JPH01137542U - - Google Patents
Info
- Publication number
- JPH01137542U JPH01137542U JP1988032761U JP3276188U JPH01137542U JP H01137542 U JPH01137542 U JP H01137542U JP 1988032761 U JP1988032761 U JP 1988032761U JP 3276188 U JP3276188 U JP 3276188U JP H01137542 U JPH01137542 U JP H01137542U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- flat package
- type semiconductor
- package type
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図ａ及びｂはそれぞれ本考案の第１の実施
例を示す正面図及び底面図、第２図ａ及びｂはそ
れぞれ第２の実施例を示す正断面図及び底面図、
第３図及び第４図はそれぞれ従来例を示す正面図
である。 １……フラツトパツケージ、２……プリント基
板、３……半導体チツプ、４……キヤツプ、５…
…リード端子、６……台座、７……放熱板、８…
…ねじ穴、９……貫通孔、１０……取付ねじ。
例を示す正面図及び底面図、第２図ａ及びｂはそ
れぞれ第２の実施例を示す正断面図及び底面図、
第３図及び第４図はそれぞれ従来例を示す正面図
である。 １……フラツトパツケージ、２……プリント基
板、３……半導体チツプ、４……キヤツプ、５…
…リード端子、６……台座、７……放熱板、８…
…ねじ穴、９……貫通孔、１０……取付ねじ。
Claims (1)
- 半導体チツプを搭載した台座の露出部にねじ穴
を有するフラツトパツケージ型半導体装置本体と
、貫通孔を有する放熱板とが間にプリント基板を
挟んで取付ねじにより連結固定されていることを
特徴とするフラツトパツケージ型半導体装置の実
装構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988032761U JPH01137542U (ja) | 1988-03-11 | 1988-03-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988032761U JPH01137542U (ja) | 1988-03-11 | 1988-03-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01137542U true JPH01137542U (ja) | 1989-09-20 |
Family
ID=31259328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988032761U Pending JPH01137542U (ja) | 1988-03-11 | 1988-03-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01137542U (ja) |
-
1988
- 1988-03-11 JP JP1988032761U patent/JPH01137542U/ja active Pending