JPH0113435Y2 - - Google Patents
Info
- Publication number
- JPH0113435Y2 JPH0113435Y2 JP1980050650U JP5065080U JPH0113435Y2 JP H0113435 Y2 JPH0113435 Y2 JP H0113435Y2 JP 1980050650 U JP1980050650 U JP 1980050650U JP 5065080 U JP5065080 U JP 5065080U JP H0113435 Y2 JPH0113435 Y2 JP H0113435Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal chassis
- conductor circuit
- tongue
- thermal stress
- alumina substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980050650U JPH0113435Y2 (enEXAMPLES) | 1980-04-14 | 1980-04-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980050650U JPH0113435Y2 (enEXAMPLES) | 1980-04-14 | 1980-04-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56154094U JPS56154094U (enEXAMPLES) | 1981-11-18 |
| JPH0113435Y2 true JPH0113435Y2 (enEXAMPLES) | 1989-04-19 |
Family
ID=29645578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980050650U Expired JPH0113435Y2 (enEXAMPLES) | 1980-04-14 | 1980-04-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0113435Y2 (enEXAMPLES) |
-
1980
- 1980-04-14 JP JP1980050650U patent/JPH0113435Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56154094U (enEXAMPLES) | 1981-11-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6181544B1 (en) | Ceramic electronic component | |
| JP4484176B2 (ja) | ボールグリッドアレイ型パッケージの接続構造 | |
| JPH0412714Y2 (enEXAMPLES) | ||
| JPH0523569U (ja) | プリント基板のパターン構造 | |
| US5406458A (en) | Printed circuit board having tapered contact pads for surface mounted electrical components | |
| US10952314B2 (en) | Removal of high stress zones in electronic assemblies | |
| JPH0113435Y2 (enEXAMPLES) | ||
| US5383094A (en) | Connection lead stucture for surface mountable printed circuit board components | |
| JPH06342966A (ja) | 電子回路モジュール | |
| JPH0742162U (ja) | ハイブリッドicの構造 | |
| JPH09260884A (ja) | プリント基板の固定構造 | |
| JP2914980B2 (ja) | 多端子電子部品の表面実装構造 | |
| JPH0739259Y2 (ja) | 電子機器の基板接続構造 | |
| JP2828233B2 (ja) | 表面実装用プリント配線板の断線補修方法 | |
| JPH0631735Y2 (ja) | 混成集積回路装置 | |
| JPH0577972U (ja) | 電子部品の接続構造 | |
| JP2923087B2 (ja) | プリント基板の半田接合構造及びプリント基板の半田接合方法 | |
| JP2522534B2 (ja) | コネクタ | |
| JPH0322958Y2 (enEXAMPLES) | ||
| JPH0870063A (ja) | 混成集積回路およびこれを含む回路装置 | |
| JPH0414858A (ja) | 電子部品のリード端子構造 | |
| JPS584962A (ja) | 半導体装置 | |
| JPH06334320A (ja) | 電子部品の実装方法 | |
| JPH0645370U (ja) | プリント配線板の実装構造 | |
| JPH04180211A (ja) | コンデンサ |