JPH01165242U - - Google Patents
Info
- Publication number
- JPH01165242U JPH01165242U JP6123288U JP6123288U JPH01165242U JP H01165242 U JPH01165242 U JP H01165242U JP 6123288 U JP6123288 U JP 6123288U JP 6123288 U JP6123288 U JP 6123288U JP H01165242 U JPH01165242 U JP H01165242U
- Authority
- JP
- Japan
- Prior art keywords
- protective cover
- support plate
- circuit board
- print head
- thermal print
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 9
- 239000000919 ceramic Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Description
第１図、第２図、第３図、第４図及び第５図は
それぞれ本考案によるサーマルプリントヘツドの
第１実施例、第２実施例、第３実施例、第４実施
例及び第５実施例を示す概略的断面図、第６図は
従来のサーマルプリントヘツドを示す概略的断面
図である。
１……支持板、２……発熱抵抗体形成基板、３
……回路基板、６……保護カバー、８……樹脂成
形品からなるカラー、９，２０，２４……ネジ、
１２，１４……アルミニウムからなるカラー、１
３，１９……銅メツキ層、１７，２１……さら座
ぐり部、２５……圧縮コイルバネ。
1, 2, 3, 4 and 5 respectively show the first embodiment, second embodiment, third embodiment, fourth embodiment and fifth embodiment of the thermal print head according to the present invention. FIG. 6 is a schematic cross-sectional view showing a conventional thermal print head. 1...Support plate, 2...Heating resistor forming substrate, 3
... Circuit board, 6 ... Protective cover, 8 ... Collar made of resin molded product, 9, 20, 24 ... Screws,
12, 14... Collar made of aluminum, 1
3, 19...Copper plating layer, 17, 21...Counterbore portion, 25...Compression coil spring.
Claims (1)
た発熱抵抗体形成基板及び回路基板と、上記発熱
抵抗体形成基板の一部及び上記回路基板を被覆す
る金属製の保護カバーとを具備し、上記保護カバ
ーをネジによつて上記支持板に固定するように成
されたサーマルプリントヘツドにおいて、 上記保護カバーと上記回路基板の金属層との間
、又は上記保護カバーと上記支持板との間に金属
又はセラミツクからなるカラーを配し、該カラー
を通して上記ネジを上記支持板に螺合させるよう
にしたことを特徴とするサーマルプリントヘツド
。 (2) 金属製の支持板と、該支持板上に固定され
た発熱抵抗体形成基板及び回路基板と、上記発熱
抵抗体形成基板の一部及び上記回路基板を被覆す
る金属製の保護カバーとを具備し、上記保護カバ
ーをネジによつて上記支持板に固定するように成
されたサーマルプリントヘツドにおいて、 上記保護カバーに座ぐり部を形成し、該座ぐり
部の先端部を上記回路基板の金属層又は上記支持
板に当接させ、上記座ぐり部を通して上記ネジを
上記支持板に螺合させるようにしたことを特徴と
するサーマルプリントヘツド。 (3) 金属製の支持板と、該支持板上に固定され
た発熱抵抗体形成基板及び回路基板と、上記発熱
抵抗体形成基板の一部及び上記回路基板を被覆す
る金属製の保護カバーとを具備し、上記保護カバ
ーをネジによつて上記支持板に固定するように成
されたサーマルプリントヘツドにおいて、 上記保護カバーと上記回路基板、又は上記保護
カバーと上記支持板との間にカラーを配し、該カ
ラーを通して上記ネジを上記支持板に螺合させる
と共に上記カラーに圧縮コイルバネを外嵌し、上
記ネジに上記圧縮コイルバネによる荷重を加える
ようにしたことを特徴とするサーマルプリントヘ
ツド。[Claims for Utility Model Registration] (1) A metal support plate, a heat generating resistor formed substrate and a circuit board fixed on the support plate, a part of the heat generating resistor formed substrate and the circuit board. In the thermal print head, the thermal print head is provided with a metal protective cover for covering the circuit board, and the protective cover is fixed to the support plate with screws, between the protective cover and the metal layer of the circuit board, Alternatively, a thermal print head characterized in that a collar made of metal or ceramic is disposed between the protective cover and the support plate, and the screw is screwed into the support plate through the collar. (2) A metal support plate, a heating resistor forming board and a circuit board fixed on the supporting plate, and a metal protective cover covering a part of the heating resistor forming board and the circuit board. In the thermal print head, the protective cover is fixed to the support plate with screws, a counterbore is formed in the protective cover, and a tip of the counterbore is connected to the circuit board. A thermal print head, characterized in that the thermal print head is brought into contact with the metal layer or the support plate, and the screw is screwed into the support plate through the counterbore. (3) A metal support plate, a heating resistor forming board and a circuit board fixed on the supporting plate, and a metal protective cover covering a part of the heating resistor forming board and the circuit board. In the thermal print head, the protective cover is fixed to the supporting plate with screws, and a collar is provided between the protective cover and the circuit board, or between the protective cover and the supporting plate. The thermal print head is characterized in that the screw is screwed into the support plate through the collar, and a compression coil spring is fitted onto the collar so that a load from the compression coil spring is applied to the screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6123288U JPH01165242U (en) | 1988-05-10 | 1988-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6123288U JPH01165242U (en) | 1988-05-10 | 1988-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165242U true JPH01165242U (en) | 1989-11-17 |
Family
ID=31286907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6123288U Pending JPH01165242U (en) | 1988-05-10 | 1988-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165242U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997006011A1 (en) * | 1995-08-09 | 1997-02-20 | Rohm Co., Ltd. | Thermal print head |
-
1988
- 1988-05-10 JP JP6123288U patent/JPH01165242U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997006011A1 (en) * | 1995-08-09 | 1997-02-20 | Rohm Co., Ltd. | Thermal print head |
| US5874983A (en) * | 1995-08-09 | 1999-02-23 | Rohm Co., Ltd. | Thermal print head |
| CN1076287C (en) * | 1995-08-09 | 2001-12-19 | 罗姆股份有限公司 | Thermal print head |