースト | |
JPH0240028B2 (ja) | Seramitsukusutokinzoku*doshuseramitsukusudoshimatahaishuseramitsukusukannosetsugohoho | |
JP2003234552A (ja) | 配線基板 | |
JPS631279B2 (enrdf_load_stackoverflow) | ||
JPH0816033B2 (ja) | 窒化珪素用メタライズペ−ストの組成物とそれを用いたメタライズ法 | |
JPS59121176A (ja) | セラミツクのメタライズ方法 | |
JPS6156198B2 (enrdf_load_stackoverflow) | ||
JPH0217952B2 (enrdf_load_stackoverflow) |