JPH01115237U - - Google Patents
Info
- Publication number
- JPH01115237U JPH01115237U JP1988009077U JP907788U JPH01115237U JP H01115237 U JPH01115237 U JP H01115237U JP 1988009077 U JP1988009077 U JP 1988009077U JP 907788 U JP907788 U JP 907788U JP H01115237 U JPH01115237 U JP H01115237U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- polyimide substrate
- contact terminal
- mounting structure
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988009077U JPH01115237U (enFirst) | 1988-01-27 | 1988-01-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988009077U JPH01115237U (enFirst) | 1988-01-27 | 1988-01-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01115237U true JPH01115237U (enFirst) | 1989-08-03 |
Family
ID=31215513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988009077U Pending JPH01115237U (enFirst) | 1988-01-27 | 1988-01-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01115237U (enFirst) |
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1988
- 1988-01-27 JP JP1988009077U patent/JPH01115237U/ja active Pending