JPH01163334U - - Google Patents
Info
- Publication number
- JPH01163334U JPH01163334U JP1988060199U JP6019988U JPH01163334U JP H01163334 U JPH01163334 U JP H01163334U JP 1988060199 U JP1988060199 U JP 1988060199U JP 6019988 U JP6019988 U JP 6019988U JP H01163334 U JPH01163334 U JP H01163334U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- chip
- electronic component
- type electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988060199U JPH01163334U (enFirst) | 1988-05-06 | 1988-05-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988060199U JPH01163334U (enFirst) | 1988-05-06 | 1988-05-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01163334U true JPH01163334U (enFirst) | 1989-11-14 |
Family
ID=31285918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988060199U Pending JPH01163334U (enFirst) | 1988-05-06 | 1988-05-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01163334U (enFirst) |
-
1988
- 1988-05-06 JP JP1988060199U patent/JPH01163334U/ja active Pending
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