JPS59162192A - 非酸化物系セラミックスの表面に導電性膜を形成する方法 - Google Patents

非酸化物系セラミックスの表面に導電性膜を形成する方法

Info

Publication number
JPS59162192A
JPS59162192A JP3277783A JP3277783A JPS59162192A JP S59162192 A JPS59162192 A JP S59162192A JP 3277783 A JP3277783 A JP 3277783A JP 3277783 A JP3277783 A JP 3277783A JP S59162192 A JPS59162192 A JP S59162192A
Authority
JP
Japan
Prior art keywords
paste
gas
ceramics
powder
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3277783A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0118035B2 (enrdf_load_stackoverflow
Inventor
秀夫 鈴木
小杉　哲夫
浦　満
荻原　覚
平賀　良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3277783A priority Critical patent/JPS59162192A/ja
Publication of JPS59162192A publication Critical patent/JPS59162192A/ja
Publication of JPH0118035B2 publication Critical patent/JPH0118035B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Manufacturing Of Electric Cables (AREA)
  • Physical Vapour Deposition (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP3277783A 1983-03-02 1983-03-02 非酸化物系セラミックスの表面に導電性膜を形成する方法 Granted JPS59162192A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3277783A JPS59162192A (ja) 1983-03-02 1983-03-02 非酸化物系セラミックスの表面に導電性膜を形成する方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3277783A JPS59162192A (ja) 1983-03-02 1983-03-02 非酸化物系セラミックスの表面に導電性膜を形成する方法

Publications (2)

Publication Number Publication Date
JPS59162192A true JPS59162192A (ja) 1984-09-13
JPH0118035B2 JPH0118035B2 (enrdf_load_stackoverflow) 1989-04-03

Family

ID=12368268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3277783A Granted JPS59162192A (ja) 1983-03-02 1983-03-02 非酸化物系セラミックスの表面に導電性膜を形成する方法

Country Status (1)

Country Link
JP (1) JPS59162192A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0373621A3 (en) * 1988-12-16 1990-12-27 Nippon Oil And Fats Company, Limited Polyoxyalkylene alkenyl ether maleic ester copolymer and use thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5527841A (en) * 1978-08-16 1980-02-28 Ngk Spark Plug Co Metallization of highly aluminous ceramics
JPS56160704A (en) * 1980-05-14 1981-12-10 Matsushita Electric Ind Co Ltd Metallized composition
JPS5747782A (en) * 1980-09-01 1982-03-18 Hitachi Ltd Formation of metal coating on silicon carbide sintered body

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5527841A (en) * 1978-08-16 1980-02-28 Ngk Spark Plug Co Metallization of highly aluminous ceramics
JPS56160704A (en) * 1980-05-14 1981-12-10 Matsushita Electric Ind Co Ltd Metallized composition
JPS5747782A (en) * 1980-09-01 1982-03-18 Hitachi Ltd Formation of metal coating on silicon carbide sintered body

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0373621A3 (en) * 1988-12-16 1990-12-27 Nippon Oil And Fats Company, Limited Polyoxyalkylene alkenyl ether maleic ester copolymer and use thereof

Also Published As

Publication number Publication date
JPH0118035B2 (enrdf_load_stackoverflow) 1989-04-03

Similar Documents

Publication Publication Date Title
US4663649A (en) SiC sintered body having metallized layer and production method thereof
JP2009504547A (ja) 金属セラミック基板
JPH06297185A (ja) 動的ハンダペースト組成物
US5045400A (en) Composition for and method of metallizing ceramic surface, and surface-metallized ceramic article
US5653379A (en) Clad metal substrate
JPS59162192A (ja) 非酸化物系セラミックスの表面に導電性膜を形成する方法
JP4081865B2 (ja) 導体組成物の製造方法
JP2578283B2 (ja) 窒化アルミニウム基板のメタライズ方法
JPH02174145A (ja) 窒化アルミニウム構造体及びその製造方法
JPH05319946A (ja) 金属板接合セラミック基板
JPH01206508A (ja) 窒化アルミニウム基板用導体ペースト
JPS6132752A (ja) セラミツクス回路板の製法
JPS61247672A (ja) 金属粒子を基板に接着する方法
JP3387655B2 (ja) セラミックスとシリコンの接合方法
JPS62182182A (ja) 金属化面を有する窒化アルミニウム焼結体
JPS6389477A (ja) Ｃｕ系部材をセラミツクス基体に直接接合する方法
US4950503A (en) Process for the coating of a molybdenum base
JPS6117475A (ja) 金属部材とセラミツク部材の直接結合方法
JPS61236661A (ja) セラミツクスと金属、同種セラミツクス同志または異種セラミツクス間の接合方法
JPH03146488A (ja) 金属化層を有する窒化アルミニウム焼結体の製造方法
JP2743558B2 (ja) 銅導体ペースト
JPH01142089A (ja) メタル・コア基板及びその製造方法
JPH02211977A (ja) 制御された酸化能力を有する雰囲気を使用するコーティング被覆／接合方法
JP3335751B2 (ja) アルミナ基板へのメタライジング方法
JPS6360186A (ja) 窒化アルミ系セラミツクス表面の金属化組成物、金属化方法