JPH0221745U - - Google Patents
Info
- Publication number
- JPH0221745U JPH0221745U JP9963888U JP9963888U JPH0221745U JP H0221745 U JPH0221745 U JP H0221745U JP 9963888 U JP9963888 U JP 9963888U JP 9963888 U JP9963888 U JP 9963888U JP H0221745 U JPH0221745 U JP H0221745U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- back surfaces
- resin
- hole
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
添付図面は、この考案の好適な実施例を示した
ＩＣ構造体の垂直断面図である。 １……基板、２……チツプ部品、３……端子、
４……封止樹脂、４ａ……貫通穴。
ＩＣ構造体の垂直断面図である。 １……基板、２……チツプ部品、３……端子、
４……封止樹脂、４ａ……貫通穴。
Claims (1)
- 基板上に回路を形成するとともに、端子を固着
し前記基板の表裏面を樹脂によつて封止したＩＣ
構造体に於いて、前記基板の所定箇所に前記表裏
面間を封止樹脂で連絡する貫通穴を設けたことを
特徴とするＩＣ構造体。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9963888U JPH0221745U (ja) | 1988-07-27 | 1988-07-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9963888U JPH0221745U (ja) | 1988-07-27 | 1988-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221745U true JPH0221745U (ja) | 1990-02-14 |
Family
ID=31326986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9963888U Pending JPH0221745U (ja) | 1988-07-27 | 1988-07-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221745U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5642987U (ja) * | 1979-09-12 | 1981-04-18 |
-
1988
- 1988-07-27 JP JP9963888U patent/JPH0221745U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5642987U (ja) * | 1979-09-12 | 1981-04-18 |