JPS62178440U - - Google Patents

Info

Publication number
JPS62178440U
JPS62178440U JP6717486U JP6717486U JPS62178440U JP S62178440 U JPS62178440 U JP S62178440U JP 6717486 U JP6717486 U JP 6717486U JP 6717486 U JP6717486 U JP 6717486U JP S62178440 U JPS62178440 U JP S62178440U
Authority
JP
Japan
Prior art keywords
electrodes
pair
fuse part
chipphuyous
stretched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6717486U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6717486U priority Critical patent/JPS62178440U/ja
Publication of JPS62178440U publication Critical patent/JPS62178440U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Fuses (AREA)

Description

【図面の簡単な説明】
第１図は、この考案の一実施例を示すチツプヒ
ユーズの斜視図、第２図は、同チツプヒユーズの
要部平面図、第３図は、同チツプヒユーズをシン
ボル表示で示した回路図、第４図は、同チツプヒ
ユーズを電子機器に組込んだ使用例を示す回路図
、第５図は、従来例を説明するための回路図であ
る。 １２ａ，１７：リード端子、１６：ホトサイリ
スタ、１８：金線、１９：ヒユーズ部、２０：弾
性樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 一対の電極間に金属細線が張設されるヒユーズ
    部と、前記一対の電極の一方に、一方の電極が接
    続され、前記ヒユーズ部の近傍に配置される光ス
    イツチング素子とが一体的に樹脂封入されてなる
    ことを特徴とするチツプヒユーズ。
JP6717486U 1986-05-01 1986-05-01 Pending JPS62178440U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6717486U JPS62178440U (ja) 1986-05-01 1986-05-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6717486U JPS62178440U (ja) 1986-05-01 1986-05-01

Publications (1)

Publication Number Publication Date
JPS62178440U true JPS62178440U (ja) 1987-11-12

Family

ID=30905840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6717486U Pending JPS62178440U (ja) 1986-05-01 1986-05-01

Country Status (1)

Country Link
JP (1) JPS62178440U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008311204A (ja) * 2007-05-15 2008-12-25 Yazaki Corp ヒューズ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008311204A (ja) * 2007-05-15 2008-12-25 Yazaki Corp ヒューズ

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