JPH0460450U - - Google Patents
Info
- Publication number
- JPH0460450U JPH0460450U JP10179490U JP10179490U JPH0460450U JP H0460450 U JPH0460450 U JP H0460450U JP 10179490 U JP10179490 U JP 10179490U JP 10179490 U JP10179490 U JP 10179490U JP H0460450 U JPH0460450 U JP H0460450U
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- fpc board
- cover
- board
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Common Mechanisms (AREA)
- Electronic Switches (AREA)
- Facsimile Heads (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の第１の実施例の断面図、第２
図は本考案の第２の実施例の断面図、第３図は従
来のサーマルヘツドの概略断面図である。
１……サーマルヘツド基板、２……放熱板、３
……ＦＰＣ基板、３ａ……ＦＰＣ本体、３ｂ……
補強板、４……カバー、５……ＦＰＣ基板固定用
ネジ又はピン、６……カバー固定用ネジ、７……
圧接ゴム、８……プラテン。
Fig. 1 is a sectional view of the first embodiment of the present invention;
The figure is a sectional view of a second embodiment of the present invention, and FIG. 3 is a schematic sectional view of a conventional thermal head. 1... Thermal head board, 2... Heat sink, 3
...FPC board, 3a...FPC body, 3b...
Reinforcement plate, 4... Cover, 5... FPC board fixing screw or pin, 6... Cover fixing screw, 7...
Pressure contact rubber, 8...platen.
Claims (1)
カバー、ＦＰＣ基板によつて構成されるサーマル
ヘツドにおいて、ＦＰＣ基板固定用の締結部品の
一部をカバーの位置決め部材として兼用したこと
を特徴とするサーマルヘツド部の構造。 (2) 前記ＦＰＣ基板固定用部品がピン又はネジ
であることを特徴とする請求項１記載のサーマル
ヘツド部の構造。[Claims for Utility Model Registration] (1) At least a thermal head board, a heat sink,
A structure of a thermal head portion comprising a cover and an FPC board, characterized in that a part of the fastening parts for fixing the FPC board also serves as a positioning member for the cover. (2) The structure of the thermal head section according to claim 1, wherein the FPC board fixing component is a pin or a screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10179490U JPH0460450U (en) | 1990-09-28 | 1990-09-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10179490U JPH0460450U (en) | 1990-09-28 | 1990-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0460450U true JPH0460450U (en) | 1992-05-25 |
Family
ID=31845536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10179490U Pending JPH0460450U (en) | 1990-09-28 | 1990-09-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0460450U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012206273A (en) * | 2011-03-29 | 2012-10-25 | Toshiba Hokuto Electronics Corp | Thermal head |
-
1990
- 1990-09-28 JP JP10179490U patent/JPH0460450U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012206273A (en) * | 2011-03-29 | 2012-10-25 | Toshiba Hokuto Electronics Corp | Thermal head |