JPH01104742U - - Google Patents

Info

Publication number
JPH01104742U
JPH01104742U JP1988000421U JP42188U JPH01104742U JP H01104742 U JPH01104742 U JP H01104742U JP 1988000421 U JP1988000421 U JP 1988000421U JP 42188 U JP42188 U JP 42188U JP H01104742 U JPH01104742 U JP H01104742U
Authority
JP
Japan
Prior art keywords
chip
lead terminal
resistor
semiconductor device
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988000421U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988000421U priority Critical patent/JPH01104742U/ja
Publication of JPH01104742U publication Critical patent/JPH01104742U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Description

【図面の簡単な説明】
第１図は本考案の半導体装置の一実施例の組立
構体の平面図、第２図は異なる実施例の組立構体
の平面図、第３図および第４図は並列接続使用時
ゲートに発生する寄生振動を説明する線図で、第
３図はゲートに直列抵抗が接続されていなくて寄
生振動が発生する場合、第４図は直列抵抗が接続
されて寄生振動が発生しない場合を示す。 １……金属基板、２……ＭＯＳＦＥＴチツプ、
３……金属細線、４……外部リード端子（ソース
）、５……外部リード端子（ゲート）、６……チ
ツプ抵抗、７……樹脂、１１……リード端子（ド
レイン）。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 一端がリード端子を形成している金属基板
    にＭＯＳ電界効果トランジスタチツプがドレイン
    電極で接続され、このチツプのソース電極および
    ゲート電極が前記リード端子に並列に配置された
    外部リード端子の一端部にそれぞれ金属細線で接
    続されてなる組立構体を一体として樹脂封止した
    ものにおいて、前記チツプのゲート電極と外部リ
    ード端子との間に直列に抵抗体を挿入接続し一体
    として樹脂封止したことを特徴とする半導体装置
    。 (2) 実用新案登録請求の範囲第１項記載の半導
    体装置において、抵抗体が外部リード端子の一端
    部にろう付けされたチツプ抵抗素子であることを
    特徴とする半導体装置。 (3) 実用新案登録請求の範囲第１項記載の半導
    体装置において、抵抗体がトランジスタチツプの
    ゲート電極にろう付けされたチツプ抵抗素子であ
    ることを特徴とする半導体装置。
JP1988000421U 1988-01-06 1988-01-06 Pending JPH01104742U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988000421U JPH01104742U (ja) 1988-01-06 1988-01-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988000421U JPH01104742U (ja) 1988-01-06 1988-01-06

Publications (1)

Publication Number Publication Date
JPH01104742U true JPH01104742U (ja) 1989-07-14

Family

ID=31199432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988000421U Pending JPH01104742U (ja) 1988-01-06 1988-01-06

Country Status (1)

Country Link
JP (1) JPH01104742U (ja)

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