JPH01145133U - - Google Patents

Info

Publication number
JPH01145133U
JPH01145133U JP1988040783U JP4078388U JPH01145133U JP H01145133 U JPH01145133 U JP H01145133U JP 1988040783 U JP1988040783 U JP 1988040783U JP 4078388 U JP4078388 U JP 4078388U JP H01145133 U JPH01145133 U JP H01145133U
Authority
JP
Japan
Prior art keywords
semiconductor device
cap
internal wiring
molded
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988040783U
Other languages
English (en)
Other versions
JPH0741158Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988040783U priority Critical patent/JPH0741158Y2/ja
Publication of JPH01145133U publication Critical patent/JPH01145133U/ja
Application granted granted Critical
Publication of JPH0741158Y2 publication Critical patent/JPH0741158Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【図面の簡単な説明】
第１図〜第５図は本考案の一実施例に係り、第
１図はパツケージ前の半導体装置の断面図、第２
図はキヤツプをかぶせた状態の半導体装置の斜視
図、第３図はキヤツプを裏返した状態で示す斜視
図、第４図は半導体基板のキヤツプ取付部を示す
斜視図、第５図は樹脂モールデイング後の半導体
装置の断面図、第６図は直接樹脂モールデイング
を施した半導体装置の断面図である。 １は基板、１ａは内部配線部、３ａ，３ｂは内
部配線、４は空間、５はキヤツプ、６はモールド
樹脂である。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) エアブリツジ内部配線構造を有する半導体
    装置において、半導体基板の内部配線部を覆うキ
    ヤツプと、該キヤツプ上からモールドされて当該
    半導体装置をパツケージする樹脂モールド層とを
    備えたことを特徴とする半導体装置。 (2) キヤツプは導体であることを特徴とする実
    用新案登録請求の範囲第１項記載の半導体装置。
JP1988040783U 1988-03-28 1988-03-28 半導体装置 Expired - Lifetime JPH0741158Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988040783U JPH0741158Y2 (ja) 1988-03-28 1988-03-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988040783U JPH0741158Y2 (ja) 1988-03-28 1988-03-28 半導体装置

Publications (2)

Publication Number Publication Date
JPH01145133U true JPH01145133U (ja) 1989-10-05
JPH0741158Y2 JPH0741158Y2 (ja) 1995-09-20

Family

ID=31267245

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988040783U Expired - Lifetime JPH0741158Y2 (ja) 1988-03-28 1988-03-28 半導体装置

Country Status (1)

Country Link
JP (1) JPH0741158Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190052098A (ko) * 2016-10-24 2019-05-15 미쓰비시덴키 가부시키가이샤 반도체 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59152647A (ja) * 1983-02-21 1984-08-31 Sumitomo Electric Ind Ltd 多層配線方法
JPS6194352U (ja) * 1984-11-26 1986-06-18

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59152647A (ja) * 1983-02-21 1984-08-31 Sumitomo Electric Ind Ltd 多層配線方法
JPS6194352U (ja) * 1984-11-26 1986-06-18

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190052098A (ko) * 2016-10-24 2019-05-15 미쓰비시덴키 가부시키가이샤 반도체 장치
DE112016007369T5 (de) 2016-10-24 2019-07-11 Mitsubishi Electric Corporation Halbleitervorrichtung
US10854523B2 (en) 2016-10-24 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
DE112016007369B4 (de) 2016-10-24 2022-09-29 Mitsubishi Electric Corporation Halbleitervorrichtung

Also Published As

Publication number Publication date
JPH0741158Y2 (ja) 1995-09-20

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