JPS63174460U - - Google Patents

Info

Publication number
JPS63174460U
JPS63174460U JP1986197677U JP19767786U JPS63174460U JP S63174460 U JPS63174460 U JP S63174460U JP 1986197677 U JP1986197677 U JP 1986197677U JP 19767786 U JP19767786 U JP 19767786U JP S63174460 U JPS63174460 U JP S63174460U
Authority
JP
Japan
Prior art keywords
integrated circuit
package
heat dissipation
covering material
circuit chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986197677U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986197677U priority Critical patent/JPS63174460U/ja
Publication of JPS63174460U publication Critical patent/JPS63174460U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は、本考案の望ましい実施例を示す集積
回路用フラツトパツケージの一部破断斜視図、第
２図は、同パツケージを放熱板に固定した状態を
示す斜視図、第３図は、本考案の他の望ましい実
施例を示す収積回路用フラツトパツケージの斜視
図、第４図は、従来の集積回路用フラツトパツケ
ージの一部破断斜視図である。 １，１１……パツケージ基板、２，２′，１２
……リードフレーム、３，１３……集積回路チツ
プ、４，１４……被覆部材、５，５′……放熱部
材、６，１６……ボンデイングワイヤ、７……放
熱板。

Claims (1)

  1. 【実用新案登録請求の範囲】 パツケージ基板１上に載置固定されるリードフ
    レーム２と集積回路チツプ３とを電気的に接続し
    た後に被覆材４で被覆してなる集積回路用フラツ
    トパツケージにおいて、 その先端がパツケージ基板１上で集積回路チツ
    プ３に近接する放熱部材５を、被覆材４外部に突
    出させたことを特徴とする集積回路用フラツトパ
    ツケージの放熱構造。
JP1986197677U 1986-12-23 1986-12-23 Pending JPS63174460U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986197677U JPS63174460U (ja) 1986-12-23 1986-12-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986197677U JPS63174460U (ja) 1986-12-23 1986-12-23

Publications (1)

Publication Number Publication Date
JPS63174460U true JPS63174460U (ja) 1988-11-11

Family

ID=31157649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986197677U Pending JPS63174460U (ja) 1986-12-23 1986-12-23

Country Status (1)

Country Link
JP (1) JPS63174460U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04315465A (ja) * 1991-04-15 1992-11-06 Mitsubishi Electric Corp 表面実装型半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04315465A (ja) * 1991-04-15 1992-11-06 Mitsubishi Electric Corp 表面実装型半導体装置

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